Inventors:
Jerry G. Black - Lincoln MA
David K. Astolfi - Littleton MA
Scott P. Doran - Wakefield MA
Daniel J. Ehrlich - Lexington MA
Assignee:
Massachusetts Institute of Technology - Cambridge MA
International Classification:
H01L 2156
Abstract:
A method for assembling and interconnecting large, high-density circuits from separately fabricated components, where conventional preassembly device testing, and conventional production techniques, can be employed in an uncomplicated process. A plurality of semiconductor chips are applied connection-side down to a temporary soluble substrate and then encapsulated. The temporary soluble substrate is then dissolved, exposing the connection side of the chips, to which electrical connections can then be made.