Inventors:
Alex Harwit - Boulder CO, US
David A. Dorn - Loveland CO, US
Christopher Lynn Mears - Boulder CO, US
Morley M. Blouke - Erie CO, US
Robert H. Philbrick - Erie CO, US
Theresa J. Axenson - Longmont CO, US
Assignee:
Ball Aerospace & Technologies Corp. - Boulder CO
International Classification:
H04N 3/14, H04N 5/335
US Classification:
348311, 348295, 348300, 2502081
Abstract:
The present invention relates to imaging systems that generally include at least a first substrate, on which a charge coupled device imaging sensor array is formed, and a second substrate on which readout circuitry is formed. Information related to the amount of light incident on pixels included in the imaging sensor array is passed to the readout circuitry as a voltage signal over an interconnection between the imaging sensor array and the readout circuitry. Accordingly, the readout circuitry may sample the output of the imaging sensor array multiple times. The system allows different processes to be used for forming the imaging sensor array and the readout circuitry, while also supporting multiple samples of information provided by the imaging sensor array.