SCOTT D GARNER
Engineers in Kissel Hill, PA

6437437, Aug 20, 2002

Jan 3, 2001

09/753893

Jon Zuo - Lancaster PA
Scott D. Garner - Lititz PA

Thermal Corp. - Stanton DE

H01L 2310

257710, 257704

A semiconductor package is provided that includes a substrate having a top surface, a cover, and at least one semiconductor device attached to the top surface of the substrate. The cover is secured to the substrate so as to create a space between the interior surface and the substrate such that the semiconductor device resides within the space. The cover has an interior surface comprising a plurality of micro-channels. A wick is positioned in confronting relation to the plurality of micro-channels and the semiconductor device, with a two-phase vaporizable liquid disposed within the space.

2006018, Aug 24, 2006

Feb 24, 2005

11/065466

Scott Garner - Lititz PA, US

H05K 7/20

165185000, 361705000

A conformable, thermally conductive layer is provided comprising a flowable component and a plurality of substantially incompressible spacer particles, wherein the conductive layer is disposed between a pair of heat exchange surfaces of an electronic device to maintain a desired spacing during operation. The thermally conductive layer enhances heat transfer between the surfaces while the spacer layer ensures a constant desired offset between the surfaces both to maintain an optimum level of heat transfer and to provide a desired voltage standoff between the surfaces to prevent arcing across the surfaces. The offset is substantially equal to the diameter of the spacer particles, and the particles align in a single layer between the heat exchange surfaces. The heat exchange surfaces can be a heat source such as an integrated circuit chip, and the heat sink can be a plate with a plurality of fins. The flowable component can be a thermal grease or paste, and the spacer particles can be ceramic or glass material. A method of applying the conductive layer and of assembling the heat source and heat sink is also disclosed.

6972365, Dec 6, 2005

Sep 9, 2003

10/658828

Scott D. Garner - Lititz PA, US

Thermal Corp. - Wilmington DE

H05K007/20

174 163, 361700, 62119

A thermal energy management system is provided having a heat spreading device that is operatively engaged with at least one semiconductor chip and a thermal bus operatively engaged with the heat spreading device so as to transport thermal energy from the heat spreading device to a heat sink. The heat spreading device includes a heat pipe and the thermal bus includes a loop thermosyphon. A second thermal bus may be operatively engaged with the first thermal bus so as to transport thermal energy from the first thermal bus to a heat sink. The second thermal bus may also include a loop thermosyphon. A method of managing thermal energy in an electronic system is also provided that includes spreading thermal energy generated by one or more devices over a surface that is relatively larger than the devices, thermally coupling an evaporator portion of a loop thermosyphon to the surface, and thermally coupling a condensing portion of the loop thermosyphon to a thermal energy sink, e. g. , a second loop thermosyphon, convection fin, or cold plate.

5822187, Oct 13, 1998

Oct 25, 1996

8/735191

Scott D. Garner - Lititz PA
George A. Meyer - Conestoga PA
Jerome E. Toth - Hatboro PA
Richard W. Longsderff - Lancaster PA

Thermal Corp. - Georgetown DE

G06F 120, H05K 720, F28D 1502

361687

The apparatus is a device for transferring heat across the hinged joint between the two sections of the case of a laptop computer. Two simple heat pipe cylinders are inserted into parallel cylindrical holes in a heat conductive block. One cylinder is bonded within its hole, and the other cylinder is permitted to rotate within its hole. The axis of the rotatable cylinder is located in line with the axis of the mechanical hinges which permit the panels to pivot relative to each other. A heat producing device in one panel can be then attached to one heat pipe, and a heat sink on the other panel can be attached to the other heat pipe. The heat transfer between the heat source and the heat sink is essentially that of a heat pipe except for the very short heat conductive path through the solid block and the one rotating joint.

