Inventors:
John W. Cassen - Sykesville MD
Edward L. Rich - Arnold MD
Gary N. Bonadies - Laurel MD
John S. Fisher - Ellicott City MD
John W. Gipprich - Millersville MD
John D. Gornto - Columbia MD
Daniel J. Heffernan - Pasadena MD
David A. Herlihy - Ellicott City MD
Scott C. Tolle - Baltimore MD
Patrick K. Richard - Baltimore MD
David W. Strack - Baltimore MD
Scott K. Suko - Elkridge MD
Timothy L. Eder - Glen Burnie MD
Chad E. Wilson - Redmond WA
Gary L. Ferrell - Pasadena MD
Stephanie A. Parks - Virginia Beach VA
Assignee:
Northrop Grumman Corporation - Los Angeles CA
International Classification:
G01S 728
Abstract:
Two discrete transmit/receive (T/R) channels are implemented in a single common T/R module package having the capability of providing combined functions, control and power conditioning while utilizing a single multi-cavity, multi-layer substrate comprised of high or low temperature cofired ceramic layers. The ceramic layers have outer surfaces including respective metallization patterns of ground planes and stripline conductors as well as feedthroughs or vertical vias formed therein for providing three dimensional routing of both shielded RF and DC power and logic control signals so as to configure, among other things, a pair of RF manifold signal couplers which are embedded in the substrate and which transition to a multi-pin blind mate press-on RF connector assembly at the front end of the package. DC and logic input/output control signals are connected to a plurality of active circuit components including application specific integrated circuits (ASICs) and monolithic microwave integrated circuit chips (MMICs) via spring contact pads at the rear of the package. An RF connector assembly for coupling transmit and receive signals to and from the module is located at the front of the package.