Robert Albert Enzenroth
Engineers at Rutgers Ave, Fort Collins, CO

License number
Colorado 57552
Issued Date
Jul 6, 1994
Renew Date
Jul 6, 1994
Type
Engineer Intern
Address
Address
112 Rutgers Ave #108, Fort Collins, CO 80525

Professional information

Robert Enzenroth Photo 1

Apparatus And Processes For The Massproduction Of Photovotaic Modules

US Patent:
6423565, Jul 23, 2002
Filed:
May 30, 2000
Appl. No.:
09/583381
Inventors:
Kurt L. Barth - Fort Collins CO 80521
Robert A. Enzenroth - Fort Collins CO 80525
Walajabad S. Sampath - Fort Collins CO 80525
International Classification:
H01L 2100
US Classification:
438 57, 438 60, 438 95, 136260, 136264
Abstract:
An apparatus and processes for large scale inline manufacturing of CdTe photovoltaic modules in which all steps, including rapid substrate heating, deposition of CdS, deposition of CdTe, CdCl treatment, and ohmic contact formation, are performed within a single vacuum boundary at modest vacuum pressures. A p+ ohmic contact region is formed by subliming a metal salt onto the CdTe layer. A back electrode is formed by way of a low cost spray process, and module scribing is performed by means of abrasive blasting or mechanical brushing through a mask. The vacuum process apparatus facilitates selective heating of substrates and films, exposure of substrates and films to vapor with minimal vapor leakage, deposition of thin films onto a substrate, and stripping thin films from a substrate. A substrate transport apparatus permits the movement of substrates into and out of vacuum during the thin film deposition processes, while preventing the collection of coatings on the substrate transport apparatus itself.


Robert Enzenroth Photo 2

Apparatus And Method For Rapid Cooling Of Large Area Substrates In Vacuum

US Patent:
8302554, Nov 6, 2012
Filed:
Aug 23, 2010
Appl. No.:
12/861391
Inventors:
Kurt L. Barth - Fort Collins CO, US
Robert A. Enzenroth - Fort Collins CO, US
Walajabad S. Sampath - Fort Collins CO, US
Assignee:
Colorada State University Research Foundation. - Ft. Collins CO
International Classification:
B05C 11/00, B05C 13/00, B05C 13/02, B05C 21/00, C23C 16/00, C23F 1/00, H01L 21/306, B05D 3/00, F26B 7/00
US Classification:
118 69, 118500, 118715, 118716, 118724, 118725, 4273981, 15634527, 15634537, 15634553, 34433, 165 801
Abstract:
The present invention is directed to an apparatus and method for rapid cooling of a large substrate in a vacuum environment. A first cooled plate is brought into close proximity with one surface of a flat substrate. The spatial volume between the first cooling plate and the substrate is sealed and brought to a higher pressure than the surrounding vacuum level to increase the cooling efficiency. A second cooled plate is brought into close proximity with the opposite surface of the flat substrate. A second spatial volume between the second cooling plate and the substrate is sealed and the gas pressure is equalized to the gas pressure in the first spatial volume. The equalization of the gas pressure on both sides of the flat substrate eliminates deflection of the substrate and bending stress in the substrate.


Robert Enzenroth Photo 3

Apparatus And Method For Rapid Cooling Of Large Area Substrates In Vacuum

US Patent:
7803419, Sep 28, 2010
Filed:
Sep 22, 2006
Appl. No.:
11/525456
Inventors:
Kurt L. Barth - Fort Collins CO, US
Robert A. Enzenroth - Fort Collins CO, US
Walajabad S. Sampath - Fort Collins CO, US
Assignee:
Abound Solar, Inc. - Loveland CO
International Classification:
C23C 16/52, B05D 3/00
US Classification:
427 8, 4272481, 427331, 427444, 427532, 118724
Abstract:
The present invention is directed to an apparatus and method for rapid cooling of a large substrate in a vacuum environment. A first cooled plate is brought into close proximity with one surface of a flat substrate. The spatial volume between the first cooling plate and the substrate is sealed and brought to a higher pressure than the surrounding vacuum level to increase the cooling efficiency. A second cooled plate is brought into close proximity with the opposite surface of the flat substrate. A second spatial volume between the second cooling plate and the substrate is sealed and the gas pressure is equalized to the gas pressure in the first spatial volume. The equalization of the gas pressure on both sides of the flat substrate eliminates deflection of the substrate and bending stress in the substrate.


