Samuel M Babb
Engineers at Fossil Crk Dr, Fort Collins, CO
License number
Colorado 19892
Issued Date
Nov 22, 1982
Renew Date
Nov 1, 2015
Expiration Date
Oct 31, 2017
Type
Professional Engineer
Address
Address
5317 Fossil Creek Dr, Fort Collins, CO 80526
Professional information
E-Fuse System For Supplying Current To A Load Along More Than One Path
US Patent:
2011026, Oct 27, 2011
Filed:
Apr 27, 2010
Appl. No.:
12/768242
Inventors:
Kelly Pracht - Tomball TX, US
Samuel M. Babb - Fort Collins CO, US
Samuel M. Babb - Fort Collins CO, US
International Classification:
H02H 9/02
US Classification:
361 937
Abstract:
An electronic fuse system includes plural current paths, each operable to be coupled between a power source and a load, and each including a switching element and a current sensing resistor in series with the path such that the path passes current when the switching element is turned on and does not pass current when the switching element is turned off. A controller has two sense inputs and a control output. The control output is coupled to the switching elements in each of the plural current paths and is operable to turn them all on or off simultaneously responsive at least in part to the sense inputs. A summing resistor is connected across the two sense inputs, and coupling circuitry is operable to couple voltages appearing across the current sensing resistors to the summing resistor.
Apparatus For Electromagnetic Interference Containment For Printed Circuit Board Connectors
US Patent:
5130896, Jul 14, 1992
Filed:
Feb 22, 1991
Appl. No.:
7/658944
Inventors:
Samuel M. Babb - Fort Collins CO
David O. Merrill - Fort Collins CO
David O. Merrill - Fort Collins CO
Assignee:
Hewlett-Packard Company - Palo Alto CA
International Classification:
H05K 900
US Classification:
361424
Abstract:
A printed circuit board for mounting in a housing, having a mounted connector for making connections with the circuit board through the housing includes a layer formed from electrically insulating material and a conductive structure formed on such layer which conductive structure is adapted to be connected to ground. A casing, also formed from electrically conductive material, is shaped to surround a portion of the connector and is electrically connected to the conductive structure so that electromagnetic radiation emanating from the circuit board will not pass through the connector. In embodiments where the connector is mounted on an edge of said circuit board, the casing surrounds all of but the open end of the connector. In a preferred embodiment the casing includes a top portion, connected to the conductive structure, for surrounding the top of the connector and a bottom portion, also connected to the conductive structure, for surrounding the bottom portion of the connector. In such an embodiment, it is preferred that the top portion include a plurality of legs.
Emi Shield That Adheres To And Conforms With Printed Circuit Board Surfaces
US Patent:
7196275, Mar 27, 2007
Filed:
Sep 29, 2003
Appl. No.:
10/674107
Inventors:
Samuel M. Babb - Ft Collins CO, US
Lowell E Kolb - Loveland CO, US
Brian Davis - Fort Collins CO, US
Jonathan P Mankin - Fort Collins CA, US
Kristina L Mann - Fort Collins CO, US
Paul H Mazurkiewicz - Fort Collins CO, US
Marvin Wahlen - Loveland CO, US
Lowell E Kolb - Loveland CO, US
Brian Davis - Fort Collins CO, US
Jonathan P Mankin - Fort Collins CA, US
Kristina L Mann - Fort Collins CO, US
Paul H Mazurkiewicz - Fort Collins CO, US
Marvin Wahlen - Loveland CO, US
Assignee:
Hewlett-Packard Development Company, L.P. - Houston TX
International Classification:
H05K 9/00
US Classification:
174382, 174377
Abstract:
An electrically continuous, grounded conformal EMI protective shield and methods for applying same directly to the surfaces of a printed circuit board. The EMI shield adheres and conforms to the surface of the components and printed wiring board. The shield takes the shape of the covered surfaces while adding little to the dimensions of the surfaces. The EMI shield includes low viscosity, high adherence conductive and dielectric coatings each of which can be applied in one or more layers using conventional spray techniques. The conductive coating prevents substantially all electromagnetic emissions generated by the shielded components from emanating beyond the conformal coating. The dielectric coating is initially applied to selected locations of the printed circuit board so as to be interposed between the conductive coating and the printed circuit board, preventing the conductive coating from electrically contacting selected components and printed wiring board regions.
Electronic Device Enclosure Having Electromagnetic Energy Containment And Heat Removal Characteristics
US Patent:
5740013, Apr 14, 1998
Filed:
Jul 3, 1996
Appl. No.:
8/676602
Inventors:
Arlen L. Roesner - Fort Collins CO
Guy R. Wagner - Loveland CO
Samuel M. Babb - Fort Collins CO
Guy R. Wagner - Loveland CO
Samuel M. Babb - Fort Collins CO
Assignee:
Hewlett-Packard Company - Palo Alto CA
International Classification:
H05K 720, H05K 900
US Classification:
361697
Abstract:
An enclosure for integrated circuit devices is disclosed. The enclosure includes a first portion which substantially encloses a plurality of secondary, relatively low-power integrated circuit devices and which includes a mechanism for contacting the secondary integrated circuit devices in order to conduct heat away. The enclosure also includes a second portion, which may include an active cooling device, directly in contact with a primary, relatively high-power primary integrated circuit device. In addition to removing heat, the first and second enclosure portions together shield the integrated circuit devices to contain electromagnetic energy generated by the devices. The first and second enclosure portions also allow different levels of force to be applied to the primary and secondary devices.
