Inventors:
Huanbo Zhang - San Jose CA, US
Garrett Ho Yee Sin - Sunnyvale CA, US
King Yi Heung - Santa Clara CA, US
Nathan Bohannon - Saratoga CA, US
Qing Zhang - San Jose CA, US
International Classification:
G06F 19/00
Abstract:
Values are selected for a plurality of controllable parameters of a chemical mechanical polishing system that includes a carrier head with a plurality of zones to apply independently controllable pressures on a substrate. Data is stored relating variation in removal profile on a front surface of the substrate to variation in the controllable parameters, the data including removal at a plurality of positions on the front surface of the substrate, there being a greater number of positions than chambers. A value is determined for each parameter of the plurality of controllable parameters to minimize a difference between a target removal profile and an expected removal profile calculated from the data relating variation in removal profile on a front surface of the substrate to variation in the parameters. The value for each parameter of the plurality of controllable parameters is stored.