SCOTT ANTHONY CAMPBELL
Pilots at Desert Cv Ave, Scottsdale, AZ

5989449, Nov 23, 1999

Aug 14, 1998

9/134222

Scott Campbell - Fountain Hills AZ

Morton International, Inc. - Chicago IL

C09K 1300, C09K 1304, C09K 1306

252 791

A composition and method for stripping tin or tin-lead alloys, and any underlying copper-tin intermetallic, from a copper surface. The composition includes an aqueous solution of approximately 5-60% nitric acid by weight, approximately 0. 5-30% ferric nitrate by weight, and a nitric acid stabilizer selected from the group consisting of an amino-triazole, an amino-isoxazole, and a linear amino sulfone in the form H. sub. 2 N--SO. sub. 2 --R, where R is any alkyl or benzene group, wherein the stabilizer is present at a concentration sufficient to inhibit exothermic conditions, emission of toxic NOx gas, and copper attack. A soluble source of halogen ion, such as hydrochloric acid, can be added to the composition to yield a uniform, reflective, bright pink copper appearance, and to further reduce sludge formation. In addition, sludge formation can be eliminated by adding a soluble source of sulfate ion (SO. sub. 4. sup. -2) to the composition.

5911907, Jun 15, 1999

Aug 30, 1995

8/521305

Scott Campbell - Fountain Hills AZ

Surface Tek Specialty Products, Inc. - Scottsdale AZ

C09K 1300, C09K 1304, C09K 1306

252 791

A composition and method for stripping tin or tin-lead alloys, and any underlying copper-tin intermetallic, from a copper surface. The composition includes an aqueous solution of approximately 5-60% nitric acid by weight, approximately 0. 5-30% ferric nitrate by weight, and a nitric acid stabilizer selected from the group consisting of an amino-triazole, an amino-isoxazole, and a linear amino sulfone in the form H. sub. 2 N--SO. sub. 2 --R, where R is any alkyl or benzene group, wherein the stabilizer is present at a concentration sufficient to inhibit exothermic conditions, emission of toxic NOx gas, and copper attack. A soluble source of halogen ion, such as hydrochloric acid, can be added to the composition to yield a uniform, reflective, bright pink copper appearance, and to further reduce sludge formation. In addition, sludge formation can be eliminated by adding a soluble source of sulfate ion (SO. sub. 4. sup. -2) to the composition.

6322656, Nov 27, 2001

Dec 19, 1995

8/574954

John Fakler - Phoenix AZ
Michael Rush - Scottsdale AZ
Scott Campbell - Fountain Hills AZ

Morton International, Inc. - Chicago IL

B32B 3100

156281

An improvement in a method of bonding copper and a resin together wherein a copper oxide layer is formed on the surface of copper by the oxidation of metallic copper, the copper oxide layer is reduced to metallic copper with an aqueous reducing solution containing at least one amine borane represented by the general formula: BH. sub. 3 NHRR' (wherein R and R' are each a member selected from the group consisting of H, CH. sub. 3, and CH. sub. 2 CH. sub. 3), and the metallic copper is bonded to a resin. According to the improvement, a reducing stabilizer is added to the reducing solution in an amount sufficient to decrease consumption of the amine borane during reduction to a level less than that consumed in the absence of the reducing stabilizer during the course of the copper oxide reduction process, wherein the stabilized reduction process is initiated in a reasonable time and the metallic copper layer resulting from the stabilized reduction process is resistant to acid attack. Examples of such reducing stabilizers include thio-containing (--C(. dbd. S)NH. sub. 2) compounds, triazole-containing (C. sub. 2 H. sub. 3 N. sub.

5753309, May 19, 1998

Apr 3, 1996

8/627931

John Fakler - Phoenix AZ
Michael Rush - Scottsdale AZ
Scott Campbell - Fountain Hills AZ

Surface Tek Specialty Products, Inc. - Scottsdale AZ

B05D 500

427399

A composition for reducing a copper oxide layer to metallic copper so as to facilitate bonding a resin to the metallic copper is disclosed. The composition is an aqueous reducing solution containing a cyclic borane compound. Examples of such cyclic borane compounds include those having nitrogen or sulfur as a ring-forming members, such as morpholine borane, piperidine borane, pyridine borane, piperazine borane, 2,6-Iutidine borane, 4-methylmorpholine borane, and 1,4-oxathiane borane, and also N,N-diethylaniline borane.

6086956, Jul 11, 2000

Jan 19, 1999

9/232968

John Fakler - Phoenix AZ
Michael Rush - Scottsdale AZ
Scott Campbell - Fountain Hills AZ

Morton International Inc. - Chicago IL

C01G 302, C23C 2263, C03J 504, H05K 338

427299

A composition for reducing a copper oxide layer to metallic copper so as to facilitate bonding a resin to the metallic copper is disclosed. The composition is an aqueous reducing solution containing a cyclic borane compound. Examples of such cyclic borane compounds include those having nitrogen or sulfur as a ring-forming member, such as morpholine borane, piperidine borane, pyridine borane, piperazine borane, 2,6-Iutidine borane, 4-methylmorpholine borane, and 1,4-oxathiane borane, and also N,N-diethylaniline borane.

5900186, May 4, 1999

Feb 25, 1998

9/030687

John Fakler - Phoenix AZ
Michael Rush - Scottsdale AZ
Scott Campbell - Fountain Hills AZ

Morton International, Inc. - Chicago IL

B44C 122

252 791

A composition for reducing a copper oxide layer to metallic copper so as to facilitate bonding a resin to the metallic copper is disclosed. The composition is an aqueous reducing solution containing a cyclic borane compound. Examples of such cyclic borane compounds include those having nitrogen or sulfur as a ring-forming member, such as morpholine borane, piperidine borane, pyridine borane, piperazine borane, 2,6-Iutidine borane, 4-methylmorpholine borane, and 1,4-oxathiane borane, and also N,N-diethylaniline borane.

5721014, Feb 24, 1998

Dec 19, 1995

8/574946

John Fakler - Phoenix AZ
Michael Rush - Scottsdale AZ
Scott Campbell - Fountain Hills AZ

Surface Tek Specialty Products, Inc. - Scottsdale AZ

B05D 300

427299

A composition for reducing a copper oxide layer to metallic copper so as to facilitate bonding a resin to the metallic copper is disclosed. The composition is an aqueous reducing solution containing morpholine borane.