PETER VERNE LOEPPERT
Pilots at Hauley Rd, Durand, IL
License number
Illinois A4712527
Category
Airmen
Type
Authorized Aircraft Instructor
Address
Address
13804 Hauley Rd, Durand, IL 61024
Professional information
Sensitivity Adjustment Apparatus And Method For Mems Devices
US Patent:
2013004, Feb 21, 2013
Filed:
Aug 16, 2012
Appl. No.:
13/586999
Inventors:
Jordan T. Schultz - Chicago IL, US
Weiwen Dai - Elgin IL, US
Peter V. Loeppert - Durand IL, US
Weiwen Dai - Elgin IL, US
Peter V. Loeppert - Durand IL, US
International Classification:
H04R 3/00
US Classification:
381111
Abstract:
A microelectromechanical (MEMS) microphone includes a MEMS motor and a gain adjustment apparatus. The MEMS motor includes at least a diaphragm and a charge plate and is configured to receive sound energy and transform the sound energy into an electrical signal. The gain adjustment apparatus has an input and an output and is coupled to the MEMS motor. The gain adjustment apparatus is configured to receive the electrical signal from the MEMS motor at the input and adjust the gain of the electrical signal as measured from the output of the gain adjustment apparatus. The amount of gain is selected so as to obtain a favorable sensitivity for the microphone.
Back Plate Apparatus With Multiple Layers Having Non-Uniform Openings
US Patent:
2013034, Dec 26, 2013
Filed:
Jun 6, 2013
Appl. No.:
13/911696
Inventors:
Peter V. Loeppert - Durand IL, US
Assignee:
Knowles Electronics, LLC - Itasca IL
International Classification:
H04R 1/00
US Classification:
381174
Abstract:
An acoustic microphone includes a back plate, a diaphragm, and a microelectromechanical system (MEMS) structure that is coupled to the back plate and the diaphragm. The MEMS structure is disposed on a substrate. The back plate includes a first layer and a second layer that are disposed in generally parallel relation to each other. The first layer including a first opening with a first sizing and the second layer including a second opening with a second sizing. The first sizing is different from the second sizing. The first opening and the second opening form a channel through the back plate.
Microphone Assembly
US Patent:
2014006, Mar 6, 2014
Filed:
Jul 30, 2013
Appl. No.:
13/954223
Inventors:
John B. Szczech - Schaumburg IL, US
Gregory B. Servis - Bloomingdale IL, US
Peter Van Kessel - Downers Grove IL, US
Peter V. Loeppert - Durand IL, US
Gregory B. Servis - Bloomingdale IL, US
Peter Van Kessel - Downers Grove IL, US
Peter V. Loeppert - Durand IL, US
Assignee:
KNOWLES ELECTRONICS, LLC - Itasca IL
International Classification:
H04R 1/04
US Classification:
381361
Abstract:
A microphone assembly includes a cover, a substrate, at least one wall disposed and between and attached to the cover and the substrate, an acoustic transducer acoustically sealed to the lid, and an interposer. The interposer and the acoustic transducer are electrically connected without using the lid as an electrical conduit. The transducer and interposer are disposed one above the other and the transducer is supported by the interposer or by a pedestal.