RICHARD KINGSLEY NELSON
Pilots at Pleasant Run Pl, Austin, TX

6437965, Aug 20, 2002

Nov 28, 2000

09/724292

Calvin L. Adkins - Malabar FL
David John Tammen - Satellite Beach FL
Michael Alan Gribbons - Mt. Laurel NJ
Jason D. Reed - West Hartford CT
Claude Hilbert - Austin TX
Richard D. Nelson - Austin TX

Harris Corporation - Melbourne FL

H01G 4005

361303, 3613061, 361290, 361287, 3613011

An electronic device, such as a filter or phase shifter, for example, includes a substrate, and a MEMS capacitor on the substrate and having a plurality of selectable capacitance values. The MEMS capacitor preferably includes a lower capacitor electrode on the substrate, and a movable bridge including end portions connected to the substrate laterally adjacent the lower capacitor electrode. The movable bridge may also include a conductive medial portion between the end portions defining an upper capacitor electrode suspended above the lower capacitor electrode and being movable between an upper position and a lower position by an electrostatic force generated between the capacitor electrodes. The upper and lower positions provide respective low and high selectable capacitance values. Moreover, the movable bridge may further include at least one travel limiting portion between the end portions for engaging adjacent substrate portions to keep the upper capacitor electrode in a predetermined spaced relation from the lower capacitor electrode when in the lower position.

6529377, Mar 4, 2003

Sep 5, 2001

09/946798

Richard D. Nelson - Austin TX
Anjan Somadder - Fremont CA

Microelectronic Computer Technology Corporation - Austin TX

H05K 720

361699, 2989003, 174252, 16510433, 361720, 361749

Systems and methods are described for integrated cooling system. A method includes: circulating a liquid inside a flexible multi-layer tape; and transporting heat between a heat source that is coupled to the flexible multi-layer tape and a heat sink that is coupled to the flexible multi-layer tape. A method includes installing a flexible multi-layer tape in an electrical system, wherein the flexible multi-layer tape includes a top layer; an intermediate, layer coupled to the top layer; and a bottom layer coupled to the intermediate layer, the intermediate layer defining a closed loop circuit for a circulating fluid. An apparatus includes a flexible multi-layer tape, including: a top layer; an intermediate layer coupled to the top layer; and a bottom layer coupled to the intermediate layer, wherein the intermediate layer defines a closed loop circuit for a circulating fluid.

6646215, Nov 11, 2003

Jun 29, 2001

09/895455

Richard D. Nelson - Austin TX

Teravicin Technologies, Inc. - Austin TX

B81B 700

200181, 333262

A device is provided which is adapted to electrostatically pull a cantilever away from a conductive pad. In particular, a microelectromechanical device is provided which includes a fulcrum contact structure interposed between two electrodes spaced under a cantilever and a conductive pad arranged laterally adjacent to one of the electrodes. The cantilever may be brought into contact with the conductive pad by residual forces within the cantilever and/or an application of a closing voltage to one of the electrodes. Such a device may be adapted bring the cantilever in contact with the fulcrum contact structure by applying an actuation voltage to the other of the electrodes. In addition, the actuation voltage may deflect the cantilever away from the conductive pad. In some cases, deflecting the cantilever from the conductive pad may include releasing the closing voltage and increasing the actuation voltage subsequent to the release of the closing voltage.

4882654, Nov 21, 1989

Dec 22, 1988

7/288363

Richard D. Nelson - Austin TX
Omkarnath R. Gupta - Englewood CO
Dennis J. Herrell - Austin TX

Microelectronics and Computer Technology Corporation - Austin TX

H01L 2334

361382

A fluid heat exchanger for mating with an electronic component is supported from a fixed support. A connection between the fixed support and the heat exchanger is initially flexible for adjusting the position of the heat exchanger to accommodate variations in the height or attitude of the electronic component for providing a good thermal interface. Thereafter, the connection changes to a rigid connection to provide good structural suppport for the heat exchanger which allows the support to withstand vibration or shock without overloading the electronic component. The flexibility of the connection may be reversible for later readjusting the position of the heat exchanger relative to the electronic component.

