RICHARD H MORRISON
Broker in Taunton, MA

5490034, Feb 6, 1996

Mar 5, 1993

8/027249

Paul M. Zavracky - Norwood MA
Richard H. Morrison - Taunton MA

Kopin Corporation - Tautnon MA

H01G 700

3612834

The present invention relates to the fabrication of diaphragm pressure sensors utilizing silicon-on-insulator technology where recrystallized silicon forms a diaphragm which may incorporate electronic devices used in monitoring pressure. The diaphragm is alternatively comprised of a silicon nitride having the necessary mechanical properties with a recrystallized silicon layer positioned thereon to provide sensor electronics.

8279026, Oct 2, 2012

Sep 18, 2009

12/562390

Sumit Majumder - Malden MA, US
Kenneth Skrobis - Maynard MA, US
Richard H. Morrison - Taunton MA, US
Geoffrey Haigh - Boxford MA, US

Analog Devices, Inc. - Norwood MA

H01H 51/22

335 78, 200181

An improved micro-machined relay is disclosed. The relay includes a micro-machined beam capable of carrying an electric signal and having a contact point on a closure side of the beam. The beam is electrically coupled to a first electrical transmission path and suspended above a second electrical transmission path. An insulation layer resides on a portion of the closure side of the beam and an electrical conductor is coupled to a least a portion of the insulation layer. A potential creator creates a potential between the electrical conductor and the potential creator that is capable of deflecting the beam, so that the contact point comes into contact with the second electrical transmission path. In such an embodiment, the potential creator need not account for the possible signal in the transmission path because the potential creator, which may be a voltage source, is decoupled from the transmission path.

4674180, Jun 23, 1987

May 1, 1984

6/606065

Paul M. Zavracky - Norwood MA
Richard H. Morrison - Taunton MA

The Foxboro Company - Foxboro MA

H01H 1100, H01H 1104

29622

A micromechanical electric shunt is fabricated by micromachining according to recent IC fabrication procedures. A plurality of such shunts is incorporated on a single substrate to form novel process station or post identification or signature encoding apparatus for use on a telecommunications bus or the equivalent. Such identification of signature encoding apparatus may be configured for conventional binary coding. Both frequency and current derivative mode apparatus are disclosed.

5493470, Feb 20, 1996

Dec 18, 1992

7/993096

Paul M. Zavracky - Norwood MA
Richard H. Morrison - Taunton MA

Kopin Corporation - Taunton MA

H01G 700, H01L 2702

3612834

The present invention relates to the fabrication of diaphragm pressure sensors utilizing silicon-on-insulator technology where recrystallized silicon forms a diaphragm which incorporates electronic devices used in monitoring pressure. The diaphragm is alternatively comprised of a silicon nitride having the necessary mechanical properties with a recrystallized silicon layer positioned thereon to provide sensor electronics.

4959515, Sep 25, 1990

Feb 6, 1987

7/012092

Paul M. Zavracky - Norwood MA
Richard H. Morrison - Taunton MA

The Foxboro Company - Foxboro MA

H01H 5700

200181

A micromechanical electric shunt is fabricated by micromachining according to recent IC fabrication procedures. A plurality of such shunts is incorporated on a single substrate to form novel process station or post identification or signature encoding apparatus for use on a telecommunications bus or the equivalent. Such identification of signature encoding apparatus may be configured for conventional binary coding. Both frequency and current derivative mode apparatus are disclosed.

2002008, Jul 11, 2002

Apr 27, 2001

09/844251

Richard Morrison - Taunton MA, US
Nicol McGruer - Dover MA, US
Jeffrey Hopwood - Needham MA, US

H01H011/00, H01H011/02

029/622000, 029/846000

Processes for preparing contacts on microswitches have been invented. The first is a wet process, involving the use of one or more acids, bases and peroxides, in some formulations diluted in water, to flush the contacts. The second process involves exposing the contacts to plasmas of various gases, including (1) oxygen, (2) a mixture of carbon tetrafluoride and oxygen, or (3) argon.

2003010, Jun 5, 2003

Oct 15, 2002

10/270872

John Martin - Foxborough MA, US
Richard Morrison - Taunton MA, US

H01L023/12, H01L021/44, H01L021/48, H01L021/50

257/704000

An in-situ cap for an integrated circuit device such as a micromachined device and a method of making such a cap by fabricating an integrated circuit element on a substrate; forming a support layer over the integrated circuit element and forming a cap structure in the support layer covering the integrated circuit element.

2006023, Oct 19, 2006

Jan 26, 2006

11/339997

Sumit Majumder - Malden MA, US
Kenneth Skrobis - Maynard MA, US
Richard Morrison - Taunton MA, US
Geoffrey Haigh - Boxford MA, US

H01H 51/22

335078000

An improved micro-machined relay is disclosed. The relay includes a micro-machined beam capable of carrying an electric signal and having a contact point on a closure side of the beam. The beam is electrically coupled to a first electrical transmission path and suspended above a second electrical transmission path. An insulation layer resides on a portion of the closure side of the beam and an electrical conductor is coupled to a least a portion of the insulation layer. A potential creator creates a potential between the electrical conductor and the potential creator that is capable of deflecting the beam, so that the contact point comes into contact with the second electrical transmission path. In such an embodiment, the potential creator need not account for the possible signal in the transmission path because the potential creator, which may be a voltage source, is decoupled from the transmission path.

4764244, Aug 16, 1988

Jun 11, 1985

6/743255

Gordon W. Chitty - Norfolk MA
Richard H. Morrison - Taunton MA
Everett O. Olsen - Wrentham MA
John G. Panagou - Attleboro MA
Paul M. Zavracky - Norwood MA

The Foxboro Company - Foxboro MA

H01L 21306, B44C 122, C03C 1500, C23F 102

156630

Microminiature resonant sensor structures are prepared according to micromachining/microfabrication techniques, which structures include thin-film deposits of piezoelectric materials. Such piezoelectric deposits may be excited electrically by including metallized conductive paths during fabrication, or optically. The resonant frequency of the sensor structure is varied by subjecting it to a physical variable, or measurand, such as pressure, temperature, flow rate, etc. Similarly, the resonant frequency of the devices may be detected electrically or optically. The microminiature resonant structures include ribbons and wires, hollow beam and cantilevered hollow beams, and single- and double-ended double beam resonant structures such as tuning forks.

7075393, Jul 11, 2006

Oct 27, 2003

10/694262

Sumit Majumder - Malden MA, US
Kenneth Skrobis - Maynard MA, US
Richard H. Morrison - Taunton MA, US

Analog Devices, Inc. - Norwood MA

H01H 51/22

335 78, 200181

A micromechanical relay is made by surface micromachining techniques. It includes a metallic cantilever beam deflectable by an electrostatic field and a beam contact connected to the beam and electrically insulated from the beam by an insulating segment. During operation, the beam deflects, and the beam contact establishes an electrical contact between two drain electrodes.