RICHARD HARRIS, PSYD
Psychologist at Piper St, Anchorage, AK

6806440, Oct 19, 2004

Mar 12, 2002

10/096629

Yunlong Sun - Beaverton OH
Richard S. Harris - Portland OR

Electro Scientific Industries, Inc. - Portland OR

B23K 2638

21912171, 21912161

A quasi-CW diode- or lamp-pumped, A-O Q-switched solid-state UV laser system ( ) synchronizes timing of the quasi-CW pumping with movement of the positioning system ( ) to reduce pumping while the positioning system ( ) is moving from one target area ( ) to the next target area ( ) to form multiple vias in a substrate at a high throughput. Thus, the available UV power for via formation is higher even though the average pumping power to the laser medium ( ), and thermal loading of the laser pumping diodes ( ), remains the same as that currently available through conventional CW pumping with conventionally available laser pumping diodes ( ). The quasi-CW pumping current profile can be further modified to realize a preferred UV pulse amplitude profile.

7133182, Nov 7, 2006

May 25, 2005

11/138657

Jay Johnson - Portland OR, US
David Watt - Newark CA, US
Brian Baird - Oregon City OR, US
Richard Harris - Portland OR, US

Electro Scientific Industries, Inc. - Portland OR

G02F 1/11, B23K 26/00, G02F 1/33, H01S 3/10

359285, 21912161, 2191216, 359305, 359310, 372 26

Digital control of frequency and/or amplitude modulation techniques of an intracavity and/or extracavity AOM () facilitate substantially full extinction of a laser beam () to prevent unwanted laser energy from impinging a workpiece (); facilitate laser pulse amplitude stability through closed-loop control of pulse-to-pulse laser energy; facilitate beam-positioning control including, but not limited to, closed-loop control for applications such as alignment error correction, beam walk rectification, or tertiary positioning; and facilitate employment of more than one transducer on an AOM () to perform any of the above-listed applications.

7633034, Dec 15, 2009

Feb 4, 2005

11/051261

Kelly J. Bruland - Portland OR, US
Brian W. Baird - Oregon City OR, US
Ho Wai Lo - Portland OR, US
Richard S. Harris - Portland OR, US
Yunlong Sun - Beaverton OR, US

Electro Scientific Industries, Inc. - Portland OR

B23K 26/00

21912168, 21912169, 21912167

Methods and systems use laser pulses to process a selected structure on or within a semiconductor substrate. The structure has a surface, a width, and a length. The laser pulses propagate along axes that move along a scan beam path relative to the substrate as the laser pulses process the selected structure. The method simultaneously generates on the selected structure first and second laser beam pulses that propagate along respective first and second laser beam axes intersecting the selected structure at distinct first and second locations. The first and second laser beam pulses impinge on the surface of the selected structure respective first and second beam spots. Each beam spot encompasses at least the width of the selected link. The first and second beam spots are spatially offset from one another along the length of the selected structure to define an overlapping region covered by both the first and the second beam spots and a total region covered by one or both of the first and second beam spots. The total region is larger than the first beam spot and also larger than the second beam spot.

RE43605, Aug 28, 2012

Jan 9, 2009

12/351562

James N. O'Brien - Bend OR, US
Yunlong Sun - Beaverton OR, US
Kevin P. Fahey - Portland OR, US
Michael J. Wolfe - Portland OR, US
Brian W. Baird - Oregon City OR, US
Richard S. Harris - Portland OR, US

Electro Scientific Industries, Inc. - Portland OR

B23K 26/04, C04B 41/91

264400, 264482, 21912162, 21912167, 21912169, 2191218, 21912181

UV laser cutting throughput through silicon and like materials is improved by dividing a long cut path () into short segments (), from about 10 μm to 1 mm. The laser output () is scanned within a first short segment () for a predetermined number of passes before being moved to and scanned within a second short segment () for a predetermined number of passes. The bite size, segment size (), and segment overlap () can be manipulated to minimize the amount and type of trench backfill. Real-time monitoring is employed to reduce rescanning portions of the cut path (112) where the cut is already completed. Polarization direction of the laser output () is also correlated with the cutting direction to further enhance throughput. This technique can be employed to cut a variety of materials with a variety of different lasers and wavelengths. A multi-step process can optimize the laser processes for each individual layer.

