RANDALL JONES
Architects at 5 Ave, Seattle, WA
License number
Alaska AELM11972
Issued Date
Jun 3, 2008
Effective Date
Dec 23, 2015
Expiration Date
Dec 31, 2017
Category
Architects, Engineers and Land Surveyors
Address
Address
10202 5Th Ave NE SUITE 102, Seattle, WA 98125
Personal information
See more information about RANDALL JONES at radaris.comName
Address
Phone
4506 Linden Ave N, Seattle, WA 98103
53 Atlantic Ave, Aberdeen, WA 98520
Professional information
Principal, Kdw Ps
Position:
Principal, Mechanical Engineer at KDW Architecture/Engineering
Location:
Greater Seattle Area
Industry:
Architecture & Planning
Work:
KDW Architecture/Engineering
since Oct 2005
-
Principal, Mechanical Engineer
Abacus Engineered Systems
1991 - 2005
-
Mechanical Engineer
Surface Force Distribution Sensor By Frequency-Domain Multiplexing
US Patent:
8266971, Sep 18, 2012
Filed:
Nov 24, 2009
Appl. No.:
12/592456
Inventors:
Randall E. Jones - Seattle WA, US
International Classification:
G01D 7/00
US Classification:
73862046
Abstract:
One embodiment of a surface force distribution sensor includes an elastic dielectric () sandwiched by a first plurality of compliant, conductive carrier elements () and a second plurality of conductive pickup elements (), as well as a system for frequency-domain demultiplexing including at least a microprocessor (). A plurality of signals is generated, each of which has a different fundamental frequency and is connected to a different carrier element. The pickup and carrier elements are arranged so that each pickup element overlaps one or more carrier elements. When forces are applied to a nonconductive compliant layer (), the distance between one or more carrier elements and one or more pickup elements decreases at their points of overlap, increasing the amplitude of carrier signals capacitively transmitted to the pickup elements. The microprocessor demultiplexes the signals received from the pickup elements to determine the amplitude of each carrier signal received, and thereby the applied force, at each point of overlap on the surface of the compliant layer. Other embodiments are described and shown.