SCOTT THOMAS PARKHILL
Pilots at Sheringham Rd, Perrysburg, OH
License number
Ohio A2269342
Issued Date
Sep 2016
Expiration Date
Sep 2018
Category
Airmen
Type
Authorized Aircraft Instructor
Address
Address
26738 Sheringham Rd, Perrysburg, OH 43551
Professional information
Press (Non-Soldered) Contacts For High Current Electrical Connections In Power Modules
US Patent:
6793502, Sep 21, 2004
Filed:
Sep 20, 2001
Appl. No.:
09/957047
Inventors:
Scott Parkhill - Perrysburg OH
Sayeed Ahmed - Canton MI
Fred Flett - Bloomfield MI
Sayeed Ahmed - Canton MI
Fred Flett - Bloomfield MI
Assignee:
Ballard Power Systems Corporation - Dearborn MI
International Classification:
H01R 1200
US Classification:
439 66, 439 762, 361141
Abstract:
An electrical connector for use in a power module includes a first end portion for forming an electrical connection with a substrate, a second end portion, and a compliant portion situated between the first end portion and the second end portion. The compliant portion includes a compressed position and a decompressed position. The first end portion is configured for forming an electrical connection with a substrate if the compliant portion is in the compressed position.
Emi Reduction In Power Modules Through The Use Of Integrated Capacitors On The Substrate Level
US Patent:
6636429, Oct 21, 2003
Filed:
Sep 20, 2001
Appl. No.:
09/957001
Inventors:
Douglas Maly - Canton MI
Sayeed Ahmed - Canton MI
Scott Parkhill - Perrysburg OH
Fred Flett - Bloomfield MI
Sayeed Ahmed - Canton MI
Scott Parkhill - Perrysburg OH
Fred Flett - Bloomfield MI
Assignee:
Ballard Power Systems Corporation - Dearborn MI
International Classification:
H05K 900
US Classification:
361818, 361816, 361715, 361723, 257666, 257700, 315194
Abstract:
A high frequency, low impedance network is integrated into the substrate level of a power module for the reduction of electromagnetic interference (âEMIâ). In one embodiment, capacitance is electrically connected to at least one of the positive conducting layer in a substrate or the negative conducting layer in a substrate and a ground. Integrating a capacitive network of low stray inductance in a substrate of a power module allows relatively small, inexpensive capacitors to be used.
Leadframe-Based Module Dc Bus Design To Reduce Module Inductance
US Patent:
7012810, Mar 14, 2006
Filed:
Mar 27, 2002
Appl. No.:
10/109555
Inventors:
Scott Parkhill - Perrysburg OH, US
Sayeed Ahmed - Canton MI, US
Fred Flett - Bloomsfield MI, US
Sayeed Ahmed - Canton MI, US
Fred Flett - Bloomsfield MI, US
Assignee:
Ballard Power Systems Corporation - Dearborn MI
International Classification:
H01R 9/00
US Classification:
361775, 361784, 439 762
Abstract:
A DC bus for use in a power module has a positive DC conductor bus plate parallel with a negative DC conductor bus plate. One or more positive leads are connected to the positive bus and are connectable to a positive terminal of a power source. One or more negative leads are connected to the negative bus and are connectable to a negative terminal of a power source. The DC bus has one or more positive connections fastenable from the positive bus to the high side of a power module. The DC bus also has one or more negative connections fastenable from the negative bus to the low side of the power module. The positive bus and negative bus permit counter-flow of currents, thereby canceling magnetic fields and their associated inductances, and the positive and negative bus are connectable to the center portion of a power module.
