RONALD LLEWELLYN ENCK
Pilots at Conifer Blvd, Corvallis, OR

6481831, Nov 19, 2002

Jul 7, 2000

09/611810

Colin C. Davis - Corvallis OR
Eric L. Nikkel - Philomath OR
Martha A. Truninger - Corvallis OR
Ronald L. Enck - Corvallis OR

Hewlett-Packard Company - Palo Alto CA

B41J 205

347 62, 347 63

An inkjet printhead and a method of fabricating an inkjet printhead is disclosed. The inkjet printhead includes a conducting material layer deposited on an insulative dielectric. The conducting material layer has a chamber formed between a first and a second section of the conducting material layer. A dielectric material is fabricated on the first and second sections of the conducting material layer and on the insulative dielectric in the chamber. The dielectric material has a planarized top surface. A first via is formed in the dielectric material, thereby exposing a portion of the first section of the conducting material layer. A second via is formed in the dielectric material, thereby exposing a portion of the second section of the conducting material layer. The first and second vias each having sidewalls sloped at an angle in the range of approximately 10-60 degrees. A resistive material layer is formed in the first and second vias and on the planarization dielectric between the first and second vias through a single photoresist mask and a single etch process.

6441838, Aug 27, 2002

Jan 19, 2001

09/765825

Gregory T. Hindman - Albany OR
Domingo A. Figueredo - Livermore CA
Ronald L. Enck - Corvallis OR

Hewlett-Packard Company - Palo Alto CA

G01D 928

346 63

A thermal ink jet printhead that includes a thin film substrate including a plurality of thin film layers, a plurality of ink firing heater resistors defined in the plurality of thin film layers, a patterned tantalum layer disposed on said plurality of thin film layers, a barrier adhesion layer disposed on the patterned tantalum layer, an ink barrier layer disposed over the barrier adhesion layer, and respective ink chambers formed in the ink barrier layer over respective thin film resistors, each chamber formed by a chamber opening in barrier layer, the barrier adhesion layer more particularly comprises a tantalum nitride layer or a deposited tantalum, carbon, fluorine, and oxygen containing layer that is formed pursuant to exposure of the patterned tantalum layer to a plasma that includes a fluorinated hydrocarbon such as carbon tetrafluoride (CF ), fluoroform (CHF ), hexafluoroethane (C F ), difluoromethane (CH F ), pentafluoroethane (C HF ), tetrafluoroethane (C H F ), or octafluorobutene (C F ).

6758711, Jul 6, 2004

Jun 14, 2001

09/881981

Zhizhang Chen - Corvallis OR
Ronald L. Enck - Corvallis OR
Sriram Ramamoorthi - Corvallis OR
Qin Liu - Corvallis OR

Hewlett-Packard Development Company, L.P. - Houston TX

H01J 900

445 24, 430312

A method for creating an electron lens includes the steps of applying a polymer layer on an emitter surface of an electron emitter and then curing the polymer layer to reduce volatile content.

6286939, Sep 11, 2001

Sep 26, 1997

8/938786

Gregory T. Hindman - Albany OR
Domingo A. Figueredo - Livermore CA
Ronald L. Enck - Corvallis OR

Hewlett-Packard Company - Palo Alto CA

B41J 205

347 63

A thermal ink jet printhead that includes a thin film substrate including a plurality of thin film layers, a plurality of ink firing heater resistors defined in the plurality of thin film layers, a patterned tantalum layer disposed on said plurality of thin film layers, a barrier adhesion layer disposed on the patterned tantalum layer, an ink barrier layer disposed over the barrier adhesion layer, and respective ink chambers formed in the ink barrier layer over respective thin film resistors, each chamber formed by a chamber opening in barrier layer, the barrier adhesion layer more particularly comprises a tantalum nitride layer or a deposited tantalum, carbon, fluorine, and oxygen containing layer that is formed pursuant to exposure of the patterned tantalum layer to a plasma that includes a fluorinated hydrocarbon such as carbon tetrafluoride (CF. sub. 4), fluoroform (CHF. sub. 3), hexafluoroethane (C. sub. 2 F. sub.

