Inventors:
Willis George Watrous - Mountain View CA
Robert T. Jenkins - Byron CA
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L 2934, H01L 2904, H01L 2348, H01L 2328
Abstract:
An interconnect pad for electrical coupling between a semiconductor integrated circuit and external leads or the like which includes a secondary conductive path in the event of degradation of the interconnect pad. Metallic contact and conductive elements in the integrated circuit are separated from, and otherwise protected from, deliquescent chemical radicals such as P. sub. 2 O. sub. 5 contained in underlying structure of the integrated circuit by a layer of silicon.