Inventors:
Paul Silinger - Spokane WA, US
Brent S. Bowler - Newman Lake WA, US
Brian P. Knight - Post Falls ID, US
Ross Schlotthauer - Post Falls ID, US
International Classification:
B23H 11/00
Abstract:
Clip devices contemplated herein comprise a metal-containing base, wherein the base comprises a lower clip body and an upper clip body, and wherein the lower clip body further comprises at least two sets of electrically conducting wire springs. Contemplated electrically conducting wire springs comprise at least one non-contact body section and a plurality of contact points. Methods of plating parts or workpieces include: a) submerging a work piece to be plated in a volume of plating solution; b) positioning a work piece to be plated at least partially within an upper plating channel and a lower plating channel, the upper and lower plating channels comprising non electrically conductive sides, the channels being positioned opposite each other and being separated from each other, the separation between the channels forming a pair of solution egress slots positioned approximately over the center of the work piece to be plated; c) causing electrical current to flow between the work piece and one or more anodes, the current flowing into the upper and lower channels only after passing through the solution egress slots; and d) moving the work piece to be plated along the length of the plating channels to form one or more internal heat spreaders on a surface of the work piece which is essentially parallel to the shields. Plating systems comprising disclosed clip devices are also contemplated.