MR. ROBERT THOMAS BROWN
Transportation at Emerald Ct, Rolla, MO
License number
Missouri 3SM647
Category
Transportation
Type
Private Vehicle
Address
Address
11055 Emerald Ct, Rolla, MO 65401
Phone
(573) 308-9999
Professional information
Contact Planarization Apparatus
US Patent:
7775785, Aug 17, 2010
Filed:
Dec 20, 2006
Appl. No.:
11/613898
Inventors:
Jeremy W. McCutcheon - Rolla MO, US
Robert D. Brown - Rolla MO, US
Robert D. Brown - Rolla MO, US
Assignee:
Brewer Science Inc. - Rolla MO
International Classification:
B28B 1/00, B29C 35/08
US Classification:
4254051, 4251744
Abstract:
A contact planarization apparatus includes a lower membrane assembly, an upper membrane assembly, a differential pressure assembly, and a curing or reflowing assembly. The lower membrane assembly supports a substrate to be planarized and biases it toward the upper membrane assembly under the influence of the pressure differential assembly. The upper membrane assembly planarizes the coating on the substrate under the influence of the differential pressure assembly and includes a flexible sheet which is supported above the substrate stage and below the curing or reflowing assembly via a vacuum force applied by the differential pressure assembly. The differential pressure assembly moves the lower and upper membrane assemblies relative to one another to planarize the coating on the substrate entirely through the application of vacuum and pressure forces. The differential pressure assembly includes atop pressure chamber positioned above the upper face of the upper sheet, a bottom pressure chamber positioned below the lower face of the lower sheet, and a central pressure chamber positioned generally between the lower face of the upper sheet and the upper face of the lower sheet.
Method And Apparatus For Removing A Reversibly Mounted Device Wafer From A Carrier Substrate
US Patent:
2011030, Dec 22, 2011
Filed:
Jun 21, 2010
Appl. No.:
12/819680
Inventors:
Jeremy W. McCutcheon - Rolla MO, US
Robert D. Brown - Rolla MO, US
Robert D. Brown - Rolla MO, US
Assignee:
BREWER SCIENCE INC. - Rolla MO
International Classification:
B26D 5/42, B26D 3/28
US Classification:
156766, 156383
Abstract:
New demounting methods and apparatuses for separating temporarily, permanently, or semi-permanently bonded substrates and articles formed from those methods and apparatuses are provided. The methods comprise demounting a device wafer from a carrier wafer or substrate that have only been strongly bonded at their outer perimeters. The edge bonds are chemically, mechanically, acoustically, or thermally softened, dissolved, or disrupted to allow the wafers to be easily separated with very low forces and at or near room temperature at the appropriate stage in the fabrication process. A clamp for facilitating separation of the bonded substrates is also provided.