ROBERT L GOLDBERG
Broker in Sharon, MA
License number
Massachusetts 129277
Issued Date
Mar 1, 1986
Expiration Date
Sep 4, 1988
Type
Broker
Address
Address
Sharon, MA 02067
Professional information
Robert Goldberg - Sharon, MA
Work:
International SOS
Corporate Accounts Manager Brainshark, Inc - Waltham, MA
National Account Manager Brainshark - Waltham, MA
Business Development Representative ZoomInfo, Inc - Waltham, MA
Account Executive - Enterprise Accounts GateHouse Media New England - Needham, MA
Sales Account Manager - Major and National Accounts David Wilson Associates - Needham, MA
Senior Account Executive Unisource Worldwide, Inc
Division Liaison Unisource Worldwide, Inc - Woburn, MA
Store Manager
Corporate Accounts Manager Brainshark, Inc - Waltham, MA
National Account Manager Brainshark - Waltham, MA
Business Development Representative ZoomInfo, Inc - Waltham, MA
Account Executive - Enterprise Accounts GateHouse Media New England - Needham, MA
Sales Account Manager - Major and National Accounts David Wilson Associates - Needham, MA
Senior Account Executive Unisource Worldwide, Inc
Division Liaison Unisource Worldwide, Inc - Woburn, MA
Store Manager
Education:
University of Hartford - Hartford, CT
Bachelor of Science in Business Administration in Marketing
Bachelor of Science in Business Administration in Marketing
Trans Dermal Skin Care
US Patent:
2003003, Feb 27, 2003
Filed:
Mar 1, 2002
Appl. No.:
10/086990
Inventors:
Michael Gulla - Sarasota FL, US
Robert Goldberg - Sharon MA, US
Robert Goldberg - Sharon MA, US
Assignee:
Neo Tech Development Company, L.L.C. - Sharon MA
International Classification:
A61K007/00
US Classification:
424/401000
Abstract:
This invention is for a rapid penetrating skin treatment emulsion characterized by an ability to very rapidly penetrate into the epidermis and dermis carrying efficacious additives with it as it penetrates into the skin. The ability to penetrate into the skin is due to the physical structure of the emulsion, which in turn is as a consequence of its ingredients, and the concentration of each ingredient.
Conductive Oxide Coating Process
US Patent:
6632344, Oct 14, 2003
Filed:
Mar 24, 2000
Appl. No.:
09/535302
Inventors:
Robert L. Goldberg - Sharon MA 02067
Michael Gulla - Sarasota FL 34238
Michael Gulla - Sarasota FL 34238
International Classification:
C25D 554
US Classification:
205159, 205220, 205164, 205125
Abstract:
The invention is directed to a process for electroplating a non-conducting surface such as through-hole walls within a printed circuit board substrate. The process comprises formation of a conductive oxide coating over a substrate, preferably by immersion of said substrate in an aqueous oxidative desmear solution for a time sufficient to form a coating containing conductive dielectric oxidation residue and then, in the absence of a step of forming an additional conductive coating over the residue coating or removing the coating, electroplating metal onto said surface by immersion of the substrate having the coating in an electroplating solution.
Multilayer Circuit Board Manufacturing Process
US Patent:
6804881, Oct 19, 2004
Filed:
May 12, 2000
Appl. No.:
09/569767
Inventors:
Charles R. Shipley - Auburndale MA
Robert L. Goldberg - Sharon MA
James G. Shelnut - Northboro MA
Robert L. Goldberg - Sharon MA
James G. Shelnut - Northboro MA
Assignee:
Shipley Company, L.L.C. - Marlborough MA
International Classification:
H05K 336
US Classification:
29830, 29846, 29843, 174262, 430315, 430319, 430312, 205125
Abstract:
A method for manufacture of a multilayer board and the board formed by the novel method. The method comprises selective plating of metallic reinforcing members, solder mount pads, signal lines and interconnections sequentially. The resultant board is desirably free of glass fiber reinforcement.
Sequential Build Circuit Board
US Patent:
6759596, Jul 6, 2004
Filed:
May 12, 2000
Appl. No.:
09/569553
Inventors:
James G. Shelnut - Northboro MA
Charles R. Shipley - Auburndale MA
Robert L. Goldberg - Sharon MA
Charles R. Shipley - Auburndale MA
Robert L. Goldberg - Sharon MA
Assignee:
Shipley Company - Marlborough MA
International Classification:
H05K 103
US Classification:
174255, 174261, 29832, 29847
Abstract:
The invention provides multilayer circuit boards and methods for formation of a sequential build circuit board. Among other things, glass fiber reinforced copper clad epoxy substrates, required to provide strength or rigidity to prior boards, are not required for preferred circuit boards of the invention. Preferred methods of the invention include applying a dielectric coating onto a support; forming recesses in the dielectric coating that define openings including opening for at least one reinforcing member; depositing copper metal into the recesses to form a first layer; applying a second dielectric coating onto the first circuit layer; forming recesses in the second dielectric coating that define openings including openings for at least one reinforcing member in registration with the one or more reinforcing members in the first layer; depositing metal into the recesses in the dielectric coating to form the second layer; and repeating the process to form sequential build board having the desired number of layers.
