ROBERT E GARRETT
Vehicle Board in Reading, PA

4297190, Oct 27, 1981

Dec 1, 1980

6/211603

Robert W. Garrett - Reading PA

Western Electric Co., Inc. - New York NY

C23C 1500

204192E

A workpiece (16), for example a magnetic bubble memory wafer, is held in place, and heat is removed from it by an expandable heat pipe (22) during a process performed in a vacuum as, for example, a sputter etch process. The expandable heat pipe (22) includes two plates (24, 26) joined by a bellows (28) to form a sealed chamber containing a vaporizable liquid such as water. During loading of the wafers the heat pipe (22) is compressed by atmospheric pressure and thereby facilitates easy assembly of the wafer (16) and heat pipe (22) into a holding fixture (10) which in turn is bolted to a cooling plate (30) situated inside a vacuum chamber. When the chamber is evacuated, the heat pipe (22) expands to hold the wafer (16) in place and form a good thermal path from the wafer (16) to the cooling plate (30). In an alternate embodiment the heat pipe (22) does not completely fill the gap from the wafer (16) to the cooling plate (30) in a vacuum at room temperature, but rather expands to fill the gap when the heat pipe (22) is heated by the wafer (16). The expanding heat pipe (22) holds the wafer (16) at a constant, predetermined temperature above the temperature of the cold plate.

4274476, Jun 23, 1981

May 14, 1979

6/038741

Robert W. Garrett - Reading PA

Western Electric Company, Inc. - New York NY

F28D 1500

165 80E

A workpiece (16), for example a magnetic bubble memory wafer, is held in place, and heat is removed from it by an expandable heat pipe (22) during a process performed in a vacuum as, for example, a sputter etch process. The expandable heat pipe (22) includes two plates (24, 26) joined by a bellows (28) to form a sealed chamber containing a vaporizable liquid such as water. During loading of the wafers the heat pipe (22) is compressed by atmospheric pressure and thereby facilitates easy assembly of the wafer (16) and heat pipe (22) into a holding fixture (10) which in turn is bolted to a cooling plate (30) situated inside a vacuum chamber. When the chamber is evacuated, the heat pipe (22) expands to hold the wafer (16) in place and form a good thermal path from the wafer (16) to the cooling plate (30). In an alternate embodiment the heat pipe (22) does not completely fill the gap from the wafer (16) to the cooling plate (30) in a vacuum at room temperature, but rather expands to fill the gap when the heat pipe (22) is heated by the wafer (16). The expanding heat pipe (22) holds the wafer (16) at a constant, predetermined temperature above the temperature of the cold plate.

4285433, Aug 25, 1981

Dec 19, 1979

6/105464

Robert W. Garrett - Reading PA
Donald E. Horning - Wyomissing PA
Dennis L. Merkel - Hamburg PA

Western Electric Co., Inc. - New York NY

B07C 534

209573

Removing dice (16) from a wafer (10) which has been attached to a tape layer (12, 14) and severed into individual die (16) leaving the tape layer (12, 14) in one piece is accomplished by attaching the tape layer (12, 14) to a length of adhesive tape (18). The adhesive tape (18) is passed across a surface (20) and through a slot (38) in the surface (20) causing the die (16) to pass across the slot (38) and away from the tape layer (12, 14) which remains attached to the adhesive tape (18).