6988924, Jan 24, 2006

Apr 14, 2003

10/412918

Sriram Ramamoorthi - Corvallis OR, US
Zhizhang Chen - Corvallis OR, US
John Liebeskind - Corvallis OR, US
Ronald L. Enck - Corvallis OR, US
Jennifer Shih - Corvallis OR, US

Hewlett-Packard Development Company, L.P. - Houston TX

H01J 9/00, H01J 1/38, H01J 13/00, H01K 1/04

445 31, 313553

A method of manufacturing a getter structure, including forming a support structure having a support perimeter, where the support structure is disposed over a substrate. In addition, the method includes forming a non-evaporable getter layer having an exposed surface area, where the non-evaporable getter layer is disposed over the support structure, and includes forming a vacuum gap between the substrate and the non-evaporable getter layer. The non-evaporable getter layer extends beyond the support perimeter of the support structure increasing the exposed surface area.

7037736, May 2, 2006

May 13, 2003

10/436921

Victorio A. Chavarria - Corvallis OR, US
Sadiq S. Bengali - Corvallis OR, US
Ronald L. Enck - Corvallis OR, US

Hewlett-Packard Development Company, L.P. - Houston TX

H01L 21/00

438 21

The present invention includes as one embodiment a method for fabricating a portion of an ink-jet printhead made of a silicon substrate, the method including selectively etching active region contact vias of a field effect transistor that has a conducting channel that is insulated from a gate terminal by a layer of oxide along with separate substrate contact vias using a single mask and forming the substrate contact vias simultaneously with the active region contact vias during the selective etching.

7045958, May 16, 2006

Apr 14, 2003

10/413048

Sriram Ramamoorthi - Corvallis OR, US
Zhizhang Chen - Corvallis OR, US
John Liebeskind - Corvallis OR, US
Ronald L. Enck - Corvallis OR, US
Jennifer Shih - Corvallis OR, US

Hewlett-Packard Development Company, L.P. - Houston TX

H01J 17/24, H01J 19/70, H01J 61/26

313553, 313559, 313549, 313560, 313558

A vacuum device, including a substrate and a support structure having a support perimeter, where the support structure is disposed over the substrate. In addition, the vacuum device also includes a non-evaporable getter layer having an exposed surface area. The non-evaporable getter layer is disposed over the support structure, and extends beyond the support perimeter, in at least one direction, of the support structure forming a vacuum gap between the substrate and the non-evaporable getter layer increasing the exposed surface area.

6837572, Jan 4, 2005

Aug 19, 2003

10/643264

Ravi Ramaswami - Vancouver WA, US
Victor Joseph - Palo Alto CA, US
Colin C. Davis - Corvallis OR, US
Ronnie J. Yenchik - Blodgett OR, US
Daniel A. Kearl - Philomath OR, US
Martha A. Truninger - Corvallis OR, US
Ronald L. Enck - Corvallis OR, US

Hewlett-Packard Development Company, L.P. - Houston TX

B41J 216

347 47, 216 27, 438 21

A process for fabricating a droplet plate for the printhead of an ink-jet printer, which process provides design flexibility, precise dimension control, as well as material robustness. Also provided is a droplet plate fabricated in accord with the process.

7112296, Sep 26, 2006

Oct 18, 2002

10/273732

Gregory S Herman - Albany OR, US
Sriram Ramamoorthi - Corvallis OR, US
Peter Mardilovich - Corvallis OR, US
Ronald L. Enck - Corvallis OR, US
J Daniel Smith - Corvallis OR, US

Hewlett-Packard Development Company, L.P. - Houston TX

B29C 39/12

264221, 264219, 264250, 429 38

An electrolyte has a core and at least one projection extending from the core. The core is supported on a substrate, and the at least one projection is separated from the substrate.