Inventors:
Anthony F. Bernhardt - Berkeley CA
Robert J. Contolini - Livermore CA
Vincent Malba - Livermore CA
Robert A. Riddle - Tracy CA
Assignee:
Regents of the University of California - Oakland CA
International Classification:
H05K 334
Abstract:
A repairable, chip-to-board interconnect process which addresses cost and testability issues in the multi-chip modules. This process can be carried out using a chip-on-sacrificial-substrate technique, involving laser processing. This process avoids the curing/solvent evolution problems encountered in prior approaches, as well is resolving prior plating problems and the requirements for fillets.
For repairable high speed chip-to-board connection, transmission lines can be formed on the sides of the chip from chip bond pads, ending in a gull wing at the bottom of the chip for subsequent solder.