Method For Patterning Electroless Metal On A Substrate Followed By Reactive Ion Etching
US Patent:
5112434, May 12, 1992
Filed:
Mar 20, 1991
Appl. No.:
7/672402
Inventors:
Robert L. Goldberg - Sharon MA
Assignee:
Shipley Company Inc. - Newton MA
International Classification:
B44C 122, H01L 21306, C23F 100, B29C 3700
US Classification:
156628
Abstract:
This invention describes methods for altering a substrate in a fine line image pattern using microlithographic processes including formation of a metal mask over a polymer coating to protect the coating during dry development of the same. A substrate is first coated with a polymer suitable for complexing noble metal compounds. The substrate is then complexed with a noble metal compound, such as by contact with a palladium salt, selectively irradiated to form the desired conductor pattern, and then etched so that the desired pattern remains. The substrate is subsequently placed in an electroless plating bath to form a metal mask. Alternatively, before applying the noble metal compound, a substrate immersed in a polymer solution suitable for complexing a noble metal compound can be selectively irradiated to selectively deposit polymer on the substrate, followed by applying a noble metal compound and electroless plating to form the desired mask.
Platable Liquid Film Forming Coating Composition Containing Conductive Metal Sulfide Coated Inert Inorganic Particles
US Patent:
5075039, Dec 24, 1991
Filed:
May 31, 1990
Appl. No.:
7/531354
Inventors:
Robert L. Goldberg - Sharon MA
Assignee:
Shipley Company Inc. - Newton MA
International Classification:
H01B 120
US Classification:
252518
Abstract:
The invention discloses a new platable coating composition and a process of using the same for selective plating. The coating composition and process are especially adapted for formation of EMI shielding for electronic components. The coating composition comprises particulates dispersed in a liquid film forming composition which particulates are coated with a conductive metal chalcogenide.
Electroplating Process
US Patent:
5419829, May 30, 1995
Filed:
May 17, 1994
Appl. No.:
8/243980
Inventors:
Gordon Fisher - Sudbury MA
John J. Bladon - Wayland MA
Wade Sonnenberg - Foxboro MA
Robert L. Goldberg - Sharon MA
John J. Bladon - Wayland MA
Wade Sonnenberg - Foxboro MA
Robert L. Goldberg - Sharon MA
Assignee:
Rohm and Haas Company - Philadelphia PA
International Classification:
C25D 5154
US Classification:
205166
Abstract:
A method for electroplating a nonconducting surface using a metal oxide colloid. The process comprises contacting the surface of the nonconductor to be plated with a preformed colloid of a metal oxide to adsorb the colloid onto the surface of the nonconductor and then electroplating metal over the surface having the adsorbed metal oxide colloid. The process may include a step of reducing the metal oxide to a lower valent state prior to the step of metal plating.
Electroplating Process
US Patent:
5484518, Jan 16, 1996
Filed:
Mar 4, 1994
Appl. No.:
8/206733
Inventors:
Robert L. Goldberg - Sharon MA
Assignee:
Shipley Company Inc. - Marlborough MA
International Classification:
C25D 554
US Classification:
205166
Abstract:
A process for electroplating a substrate by coating the substrate with a liquid dispersion of conductive particles selected from the group of metals, metal oxides and metal sulfides, drying the substrate and electroplating over said dried coating. The process is especially useful for the fabrication of printed circuit boards.
Sequential Build Circuit Board
US Patent:
6944945, Sep 20, 2005
Filed:
May 12, 2000
Appl. No.:
09/570321
Inventors:
Charles R. Shipley - Auburndale MA, US
Robert L. Goldberg - Sharon MA, US
James G. Shelnut - Northboro MA, US
Robert L. Goldberg - Sharon MA, US
James G. Shelnut - Northboro MA, US
Assignee:
Shipley Company, L.L.C. - Malborough MA
International Classification:
H01K003/10
US Classification:
29852, 29846, 29830, 29825, 430315, 174262, 174263, 361792, 257698, 257700
Abstract:
A method for manufacture of a circuit board and the board formed by the novel method. The method comprises selective plating of metallic reinforcing members, solder mount pads, signal and interconnections sequentially. The resultant board is desirably free of glass fiber reinforcement.