6945317, Sep 20, 2005

Apr 24, 2003

10/422878

Scott D. Garner - Lititz PA, US
James E. Lindemuth - Litiz PA, US
Jerome E. Toth - Hatboro PA, US
John H. Rosenfeld - Lancaster PA, US
Kenneth G. Minnerly - Lititz PA, US

Thermal Corp. - Stanton DE

F28D015/00

16510426, 29890032

A grooved sintered wick for a heat pipe is provided having a plurality of individual particles which together yield an average particle diameter. The grooved sintered wick further includes at least two adjacent lands that are in fluid communication with one another through a particle layer disposed between the lands where the particle layer comprises at least one dimension that is no more than about six average particle diameters. A heat pipe is also provided comprising a grooved wick that includes a plurality of individual particles having an average diameter. The grooved wick includes at least two adjacent lands that are in fluid communication with one another through a particle layer disposed between the lands that comprises less than about six average particle diameters. A method for making a heat pipe wick in accordance with the foregoing structures is also provided.

5818693, Oct 6, 1998

Jan 9, 1997

8/780858

Scott D. Garner - Lititz PA
Jerome E. Toth - Hatboro PA

Thermal Corp. - Georgetown DE

H05K 720

361700

The apparatus is a cooling structure for laptop computers, in which the heat is transferred to a heat pipe in the cover of the case behind the display screen. The heat pipe behind the screen is interconnected with the external wall of the cover by a holding fixture which, preferably, is integrated into the cover wall during manufacture. The cover is specially constructed with high thermal conductivity carbon fibers which are oriented to preferentially conduct heat from the heat pipe to the cover and to spread the heat over the entire external surface of the cover for dissipation into the environment.

2007009, May 3, 2007

Oct 31, 2005

11/262623

Mahmoud Taher - Peoria IL, US
Ronald Dupree - Washington IL, US
Dong Fei - Peoria IL, US
Scott Garner - Lititz PA, US

H01L 35/30

136205000

A thermoelectric power unit is provided. The power unit may include at least one thermoelectric device. A first fluid passage may be disposed on a first side of the thermoelectric device and may be configured to receive a hot exhaust stream. The power unit may further include a plurality of heat pipes configured to focus thermal energy from a fluid flowing through the first passage toward the first side of the thermoelectric device. A second fluid passage may be disposed on a second side of the thermoelectric device opposite of the first fluid passage and configured to conduct thermal energy away from the thermoelectric device.

2002007, Jun 20, 2002

Dec 18, 2000

09/739043

Dmitry Khrustalev - Lancaster PA, US
Scott Garner - Lititz PA, US
Peter Wollen - Lititz PA, US

F28D015/00

165/104260

An apparatus for maintaining two-phase fluid circulation is disclosed, which includes a two-phase loop containing at least one condenser and at least one evaporator with a capillary structure therein.

7013958, Mar 21, 2006

May 13, 2005

11/128454

Scott D. Garner - Lititz PA, US
James E. Lindemuth - Lititz PA, US
Jerome E. Toth - Hatboro PA, US
John H. Rosenfeld - Lancaster PA, US
Kenneth G. Minnerly - Lititz PA, US

Thermal Corp. - Wilmington DE

F28D 15/00

16510426, 16510421, 361700, 174 152, 257715

A grooved sintered wick for a heat pipe is provided having a plurality of individual particles which together yield an average particle diameter. The grooved sintered wick further includes at least two adjacent lands that are in fluid communication with one another through a particle layer disposed between the lands where the particle layer comprises at least one dimension that is no more than about six average particle diameters. A heat pipe is also provided comprising a grooved wick that includes a plurality of individual particles having an average diameter. The grooved wick includes at least two adjacent lands that are in fluid communication with one another through a particle layer disposed between the lands that comprises less than about six average particle diameters. A method for making a heat pipe wick in accordance with the foregoing structures is also provided.

2005013, Jun 30, 2005

Feb 24, 2005

11/065465

David Sarraf - Elizabethtown PA, US
John Hartenstine - Mountville PA, US
Jerome Toth - Exton PA, US
Scott Garner - Lititz PA, US

H01L023/10, H01L023/34

257706000

Heat sinks having a mounting surface with a coefficient of thermal expansion matching that of silicon are disclosed. Heat pipes having layered composite or integral composite low coefficient of expansion heat sinks are disclosed that can be mounted directly to silicon semiconductor devices.