ROBERT-SCOTT MELENDRINO LOPEZ
Pilots at Rorex Dr, Escondido, CA

6409307, Jun 25, 2002

Feb 14, 2001

09/783676

Mohammad Akhavain - Escondido CA
Robert-Scott Melendrino Lopez - Escondido CA
Janis Horvath - San Diego CA
Noah Carl Lassar - San Diego CA
David McElfresh - San Diego CA
Brian J. Keefe - La Jolla CA
Joseph E. Scheffelin - Poway CA

Hewlett-Packard Company - Palo Alto CA

B41J 2155

347 42, 347 13, 347 49

An inkjet printhead assembly includes a substrate having a non-planar surface and a plurality of adhesive quantities each disposed on the non-planar surface of the substrate. As such, a plurality of printhead dies are each adhered to the non-planar surface of the substrate by one of the adhesive quantities. A thickness of at least one of the adhesive quantities varies from the thickness of another of the adhesive quantities such that the thickness of the adhesive quantities compensates for the non-planar surface of the substrate. Thus, the adhesive quantities support the printhead dies and establish a substantially coplanar relationship among the printhead dies.

6476346, Nov 5, 2002

May 21, 2001

09/862686

Mohammad Akhavain - Escondido CA
Say-Teng Lai - Singapore, SG
Robert-Scott Melendrino Lopez - Escondido CA

Hewlett-Packard Company - Palo Alto CA

B23K 2600

21912164

The disclosure describes a method for predicting and avoiding bad bonds or connections when performing electrical connection of two electrical conductors by using a laser light beam attached to an optical fiber system which directs the light to the spot to be bonded. The method provides for rapid detection of damaged optical fibers before bad bonds or connections occur. Disclosed is a method for predicting and avoiding bad bonds or connections when performing solderless electrical connection of two contact elements by using a laser light beam attached to a optical fiber system which directs the light to the spot to be bonded.

6543880, Apr 8, 2003

Aug 25, 2000

09/648567

Mohammad Akhavain - Escondido CA
Robert-Scott Melendrino Lopez - Escondido CA
Brian J. Keefe - La Jolla CA
Janis Horvath - San Diego CA
Joseph E. Scheffelin - Poway CA
David K. Mc Elfresh - San Diego CA

Hewlett-Packard Company - Fort Collins CO

B41J 2155

347 42, 347 13

A method of forming an inkjet printhead assembly includes providing a substrate, disposing a planarization layer on a face of the substrate such that a first surface of the planarization layer contacts the face of the substrate, mechanically planarizing a second surface of the planarization layer opposite the first surface, including reducing a thickness of at least a portion of the first planarization layer, and mounting a plurality of printhead dies on the second surface of the planarization layer.

6236015, May 22, 2001

Oct 31, 1998

9/183957

Mohammad Akhavain - Escondido CA
Say-Teng Lai - Singapore, SG
Robert-Scott Melendrino Lopez - Escondido CA

Hewlett-Packard Company - Palo Alto CA

B23K 2600

21912163

The disclosure describes a method for predicting and avoiding bad bonds or connections when performing electrical connection of two electrical conductors by using a laser light beam attached to an optical fiber system which directs the light to the spot to be bonded. The method provides for rapid detection of damaged optical fibers before bad bonds or connections occur. Disclosed is a method for predicting and avoiding bad bonds or connections when performing solderless electrical connection of two contact elements by using a laser light beam attached to a optical fiber system which directs the light to the spot to be bonded. The method of the present invention performs optical fiber push laser bonding operations on electric conductor leads includes providing an optical fiber push laser bonding system having an optical fiber for directing a laser beam, positioning first and second electrical leads in a bonding position, holding the first and second electrical leads in contact at a bond surface with an optical fiber, bonding the first and second electrical leads at the bond surface by directing the laser beam through the optical fiber, repeating said positioning, holding and bonding steps for a plurality of bonds, interrupting the aforesaid laser bonding operations in order to examine the condition of the fiber; wherein the following procedures occur during said interrupting directing the laser beam through the optical fiber, capturing the spatial energy distribution of the laser beam exiting the optical fiber and analyzing the spatial energy distribution of the laser beam to determine condition of the optical fiber in order to determine the need for corrective action.