4821389, Apr 18, 1989

Dec 1, 1987

7/126648

Richard D. Nelson - Austin TX

Microelectronics and Computer Technology Corporation - Austin TX

B21D 5302

291573R

A pin fin heat exchanger is made by wrapping a thermally conductive wire having a coating thereon around a mandrel thereby forming a multilayer coil. The coating is fused together for holding the wires together. The method includes cutting a section out of the coil providing a plurality of generally parallel wires having first and second ends and placing the cut section between an object and a wall for transferring heat therebetween with the first ends engaging the object and the second ends engaging the wall. Thereafter the coating is removed from the wires such as by solvents. The ends of the wires may be soldered or may be lapped to provide a convex surface to provide good heat transfer.

4940085, Jul 10, 1990

Nov 27, 1989

7/441679

Richard D. Nelson - Austin TX
Omkarnath R. Gupta - Fremont CA
Dennis J. Herrell - Austin TX

Microelectronics and Computer Technology Corporation - Austin TX

H01L 2346

165 803

A high performance fluid heat exchanger for cooling an electronic component which includes a housing having a base, a plurality of parallel fins in the housing, a center fed inlet connected to the housing opposite the base for supplying cooling fluid towards the base and toward the ends of the fins. A plate is positioned between the tops and bottoms of the fins and extends generally parallel to the base and extends towards but is spaced from the ends of the fins for providing a double cooling pass against the fins.

5002123, Mar 26, 1991

Apr 19, 1990

7/511163

Richard D. Nelson - Austin TX
Dennis J. Herrell - Austin TX

Microelectronics And Computer Technology Corporation - Austin TX

F28F 1308

165147

A fluid heat exchanger for cooling an electronic component having a housing for receiving heat from the electronic component in which the housing has a fluid inlet and an outlet at opposite ends of the housing. The cross-sectional area of the housing for conveying fluid from the inlet to the outlet decreases from the inlet to the outlet thereby reducing pressure drop without sacrificing thermal performance. The cross-sectional area may be decreased by tilting a top of the housing relative to a bottom, or providing a plurality of fins separated by channels in which the cross-sectional area of the channels decreases from the inlet to the outlet.

RE40618, Jan 6, 2009

Mar 4, 2005

11/071898

Richard D. Nelson - Austin TX, US
Anjan Somadder - Fremont CA, US

Stovokor Technology LLC - Los Altos CA

H05K 7/20, H01L 23/36

361699, 361720, 361749, 2989003, 174252, 16510433

Systems and methods are described for integrated cooling system. A method includes: circulating a liquid inside a flexible multi-layer tape; and transporting heat between a heat source that is coupled to the flexible multi-layer tape and a heat sink that is coupled to the flexible multi-layer tape. A method includes installing a flexible multi-layer tape in an electrical system, wherein the flexible multi-layer tape includes a top layer; an intermediate, layer coupled to the top layer; and a bottom layer coupled to the intermediate layer, the intermediate layer defining a closed loop circuit for a circulating fluid. An apparatus includes a flexible multi-layer tape, including: a top layer; an intermediate layer coupled to the top layer; and a bottom layer coupled to the intermediate layer, wherein the intermediate layer defines a closed loop circuit for a circulating fluid.

5265321, Nov 30, 1993

Sep 22, 1992

7/949182

Richard D. Nelson - Austin TX
Michael A. Olla - Austin TX
Seyed H. Hashemi - Austin TX
Thomas P. Dolbear - Austin TX

Microelectronics And Computer Technology Corporation - Austin TX

H05K 720

29841

An integrated circuit structure and method of making in which the circuit has a plurality of metal heat exchanger elements spaced from each other with their first ends secured to the structure. The first ends may be adhesively secured to an integrated circuit chip or the underlying substrate, and the heat exchanger may be hermetically attached. The method uses a compliant removable support block for attaching the plurality of individual heat exchanger elements to integrated circuit structures having variations in their elevation.