Inventors:
Robert L. Miller - Tucson AZ, US
Raman Srinivasan - Tucson AZ, US
Assignee:
Newport Corporation - Irvine CA
International Classification:
H01S 3/04
Abstract:
A laser module comprising a laser device attached to a heat sink that is configured to provide a relatively low thermal resistance for thermal management of the laser device, and a coefficient of thermal expansion (CTE) that is substantially matched to the CTE of the laser device for reducing stress caused by thermal cycles. The heat sink includes a shell made out of a first material, and an insert situated within the shell and made out of a second material distinct from the first material of the shell. By properly selecting the first and second materials, configuring the overall mass of the shell with respect to the overall mass of the insert, and positioning, arranging, and/or orienting the insert with respect to the laser device, the desired effective thermal resistance and CTE for the heat sink may be achieved. In one embodiment, the shell includes a material, such as copper, or a metal matrix composite such as copper graphite. The insert includes a thermal pyrolytic graphite oriented such that its x-axis extends substantially parallel to the longitudinal axis of the laser device, and its y-axis extends substantially perpendicular to the laser device.