PENG CHEN
Pilots at Yorkshire Dr, Phoenix, AZ

Sr. Packaging Engineer at Intel Corporation

Electrical/Electronic Manufacturing

Intel Corporation - Chandler AZ since Aug 2013 - Sr. Packaging Engineer Brown University - Providence, Rhode Island Area Sep 2008 - Jun 2013 - Research Assistant Dassault Systemes Simulia Corp. - Providence, Rhode Island Area Jun 2011 - Aug 2011 - Intern Xi'an Jiaotong University - Xi'an, China Sep 2004 - Jun 2007 - Research Assistant

Brown University 2007 - 2013
PhD, Solid Mechanics Brown University 2010 - 2011
Master of Science, Applied Mathematics Xi'an Jiaotong University 2004 - 2007
Master of Science, Solid Mechanics Xi'an Jiaotong University 2000 - 2004
Bachelor, Engineering Mechanics

William N. Findley Award for Best Graduate Student Paper on the Mechanical Behavior of Materials
School of Engineering, Brown University
First Prize in the Poster Competition
New England Mechanics Community
at New England Workshop on the Mechanics of Materials and Structures
National Science Foundation (NSF) Student Fellowship
NSF
for Division of Civil, Mechanical and Manufacturing Innovation Grantees Conference
Brown University Graduate Fellowship
Brown University