Inventors:
Brian R. Hutchison - Windsor CA
Matthew Schwiebert - Cupertino CA
Robert J. Thompson - Santa Rosa CA
Assignee:
Agilent Technologies, Inc. - Palo Alto CA
International Classification:
H05K 720
US Classification:
361704, 361707, 361708, 361713, 361719, 361760, 361761, 257706, 257707, 257713, 165 802, 165185
Abstract:
Integral dielectric heatspreader for transferring heat from semiconductor devices. A semiconductor device is mounted to a thermally conductive electrically insulating substrate, which forms the integral dielectric heatspreader. The heatspreader is then mounted to a package or a lower cost substrate such as a printed circuit board. The integral dielectric heatspreader may also support integral transmission lines, resistors, capacitors, or other bulk components. Performance of the heatspreader is enhanced through the use of thermal vias on a printed circuit board.