Robert Enzenroth Photo 4

Apparatus And Processes For The Mass Production Of Photovoltaic Modules

US Patent:
7220321, May 22, 2007
Filed:
Mar 24, 2004
Appl. No.:
10/808050
Inventors:
Kurt L. Barth - Ft. Collins CO, US
Robert A. Enzenroth - Fort Collins CO, US
Walajabad S. Sampath - Fort Collins CO, US
International Classification:
C23G 16/00
US Classification:
118729, 117109
Abstract:
An apparatus and processes for large scale inline manufacturing of CdTe photovoltaic modules in which all steps, including rapid substrate heating, deposition of CdS, deposition of CdTe, CdCltreatment, and ohmic contact formation, are performed within a single vacuum boundary at modest vacuum pressures. A p+ ohmic contact region is formed by subliming a metal salt onto the CdTe layer. A back electrode is formed by way of a low cost spray process, and module scribing is performed by means of abrasive blasting or mechanical brushing through a mask. The vacuum process apparatus facilitates selective heating of substrates and films, exposure of substrates and films to vapor with minimal vapor leakage, deposition of thin films onto a substrate, and stripping thin films from a substrate. A substrate transport apparatus permits the movement of substrates into and out of vacuum during the thin film deposition processes, while preventing the collection of coatings on the substrate transport apparatus itself.


Robert Enzenroth Photo 5

Apparatus And Processes For The Mass Production Of Photovoltaic Modules

US Patent:
2003012, Jul 10, 2003
Filed:
Jul 22, 2002
Appl. No.:
10/200265
Inventors:
Kurt Barth - Fort Collins CO, US
Robert Enzenroth - Fort Collins CO, US
Walajabad Sampath - Fort Collins CO, US
International Classification:
H01L021/00, H01L021/301, H01L021/46, H01L021/78
US Classification:
438/462000
Abstract:
An apparatus and processes for large scale inline manufacturing of CdTe photovoltaic modules in which all steps, including rapid substrate heating, deposition of CdS, deposition of CdTe, CdCltreatment, and ohmic contact formation, are performed within a single vacuum boundary at modest vacuum pressures. A p+ ohmic contact region is formed by subliming a metal salt onto the CdTe layer. A back electrode is formed by way of a low cost spray process, and module scribing is performed by means of abrasive blasting or mechanical brushing through a mask. The vacuum process apparatus facilitates selective heating of substrates and films, exposure of substrates and films to vapor with minimal vapor leakage, deposition of thin films onto a substrate, and stripping thin films from a substrate. A substrate transport apparatus permits the movement of substrates into and out of vacuum during the thin film deposition processes, while preventing the collection of coatings on the substrate transport apparatus itself.


Robert Enzenroth Photo 6

Apparatus And Method For Fabricating Photovoltaic Modules Using Heated Pocket Deposition In A Vacuum

US Patent:
8557045, Oct 15, 2013
Filed:
Aug 26, 2008
Appl. No.:
12/198675
Inventors:
Kurt L. Barth - Fort Collins CO, US
Robert A. Enzenroth - Fort Collins CO, US
Walajabad S. Sampath - Fort Collins CO, US
Assignee:
Colorado State University Research Foundation - Fort Collins CO
International Classification:
C23C 16/00
US Classification:
118726, 118723 HC, 118724, 427592
Abstract:
An apparatus and method for manufacturing thin-film CdS/CdTe photovoltaic modules in a vacuum environment. The apparatus deposits CdS and CdTe layers onto a substrate using heated pocket deposition, a form of physical vapor deposition (PVD) in which a material thermally sublimes from a thermal sublimation source block and is deposited onto a substrate. The thermal sublimation source block includes a pocket having a lower surface into which an array of holes is formed to house plugs of deposition material. Upon heating, deposition material sublimes from a surface of each plug of deposition material, and the surface of each plug regresses into its corresponding hole while maintaining a constant surface area. The sublimation surface area of deposition material across the pocket remains substantially constant during an extended deposition process, and the deposition material is substantially free of undesired thermal radiation from the substrate. As such, the thermal sublimation source block provides a temporally- and spatially-uniform thin film deposition rate across the lower surface of the substrate.


Robert Enzenroth Photo 7

System And Method For Sealing A Vapor Deposition Source

US Patent:
8480805, Jul 9, 2013
Filed:
Apr 16, 2010
Appl. No.:
12/762024
Inventors:
Robert A. Enzenroth - Fort Collins CO, US
Joseph D. LoBue - Dale TX, US
Lawrence J. Knipp - Fort Collins CO, US
Assignee:
Colorado State University Research Foundation - Fort Collins CO
International Classification:
C23C 16/00
US Classification:
118726, 118733, 414805
Abstract:
A system and method for movably sealing a vapor deposition source is described. One embodiment includes a system for coating a substrate, the system comprising a deposition chamber; a vapor pocket located within the deposition chamber; and an at least one movable seal, wherein the at least one movable seal is configured to form a first seal with a first portion of a substrate, and wherein the first seal is configured to prevent a vapor from leaking past the first portion of the substrate out of the vapor pocket. In some embodiments, the movable seal may comprise a first flange, wherein the first flange forms a wall of the vapor pocket; and a second flange, wherein the second flange is configured to be movably disposed within a first groove of the source block.