DR. PETER ARTHUR BURKE, D.O.
Osteopathic Medicine at Ogletown Stanton Rd, Newark, DE
License number
Delaware C2-0009881
Category
Osteopathic Medicine
Type
Internal Medicine
License number
Delaware C2-0009881
Category
Osteopathic Medicine
Type
Hospitalist
Address
Address
4755 Ogletown Stanton Rd, Newark, DE 19718
Phone
(315) 269-4842
Professional information
Dr. Peter A Burke, Newark DE - DO (Doctor of Osteopathic Medicine)
Specialties:
Hospital Medicine
Address:
4755 Ogletown Stanton Rd, Newark 19718
(315) 269-4842 (Phone), (302) 733-3166 (Fax)
501 W 14Th St, Wilmington 19801
(302) 428-4411 (Phone), (302) 428-4667 (Fax)
(315) 269-4842 (Phone), (302) 733-3166 (Fax)
501 W 14Th St, Wilmington 19801
(302) 428-4411 (Phone), (302) 428-4667 (Fax)
Languages:
English
Peter Arthur Burke, Newark DE
Specialties:
Internist
Address:
4755 Ogletown Stanton Rd, Newark, DE 19718
Method For Determining The Efficiency Of A Planarization Process
US Patent:
6057068, May 2, 2000
Filed:
Dec 4, 1998
Appl. No.:
9/205483
Inventors:
Christopher H. Raeder - Austin TX
Thomas Brown - Austin TX
Peter A. Burke - Newark DE
Thomas Brown - Austin TX
Peter A. Burke - Newark DE
Assignee:
Advanced Micro Devices, Inc. - Austin TX
International Classification:
G03F 900
US Classification:
430 30
Abstract:
A method for measuring the planarization efficiency of a planarization process and a device for use with the method are provided. The device may be a substrate having a set of isolated features, such as trenches or hills, with different widths. In the method, a removable layer of material is formed over the substrate. The substrate features form corresponding features in the removable layer with varying dimensions. A pre-planarization thickness of the removable layer of material is measured at each feature and at one or more of isolation areas. The removable layer of material is then planarized using a planarization process associated with one or more process parameters. A post-planarization thickness of the removable is measured at each feature and at one or more of the isolation regions. The planarization efficiency of the planarization process is then determined as a function of the dimensions of the substrate features or corresponding features in the removable layers and/or one or more process parameters. The determined planarization efficiency may be output by, for example, generating a graph of the planarization efficiency or using the planarization efficiency to change one or more parameters of the planarization process.
Apparatuses And Methods For Polishing Semiconductor Wafers
US Patent:
6093085, Jul 25, 2000
Filed:
Sep 8, 1998
Appl. No.:
9/149166
Inventors:
Bradley J. Yellitz - Austin TX
Peter A. Burke - Newark DE
Peter A. Burke - Newark DE
Assignee:
Advanced Micro Devices, Inc. - Austin TX
International Classification:
B24B 2900
US Classification:
451 41
Abstract:
The present disclosure relates to a polishing pad including a pad structure having at least first and second polishing regions defined along a polishing surface of the pad structure. The first polishing region of the pad structure is less compressible than the second polishing region of the pad structure. The present disclosure also relates to a polish platen including a platen structure having at least first and second regions adapted for supporting a polishing pad. The first region of the platen structure is less compressible than the second region of the platen structure.