ROBERT V LORENZE, JR
Broker in Graniteville, MA

4104674, Aug 1, 1978

Feb 7, 1977

5/766327

Robert V. Lorenze - Westford MA
William Joseph White - Chelmsford MA

Honeywell Inc. - Minneapolis MN

H01L 2714

357 30

A double-sided mosaic focal plane for infrared detection includes a semiconductor substrate having first and second opposing surfaces. Infrared detectors are mounted on the first surface and solid state signal processing circuitry is formed in the semiconductor substrate proximate the second surface. Interconnect means extend through the semiconductor substrate to interconnect the infrared detectors with the solid state signal processing circuitry.

4275407, Jun 23, 1981

Oct 15, 1979

6/084975

Robert V. Lorenze - Westford MA

Honeywell Inc. - Minneapolis MN

H01L 2714, H01L 2978

357 30

A hybrid mosaic IR/CCD focal plane structure is fabricated on a silicon substrate which contains integrated circuit CCD signal processing circuitry. Contact pads are formed which are connected to the signal processing circuitry and which extend above the surface of the silicon substrate. An insulator layer is formed which covers the substrate and the contact pads. The insulator layer is then lapped to form an essentially planar surface with the contact pads exposed. A mosaic detector array is fabricated on the insulator layer, and thin film electrical interconnects are formed from the detectors to the exposed contact pads to couple the photosignals from the detector array to the CCD circuitry.

4069095, Jan 17, 1978

Sep 7, 1976

5/720917

Robert V. Lorenze - Westford MA
Miriam F. Young - Dorchester MA

Honeywell Inc. - Minneapolis MN

B44C 122, C03C 1500, C03C 2506

156632

A method of preparing photodetector array elements from a body of photodetector material wherein conductive layers of a metal are formed on selected portions of a substrate, the conductive layers are coated with a photoresist material, an adhesive layer is deposited on the photoresist and the remaining substrate, a body of photodetector material is bonded to the adhesive, and individual photodetector elements are delineated from the body to form the elements of the array and to expose the edges of the photoresist material, and the photoresist layer and material deposited thereon are removed.

4196508, Apr 8, 1980

Sep 1, 1977

5/829746

Robert V. Lorenze - Westford MA

Honeywell Inc. - Minneapolis MN

B01J 1700

29577R

A hybrid mosaic IR/CCD focal plane structure is fabricated on a silicon substrate which contains integrated circuit CCD signal processing circuitry. Contact pads are formed which are connected to the signal processing circuitry and which extend above the surface of the silicon substrate. An insulator layer is formed which covers the substrate and the contact pads. The insulator layer is then lapped to form an essentially planar surface with the contact pads exposed. A mosaic detector array is fabricated on the insulator layer, and thin film electrical interconnects are formed from the detectors to the exposed contact pads to couple the photosignals from the detector array to the CCD circuitry.

4188709, Feb 19, 1980

Jun 16, 1978

5/916035

Robert V. Lorenze - Westford MA
William J. White - Chelmsford MA

Honeywell Inc. - Minneapolis MN

B01J 1700

29577R

A double-sided mosaic focal plane for infrared detection includes a semiconductor substrate having first and second opposing surfaces. Infrared detectors are mounted on the first surface and solid state signal processing circuitry is formed in the semiconductor substrate proximate the second surface. Interconnect means extend through the semiconductor substrate to interconnect the infrared detectors with the solid state signal processing circuitry.

4286278, Aug 25, 1981

Aug 16, 1979

6/067244

Robert V. Lorenze - Westford MA
William J. White - Chelmsford MA

Honeywell Inc. - Minneapolis MN

H01L 2714

357 30

A hybrid mosaic IR/CCD focal plane structure has high detector element packing densities which may be achieved using cost effective planar processing technology. The focal plane structure preferably includes an insulator layer over a silicon substrate which contains integrated circuit CCD signal processing circuitry. A mosaic photovoltaic (Hg,Cd)Te detector array is fabricated on the insulator layer. The photosignals from the detector array are coupled to the CCD circuitry by thin film electrical interconnects together with contact pads which extend through the insulator layer and are exposed at the surface of the insulator layer.

4197633, Apr 15, 1980

Sep 1, 1977

5/829745

Robert V. Lorenze - Westford MA
William J. White - Chelmsford MA

Honeywell, Inc. - Minneapolis MN

B01J 1700

29577R

A hybrid mosaic IR/CCD focal plane structure has high detector element packing densities which may be achieved using cost effective planar processing technology. The focal plane structure preferably includes an insulator layer over a silicon substrate which contains integrated circuit CCD signal processing circuitry. A mosaic photovoltaic (Hg,Cd)Te detector array is fabricated on the insulator layer. The photosignals from the detector array are coupled to the CCD circuitry by thin film electrical interconnects together with contact pads which extend through the insulator layer and are exposed at the surface of the insulator layer.

4027323, May 31, 1977

Sep 7, 1976

5/720918

Robert V. Lorenze - Westford MA
Miriam F. Young - Dorchester MA

Honeywell Inc. - Minneapolis MN

H01L 2714, H01L 3100, C23F 100, C23G 100

357 30

A novel mask is used to contour the photodetector body and adhesive layer of a photodetector device on a substrate in which the mask apertures define an angle with the plane of the substrate. Air abrasion at that angle removes unwanted portions of the photodetector body and adhesive layer, leaving a contour desirable for subsequent interconnect metallization.