Self-Testing Power Supply Which Indicates When An Output Voltage Is Within Tolerance While Not Coupled To An External Load
US Patent:
7216241, May 8, 2007
Filed:
Jul 30, 2004
Appl. No.:
10/903429
Inventors:
Samuel Martin Babb - Fort Collins CO, US
Jeffrey Scott Weaver - Fort Collins CO, US
Stacie F. Mathis - Greeley CO, US
Kelly J. Pracht - Fort Collins CO, US
Jeffrey Scott Weaver - Fort Collins CO, US
Stacie F. Mathis - Greeley CO, US
Kelly J. Pracht - Fort Collins CO, US
Assignee:
Hewlett-Packard Development Company, L.P. - Houston TX
International Classification:
G06F 1/00, G06F 11/00, G01R 21/00
US Classification:
713300, 714 22, 702 60
Abstract:
A power supply unit according to a preferred embodiment of the invention is self testing. The power supply unit is enabled to function with no external loads applied, and includes a visual indicator of whether or not one or more voltage outputs of the power supply unit is within tolerance. To benefit from the self-test feature, a user in the field may simply unplug the power supply unit from all loads, plug the unit into an A/C source, and observe the visual indicator. If the visual indicator is lit, then the user may reasonably assume that the power supply unit is functioning correctly. But if the visual indicator is not lit, then the user may reasonably assume that the power supply unit is faulty.
Apparatus For Controlling Electromagnetic Interference From Multi-Layered Circuit Boards
US Patent:
5483413, Jan 9, 1996
Filed:
Oct 24, 1994
Appl. No.:
8/329138
Inventors:
Samuel M. Babb - Fort Collins CO
Assignee:
Hewlett-Packard Company - Palo Alto CO
International Classification:
H05K 900
US Classification:
361220
Abstract:
A printed circuit board is shown to include at least one layer formed from electrically insulating material and a power plane formed on the layer. The outer perimeter of the power plane is spaced away from the outer edge of the layer thereby defining an outer area. A conductive structure is formed in the outer area, spaced from and surrounding the power plane and adapted to be connected to ground. Electromagnetic radiation emanating from the power plane is caused to terminate on the conductive structure. A multi-layered printed circuit board can also include a first layer of electrically insulating material, a ground plane formed on the first layer, a second layer of electrically insulating material and a power plane formed on the second layer. The outer perimeter of the power plane is spaced away from the outer edge of the second layer. A conductive structure is formed on the second layer in the outer layer, spaced from and surrounding the power plane, wherein the conductive structure is electrically connected to the ground plane.
Power Conversion Using Dc And Ac Current Sharing To Produce An Ac Distribution Output
US Patent:
2012004, Mar 1, 2012
Filed:
Aug 24, 2010
Appl. No.:
12/862543
Inventors:
Samuel Martin BABB - Fort Collins CO, US
International Classification:
H02M 7/02, H02J 1/00
US Classification:
307 82
Abstract:
Examples provide DC current sharing at a first stage and AC current sharing at a second stage to provide an AC power distribution output.
Method And Apparatus For Reducing Acoustic Noise From Paired Cooling Fans
US Patent:
2005023, Oct 27, 2005
Filed:
Apr 22, 2004
Appl. No.:
10/830660
Inventors:
Samuel Babb - Fort Collins CO, US
Jeffrey Weaver - Fort Collins CO, US
Peter Piotrowski - Fort Collins CO, US
Garland Lee - Windsor CO, US
Jeffrey Weaver - Fort Collins CO, US
Peter Piotrowski - Fort Collins CO, US
Garland Lee - Windsor CO, US
International Classification:
H05K007/20
US Classification:
361697000
Abstract:
A pair of cooling fans in an electronic system is operated synchronously at a common speed and with a particular phase relationship between their respective acoustic properties that minimizes the combined acoustic noise produced by the pair of cooling fans.
Circuitry For Hot-Swappable Circuit Boards
US Patent:
2012011, May 17, 2012
Filed:
Dec 4, 2009
Appl. No.:
13/387654
Inventors:
Ray Woodward - Windsor CO, US
Samuel M. Babb - Fort Collins CO, US
Kelly Pracht - Tomball TX, US
Jack Lavier - Corvallis CO, US
Samuel M. Babb - Fort Collins CO, US
Kelly Pracht - Tomball TX, US
Jack Lavier - Corvallis CO, US
International Classification:
G01R 31/02
US Classification:
32475901
Abstract:
Electronic circuits and methods are provided for use in hot-swappable circuit board applications. Circuitry detects an electrical ground connection and signals operation of a hot-swap controller. Detection of stable operating power causes a hierarchical startup of plural voltage regulators. Sensing stable output power from the last of the voltage regulators triggers the configuration of one or more programmable devices. Circuitry and other resources of a hot-swappable circuit board are protected against electrical transient-related damage by virtue of the present teachings.
Printed Wiring Board
US Patent:
2005023, Oct 27, 2005
Filed:
Apr 27, 2004
Appl. No.:
10/832677
Inventors:
Samuel Babb - Fort Collins CO, US
Erik Swanson - Fort Collins CO, US
Lowell Kolb - Loveland CO, US
Erik Swanson - Fort Collins CO, US
Lowell Kolb - Loveland CO, US
International Classification:
H01P005/02
US Classification:
333034000
Abstract:
A printed wiring board comprises a first plane having a split formed therein and at least one signal trace disposed on a second plane. The signal trace comprises an increased width in an area of the second plane corresponding to a location of the split.