Inventors:
Robert C. Anderson - Tucson AZ, US
Randy J. Shul - Albuquerque NM, US
Peggy J. Clews - Tijeras NM, US
Michael S. Baker - Albuquerque NM, US
Maarten P. De Boer - Albuquerque NM, US
Assignee:
Sandia Corporation - Albuquerque NM
International Classification:
H01L 21/00
US Classification:
438113, 438460, 257E21483
Abstract:
A method is disclosed for singulating die from a substrate having a sacrificial layer and one or more device layers, with a retainer being formed in the device layer(s) and anchored to the substrate. Deep Reactive Ion Etching (DRIE) etching of a trench through the substrate from the bottom side defines a shape for each die. A handle wafer is then attached to the bottom side of the substrate, and the sacrificial layer is etched to singulate the die and to form a frame from the retainer and the substrate. The frame and handle wafer, which retain the singulated die in place, can be attached together with a clamp or a clip and to form a package for the singulated die. One or more stops can be formed from the device layer(s) to limit a sliding motion of the singulated die.