Inventors:
Robert Lyle Benner - Perkasie PA 18944
Stephen J. Benner - Lansdale PA 19446
Robert L. Benner - Chalfont PA 18914
International Classification:
B24B 1900
US Classification:
451443, 451444, 451 56, 451456, 451285
Abstract:
A system for conditioning rotatable polishing pads used to planarize and polish surfaces of thin film integrated circuits deposited on semiconductor wafer substrates, microelectronic, and optical system. The system has a pad conditioning apparatus, process fluids, a vacuum capability to pull waste material out of the conditioning pad, self-contained flushing means, and a piezo-electric device for vibrating the pad conditioning apparatus.