Inventors:
Kevin L. Miller - Austin TX
Robert L. McMahan - Cedar Park TX
Todd W. Steigerwald - Austin TX
Assignee:
Dell USA, L.P. - Austin TX
International Classification:
H05K 900
Abstract:
Transverse electromagnetic mode (TEM) radiation emitted from a side edge portion of a circuit board substrate portion during operation of the circuit board is intercepted by a specially designed shield structure carried by the substrate side edge portion, and the intercepted radiation is conductively returned to the substrate ground plane, through a relatively short grounding path, for return to the emitting source(s). In one form thereof, the shield is a copper plating material extending along and covering the substrate side edge portion and adjacent peripheral portions of the opposite sides of the substrate. In another form thereof, the shield is a snap-on metal shield structure that is removably mounted around the substrate side edge portion. The shield may be electrically coupled to the substrate ground plane by directly contacting a ground plane edge portion with the copper plating, using a filter structure to couple the shield to the ground plane, or otherwise using an external grounding path. When the shield is formed by using a copper plating, the shield may also be used as a grounding connection by sliding it into a metal chassis support rail structure.