Richard L Butler
Electrician in Fort Collins, CO

6687836, Feb 3, 2004

Nov 26, 1999

09/449794

Richard M. Butler - Fort Collins CO

Hewlett-Packard Development Company, L.P. - Houston TX

H04L 932

713202, 713183

Upon input of a password to a computer, the password is subjected to a hashing function to generate an N-bit number. The N-bit number is divided into two smaller numbers that are used as indexes to retrieve objects from a list of objects. The retrieved objects are presented to a user, and the user is prompted to verify that the objects are recognizable as the objects which the user knows to be associated with their password. If the objects are verified as being recognizable, the password is accepted as a correct and intended input. Alternative embodiments of this method, and associated apparatus, are also disclosed.

6678707, Jan 13, 2004

Oct 30, 2000

09/699884

Richard M. Butler - Fort Collins CO

Hewlett-Packard Development Company, L.P. - Houston TX

G06F 102

708250

A random number is generated by periodically issuing an operating system call to retrieve values from a number of multiple input shift registers (MISRs) which are coupled to a number of microprocessor buses. The number of MISR readings are then stored in a temporary location, or a number of values based on the MISR readings are stored in a temporary location. A random number is then generated from the stored MISR readings or stored values.

7028192, Apr 11, 2006

Nov 6, 2003

10/703946

Richard M. Butler - Fort Collins CO, US

Hewlett-Packard Development Company, L.P. - Houston TX

H04K 1/00, H04L 9/00

713183, 713184, 713168, 726 2

Upon input of a password to a computer, the password is subjected to a hashing function to generate an N-bit number. The N-bit number is used as an index to retrieve at least one object from a list of objects. The retrieved objects are presented to a user, and the user is prompted to verify that the objects are recognizable as the objects which the user knows to be associated with their password. If the objects are verified as being recognizable, the password is accepted as a correct and intended input. Alternative embodiments of this method, and associated apparatus, are also disclosed.

5750422, May 12, 1998

Feb 24, 1995

8/394043

Louis Thomas Mills - Loveland CO
Richard M. Butler - Fort Collins CO
Havyn Eugene Bradley - Fort Collins CO

Hewlett-Packard Company - Palo Alto CA

H01L 2144

438112

An intergrated circuit package with plastic or glass reinforcement of leads to increase lead rigidity, to improve lead alignment and positional stability, and to prevent bent leads. The invention is particularly applicable to surface mount packages. For plastic packages, plastic between the leads is formed during molding of the plastic package. For metal packages, the plastic is molded as a separate operation. For ceramic packages with lead frames, glass may be formed as a separate operation or may be formed at the same time as a glass seal for the ceramic package. Reinforcement can optionally be thicker than the leads for increased rigidity. Optional extended lead lengths enable plastic or glass to be formed on either side of the soldered foot area of each lead. No changes to test fixtures or to pick and place equipment are required.

6989684, Jan 24, 2006

Dec 4, 2002

10/309967

Richard M. Butler - Fort Collins CO, US

Hewlett-Packard Development Company, L.P. - Houston TX

G01R 31/26

324765

The present invention includes a method for testing a chip, comprising the steps of measuring power drawn by the chip, calculating a test frequency using the measured power drawn by the chip, and determining performance of the chip at the calculated test frequency. The present invention also includes a system for testing a chip including a first sensor to measure power drawn by the chip, a controller to calculate a test frequency using the measured power drawn by the chip, and a second sensor to measure speed of the chip at the calculated test frequency.

5281851, Jan 25, 1994

Oct 2, 1992

7/955622

Louis T. Mills - Loveland CO
Richard M. Butler - Fort Collins CO
Havyn E. Bradley - Fort Collins CO

Hewlett-Packard Company - Palo Alto CA

H01L 2348

257670

An integrated circuit package with plastic or glass reinforcement of leads to increase lead rigidity, to improve lead alignment and positional stability, and to prevent bent leads. The invention is particularly applicable to surface mount packages. For plastic packages, plastic between the leads is formed during molding of the plastic package. For metal packages, the plastic is molded as a separate operation. For ceramic packages with lead frames, glass may be formed as a separate operation or may be formed at the same time as a glass seal for the ceramic package. Reinforcement can optionally be thicker than the leads for increased rigidity. Optional extended lead lengths enable plastic or glass to be formed on either side of the soldered foot area of each lead. No changes to test fixtures or to pick and place equipment are required.

7412468, Aug 12, 2008

Oct 14, 2003

10/686331

Richard M. Butler - Fort Collins CO, US

Hewlett-Packard Development Company, L.P. - Houston TX

G06F 1/02

708250

In one embodiment, values are retrieved from a number of MISRs which are coupled to a number of microprocessor buses, and a random number is generated based on the retrieved values. In another embodiment, a built-in self-test (BIST) local block of a microprocessor is assigned a major address, and each of a number of multiple input shift registers (MISRs) in the BIST local block is assigned a minor address. An instruction to turn on and initialize the MISRs is then issued, and a request to read the MISRs is issued in response to a request for an encryption key. The MISR readings are then XORed with each other, and with historical readings, if any, to generate an encryption key.