Leadframe-Based Module Dc Bus Design To Reduce Module Inductance
US Patent:
7187558, Mar 6, 2007
Filed:
Oct 6, 2005
Appl. No.:
11/245723
Inventors:
Scott T. Parkhill - Perrysburg OH, US
Sayeed Ahmed - Canton MI, US
Fred Flett - Bloomfield MI, US
Sayeed Ahmed - Canton MI, US
Fred Flett - Bloomfield MI, US
Assignee:
Ballard Power Systems Corporation - Dearborn MI
International Classification:
H01R 9/00
US Classification:
361775, 361784, 439 762
Abstract:
A DC bus for use in a power module has a positive DC conductor bus plate parallel with a negative DC conductor bus plate. One or more positive leads are connected to the positive bus and are connectable to a positive terminal of a power source. One or more negative leads are connected to the negative bus and are connectable to a negative terminal of a power source. The DC bus has one or more positive connections fastenable from the positive bus to the high side of a power module. The DC bus also has one or more negative connections fastenable from the negative bus to the low side of the power module. The positive bus and negative bus permit counter-flow of currents, thereby canceling magnetic fields and their associated inductances, and the positive and negative bus are connectable to the center portion of a power module.
Leadframe-Based Module Dc Bus Design To Reduce Module Inductance
US Patent:
7193860, Mar 20, 2007
Filed:
Dec 2, 2005
Appl. No.:
11/292870
Inventors:
Scott Parkhill - Perrysburg OH, US
Sayeed Ahmed - Canton MI, US
Fred Flett - Bloomfield MI, US
Sayeed Ahmed - Canton MI, US
Fred Flett - Bloomfield MI, US
Assignee:
Ballard Power Systems Corporation - Dearborn MI
International Classification:
H01R 9/00
US Classification:
361775, 361784, 439 762
Abstract:
A DC bus for use in a power module has a positive DC conductor bus plate parallel with a negative DC conductor bus plate. One or more positive leads are connected to the positive bus and are connectable to a positive terminal of a power source. One or more negative leads are connected to the negative bus and are connectable to a negative terminal of a power source. The DC bus has one or more positive connections fastenable from the positive bus to the high side of a power module. The DC bus also has one or more negative connections fastenable from the negative bus to the low side of the power module. The positive bus and negative bus permit counter-flow of currents, thereby canceling magnetic fields and their associated inductances, and the positive and negative bus are connectable to the center portion of a power module.
Leadframe-Based Module Dc Bus Design To Reduce Module Inductance
US Patent:
2002003, Mar 21, 2002
Filed:
Jun 15, 2001
Appl. No.:
09/882708
Inventors:
Scott Parkhill - Perrysburg OH, US
Sayeed Ahmed - Canton MI, US
Fred Flett - Bloomfield MI, US
Sayeed Ahmed - Canton MI, US
Fred Flett - Bloomfield MI, US
International Classification:
H02M001/00
US Classification:
363/144000
Abstract:
A DC bus for use in a power module has a positive DC conductor bus plate parallel with a negative DC conductor bus plate. One or more positive leads are connected to the positive bus and are connectable to a positive terminal of a power source. One or more negative leads are connected to the negative bus and are connectable to a negative terminal of a power source. The DC bus has one or more positive connections fastenable from the positive bus to the high side of a power module. The DC bus also has one or more negative connections fastenable from the negative bus to the low side of the power module. The positive bus and negative bus permit counter-flow of currents, thereby canceling magnetic fields and their associated inductances, and the positive and negative bus are connectable to the center portion of a power module.
Substrate-Level Dc Bus Design To Reduce Module Inductance
US Patent:
6845017, Jan 18, 2005
Filed:
Sep 20, 2001
Appl. No.:
09/957568
Inventors:
Sayeed Ahmed - Canton MI, US
Scott Parkhill - Perrysburg OH, US
Fred Flett - Bloomfield MI, US
Douglas Maly - Canton MI, US
Scott Parkhill - Perrysburg OH, US
Fred Flett - Bloomfield MI, US
Douglas Maly - Canton MI, US
Assignee:
Ballard Power Systems Corporation - Dearborn MI
International Classification:
H01R 900
US Classification:
361775, 361764, 439 761, 257691
Abstract:
A DC bus for use in a power module includes a positive DC conductor bus plate parallel with a negative DC conductor bus plate. The positive bus and negative bus permit counter-flow of currents, thereby canceling magnetic fields and their associated inductances, and the positive and negative bus are connectable to the center portion of a power module.