2006014, Jun 29, 2006

Feb 22, 2006

11/360965

Yunlong Sun - Beaverton OR, US
Edward Swenson - Portland OR, US
Richard Harris - Portland OR, US

H01L 21/82

438132000, 438281000, 438601000

A set () of laser pulses () is employed to sever a conductive link () in a memory or other IC chip. The duration of the set () is preferably shorter than 1,000 ns; and the pulse width of each laser pulse () within the set () is preferably within a range of about 0.1 ps to 30 ns. The set () can be treated as a single “pulse” by conventional laser positioning systems () to perform on-the-fly link removal without stopping whenever the laser system () fires a set () of laser pulses () at each link (). Conventional IR wavelengths or their harmonics can be employed.

2006013, Jun 22, 2006

Nov 23, 2005

11/286305

Yunlong Sun - Beaverton OR, US
Edward Swenson - Portland OR, US
Richard Harris - Portland OR, US

H01L 21/82

438132000, 438601000, 438281000

A set () of laser pulses () is employed to sever a conductive link () in a memory or other IC chip. The duration of the set () is preferably shorter than 1,000 ns; and the pulse width of each laser pulse () within the set () is preferably within a range of about 0.1 ps to 30 ns. The set () can be treated as a single “pulse” by conventional laser positioning systems () to perform on-the-fly link removal without stopping whenever the laser system () fires a set () of laser pulses () at each link (). Conventional IR wavelengths or their harmonics can be employed.

2006011, Jun 1, 2006

Nov 30, 2004

11/001486

Yunlong Sun - Beaverton OR, US
Richard Harris - Portland OR, US

H01S 3/10

372022000, 372021000

A wavelength converter () such as a nonlinear crystal has an angle cut exit surface () to separate a harmonic wavelength from a fundamental or different harmonic wavelength. A solid optical overlay medium () has an entrance surface () that is angle cut to mate with the converter exit surface (). The optical overlay medium () is substantially transparent to the fundamental and selected harmonic wavelengths, has a refractive index similar to that of the wavelength converter (), and has damage thresholds at the selected wavelengths that are greater than the respective damage thresholds of the wavelength converter ().

2006013, Jun 29, 2006

Nov 30, 2005

11/291523

Yunlong Sun - Beaverton OR, US
Edward Swenson - Portland OR, US
Richard Harris - Portland OR, US

B23K 26/00

219121600

A set () of laser pulses () is employed to sever a conductive link () in a memory or other IC chip. The duration of the set () is preferably shorter than 1,000 ns; and the pulse width of each laser pulse () within the set () is preferably within a range of about 0.1 ps to 30 ns. The set () can be treated as a single “pulse” by conventional laser positioning systems () to perform on-the-fly link removal without stopping whenever the laser system () fires a set () of laser pulses () at each link (). Conventional IR wavelengths or their harmonics can be employed.

2006013, Jun 29, 2006

Feb 22, 2006

11/360094

Yunlong Sun - Beaverton OR, US
Edward Swenson - Portland OR, US
Richard Harris - Portland OR, US

B23K 26/16

219121690

A set () of laser pulses () is employed to sever a conductive link () in a memory or other IC chip. The duration of the set () is preferably shorter than 1,000 ns; and the pulse width of each laser pulse () within the set () is preferably within a range of about 0.1 ps to 30 ns. The set () can be treated as a single “pulse” by conventional laser positioning systems () to perform on-the-fly link removal without stopping whenever the laser system () fires a set () of laser pulses () at each link (). Conventional IR wavelengths or their harmonics can be employed.