PHILLIPS CAMPBELL BAIRD
Pilots at Southworth St, Middleboro, MA
License number
Massachusetts A0075213
Issued Date
Jan 2016
Expiration Date
Jan 2018
Category
Airmen
Type
Authorized Aircraft Instructor
Address
Address
11 Southworth St, Middleboro, MA 02347
Personal information
See more information about PHILLIPS CAMPBELL BAIRD at radaris.comName
Address
Phone
Middleboro, MA
11 Southworth St, Lakeville, MA 02347
Professional information
See more information about PHILLIPS CAMPBELL BAIRD at trustoria.com
Microwave Chip Carrier
Microwave Chip Carrier
US Patent:
4487999, Dec 11, 1984
Filed:
Jan 10, 1983
Appl. No.:
6/457112
Inventors:
Phillips C. Baird - Lakeville MA
Jay S. Greenspan - South Dartmouth MA
Jay S. Greenspan - South Dartmouth MA
Assignee:
Isotronics, Inc. - New Bedford MA
International Classification:
H05K 504
US Classification:
174 52S
Abstract:
An all-metal microwave chip carrier is provided with subminiature ceramic feedthroughs, each configured to function as a coaxial cable having a predetermined impedance. In one embodiment, the feedthroughs are formed by providing ceramic tubing metallized inside and out in which the ends are cut away to provide half-cylindrical bonding pads. In order to permit bonding directly to the feedthrough, a flat wire lead is soldered to the channel in the ceramic tube, with the ends of the flat wire extending onto the flat portions of the half-cylindrical portions of the feedthrough. In one embodiment, the chip carrier includes a base, ring, and stepped lid, all of Kovar or other suitable material, with the lid being weldable to the ring rather than being brazed or soldered.
System For Packaging Of Electronic Circuits
System For Packaging Of Electronic Circuits
US Patent:
4451540, May 29, 1984
Filed:
Aug 30, 1982
Appl. No.:
6/413169
Inventors:
Phillips C. Baird - Lakeville MA
Raymond J. Duff - South Dartmouth MA
Raymond J. Duff - South Dartmouth MA
Assignee:
Isotronics, Inc. - New Bedford MA
International Classification:
H01L 2302
US Classification:
428615
Abstract:
A brazing technique is described for providing a standard flat pack with a Thermkon base brazed to a Kovar frame through the utilization of an intermediary ring of high thermal conductivity material which prevents flashing onto the Thermkon base. Brazing is accomplished either in a one-step process in which the parts with the intermediary ring are brazed together all at one time with a single heat treatment, or in a two-step process in which the intermediary ring is first brazed to the frame. In a subsequent step, the frame with the intermediary ring brazed thereto, is brazed to the Thermkon base. In either process, the high thermal conductivity of the intermediary ring permits the ring to quickly reach brazing temperature for minimizing flashing.