ROBERT PHILLIP RIPPSTEIN
Pilots at Gene Ct, East Fishkill, NY

7115207, Oct 3, 2006

Jul 1, 2003

10/604213

Peter H. Berasi - Hopewell Junction NY, US
Michael F. Jerome - Kingston NY, US
Doris P. Pulaski - Holmes NY, US
Robert P. Rippstein - Hopewell Junction NY, US

International Businss Machines Corporation - Armonk NY

B44C 1/22, C25F 3/00, G03F 1/00

216 12, 430 5

Disclosed is a method of manufacturing a metal mask for an integrated circuit chip interconnect solder bump. The invention deposits a very thick photoresist on both sides of a very thick molybdenum foil sheet (the molybdenum sheet is at least 8 mils thick and the photoresist is at least 5 microns thick). Then the process exposes and develops the photoresist to produce at least one opening having a diameter of at least 5 mil. The invention simultaneously etches both sides of the molybdenum foil using a very low etchant spray pressure of approximately 5 psi to form at least one via in the molybdenum foil that has a diameter of at least 12 mil and a knife-edge of 0. 2 mil. The photoresist is removed after the etching process.

7077974, Jul 18, 2006

May 30, 2003

10/250044

Peter Berasi - Hopewell Junction NY, US
Michael Jerome - Kingston NY, US
Doris Pulaski - Holmes NY, US
Robert Rippstein - Hopewell Junction NY, US

International Business Machines Corporation - Armonk NY

C23F 1/00

216 84, 216 41, 216 83, 216100, 430 5, 430312, 430313, 428137

A method of making, and the resultant mask, comprises developing resist layers over surfaces of a masking layer to transfer significantly reduced sized openings within glass masters attached to the surfaces of the masking layer into the resist layers. These significantly reduced sized openings within the resist layers are then transferred into the masking layer within a first etch bath by simultaneously monitoring and controlling both etchant activity and concentration of a byproduct within the etch bath formed between the masking material and the etchant. The openings may be etched to completion within the first etch bath, or alternatively, the openings may be etched to a pre-finished image size. Wherein the openings are etched to a pre-finished image size, the masking layer is immersed into a second etch bath for further micro-etching of these openings to a final desired image size.

5235626, Aug 10, 1993

Oct 22, 1991

7/781562

Alexander L. Flamholz - Monsey NY
Robert P. Rippstein - Hopewell Junction NY
Yuli Vladimirsky - Chappaqua NY
Chester A. Wasik - Poughkeepsie NY

International Business Machines Corporation - Armonk NY

G21K 500

378 34

An x-ray lithography mask design provides for replacement of a single large area membrane with a set of smaller membranes (segments) fabricated on a single mask substrate forming a segmented mask. The segments are arranged serially so that they can be sequentially aligned and exposed by a shaped x-ray beam. Thus, the segmented mask is a series of mask membrane segments mounted together.

4515544, May 7, 1985

Mar 29, 1984

6/594666

Russell W. Boehm - Longmont CO
Robert P. Rippstein - Hopewell Junction NY
David R. Stone - Longmont CO

International Business Machines Corporation - Armonk NY

B29F 100

425129R

Sensor arranged to detect the proper placement and quantity of one or more inserts in the cavity of an injection molding machine. The sensor is preferably formed of a spring-biased plunger through one of the cavity shells. A photodetector monitors the movement of the plunger as the cavity-forming shells are closed and activates an alarm signal if the plunger movement is excessive before detection of proper mold closure.

2006024, Nov 2, 2006

Apr 28, 2005

10/908126

Robert Rippstein - Hopewell Junction NY, US
Harry Cox - Rifton NY, US
James Kuss - Claverack NY, US
Hsichang Liu - Fishkill NY, US
Vincent LoVerso - Clintondale NY, US
Krystyna Semkow - Poughquag NY, US

INTERNATIONAL BUSINESS MACHINES CORPORATION - Armonk NY

B44C 1/22

216012000, 216100000

A copper core used in electroformed metal (EFM) masks is replaced with a copper/molybdenum/copper clad core (Cu/Mo/Cu). The copper cladding on the molybdenum enhances adhesion of electroplated nickel. The nickel is electro-deposited through a patterned resist template onto the copper clad molybdenum surface. The copper and molybdenum are etched by selective etchants that do not attack other non-etched layers, leaving a patterned nickel stencil on a high-strength supporting base.

5268951, Dec 7, 1993

Dec 22, 1992

7/994744

Alexander L. Flamholz - Monsey NY
Robert P. Rippstein - Hopewell Junction NY
Jerome P. Silverman - White Plains NY
Matthew A. Thompson - Austin TX

International Business Machines Corporation - Armonk NY

G21K 500

378 34

A x-ray scanning method involves the stops of directing an x-ray beam at a collimating first mirror having the capability of altering the source to mirror location and/or grazing angle of incidence. The beam is then reflected from a flat second mirror capable of a scanning motion by linear translation with an optional accompanying angular change in the grazing angle of incidence of the beam on the second mirror.