PHONG NGUYEN
Pharmacy at 112 Ct, Vancouver, WA

License number
Washington PH60495663
Category
Pharmacy
Type
Pharmacist
Address
Address
6600 NE 112Th Ct STE 103, Vancouver, WA 98662
Phone
(360) 694-7377

Personal information

See more information about PHONG NGUYEN at radaris.com
Name
Address
Phone
Phong Nguyen, age 64
5727 S Cooper St, Seattle, WA 98118
(206) 851-4705
Phong Nguyen, age 70
5709 W Mercer Way, Mercer Island, WA 98040

Professional information

Phong Nguyen Photo 1

Non-Intrusive Pellicle Height Measurement System

US Patent:
6346986, Feb 12, 2002
Filed:
Mar 14, 2000
Appl. No.:
09/524999
Inventors:
Phong T. Nguyen - Vancouver WA
Assignee:
Wafertech, Inc. - Camas WA
International Classification:
G01B 1124
US Classification:
356601, 356609, 250205, 25055945, 25055946, 25055947
Abstract:
A method to monitor a dimension of a pellicle includes projecting a first light signal against a surface of the pellicle. A second light signal reflected from the surface of the pellicle is detected, with the second light signal being a representation of the first light signal. The method determines if the dimension of the pellicle is within an allowable value based on a characteristic of the detected second light signal. The characteristic of the detected second light signal can include time periods between pulses of the detected second light signal, an intensity of the detected second light signal, or a positional displacement of the detected second light signal.


Phong Nguyen Photo 2

Non-Intrusive Pellicle Height Measurement System

US Patent:
6459491, Oct 1, 2002
Filed:
Jul 12, 2001
Appl. No.:
09/904870
Inventors:
Phong T. Nguyen - Vancouver WA
Assignee:
Wafer Tech - Camas WA
International Classification:
G01N 2100
US Classification:
356604, 3562371
Abstract:
A method to monitor a dimension of a pellicle includes projecting a first light signal against a surface of the pellicle. A second light signal reflected from the surface of the pellicle is detected, with the second light signal being a representation of the first light signal. The method determines if the dimension of the pellicle is within an allowable value based on a characteristic of the detected second light signal. The characteristic of the detected second light signal can include time periods between pulses of the detected second light signal, an intensity of the detected second light signal, or a positional displacement of the detected second light signal.


Phong Nguyen Photo 3

Automatic In Situ Pellicle Height Measurement System

US Patent:
6778285, Aug 17, 2004
Filed:
Jan 21, 2000
Appl. No.:
09/489461
Inventors:
Phong Nguyen - Vancouver WA
Ming-Chun Chou - Vancouver WA
Marvin Mills - Washougal WA
Assignee:
Wafertech, Inc. - Camas WA
International Classification:
G01C 1112
US Classification:
356630
Abstract:
A method for measuring a thickness of a photolithography element, such as a pellicle, includes projecting a light beam from a first side of the pellicle and at a plane above a first surface of the pellicle, projecting the light beam from the first side of the pellicle and at a plane corresponding to a plane of the pellicle, and projecting the light beam from the first side of the pellicle and at a plane below a second surface of the pellicle. The light beam can be projected from a laser light source. The light beams are projected at different media above and below the pellicle. The light beams pass through the first side of the different media and exit at a second side opposite to the first side at different intensities. The light beam may not pass through the pellicle if the light beam is incident to an opaque pellicle frame, and thus has minimal intensity at the second side. The resulting intensity of the projected light beams is detected at the second side by a detector, and an index corresponding to each detected resulting intensity is generated.


Phong Nguyen Photo 4

Wafer Stage Position Calibration Method And System

US Patent:
7142314, Nov 28, 2006
Filed:
Nov 19, 2003
Appl. No.:
10/716814
Inventors:
Phong T. Nguyen - Vancouver WA, US
Stephen L. Hill - Vanvouver WA, US
Nadja Orlova - Vancouver WA, US
Assignee:
Wafertech, LLC - Camas WA
International Classification:
G01B 11/14
US Classification:
356620
Abstract:
A method of calibrating a positioning stage includes placing a substrate on the positioning stage. The substrate has a contrast film above a portion of the substrate. At least one pattern is at a predetermined location above the substrate, corresponding to a predetermined location on the positioning stage if the positioning stage has zero offset from a registration position. A beam is applied to a position where the pattern on the substrate would be located if the positioning stage has zero offset. At least one of the group consisting of reflected, transmitted and scattered portions of the beam is measured. Whether the positioning stage has a non-zero offset is detected based on the measured portion of the beam.