RANDALL L JOHNSON
Electrician at Oakwick Ln, Houston, TX
License number
Texas 153360
Expiration Date
Feb 3, 2018
Category
Apprentice Electrician
Address
Address
14118 Oakwick Ln, Houston, TX 77044
Phone
(832) 853-6147
Professional information
Operations Manager At Compucom
Position:
Sr. Operations Manager at CompuCom
Location:
Houston, Texas Area
Industry:
Information Technology and Services
Work:
CompuCom
- Houston, Texas Area since 1999
-
Sr. Operations Manager
CompuCom
- Houston, Texas Area 2002 - 2006
-
Operations Manager / Managed Services Director
CompuCom
- Houston, Texas Area 1999 - 2002
-
Service Delivery Manager
BP
- Houston, Texas Area 1994 - 1999
-
Senior IT Consultant
Education:
Texas Tech University
Three Dimensional Assembly Of Integrated Circuit Chips
US Patent:
5327327, Jul 5, 1994
Filed:
Oct 30, 1992
Appl. No.:
7/969602
Inventors:
Dean L. Frew - Garland TX
Mark A. Kressley - Richardson TX
Arthur M. Wilson - Richardson TX
Juanita G. Miller - Richardson TX
Philip E. Hecker - Garland TX
James Drumm - Crystal Lake IL
Randall E. Johnson - Houston TX
Rick Elder - Houston TX
Mark A. Kressley - Richardson TX
Arthur M. Wilson - Richardson TX
Juanita G. Miller - Richardson TX
Philip E. Hecker - Garland TX
James Drumm - Crystal Lake IL
Randall E. Johnson - Houston TX
Rick Elder - Houston TX
Assignee:
Texas Instruments Incorporated - Dallas TX
International Classification:
H05K 111
US Classification:
361784
Abstract:
The multi-chip circuit module of the invention comprises a plurality of circuit chips assembled in a laminated stack. Each chip includes a plurality of layers of thin film interconnect patterns in the normal configuration, except for the final layer or layers, which comprise a reroute pattern that locates all circuit input and output pads along a single edge of each chip. The relocated pads are provided with contact bumps to facilitate the addition of a bonded lead to each I/O pad extending therefrom to a point beyond the edge of each chip. Thus, upon lamination the protruding tips form an array of leads on a single lateral face of the laminated chip stack.