PAUL STEVENSON
Nursing at Astrozon Blvd 315F, Colorado Springs, CO

6791210, Sep 14, 2004

Jun 20, 2002

10/175763

Paul E. Stevenson - Colorado Springs CO
Jon E. Tourville - Colorado Springs CO

Intel Corporation - Santa Clara CA

H02M 306

307109, 307110, 320166

A power delivery apparatus, system may include a series-connected plurality of energy storage devices, a voltage sensor to sense a supply voltage across a load coupled to a selected one of the plurality of storage devices, and a switch to couple and decouple various ones of the series-connected plurality of energy storage devices from the load when the supply voltage is less than or equal to a reference voltage. An article, including a machine-accessible medium, capable of directing a machine to carry out a method of delivering power may include data which directs the machine to couple each one of a series-connected plurality of energy storage elements to a power source, couple a selected one of the plurality of storage elements to a load, discharge a selected amount of energy from the selected one of the series-connected plurality of storage elements into the load, and decouple the selected one of the series-connected plurality of storage elements from the load.

7859317, Dec 28, 2010

Apr 16, 2008

12/104386

Paul E. Stevenson - Colorado Springs CO, US
Nathan Enger - Colorado Springs CO, US
Jon E. Tourville - Colorado Springs CO, US

Marvell International Ltd. - Hamilton

H03K 5/12

327170, 327184, 327291

Clock generation circuitry is arranged in stages so as to convert a slow slew rate input signal into a high slew rate clock signal in a low power environment. Each stage includes a capacitor and an inverter, both fed by respective current mirrors. The capacitor is trickle-charged through its current mirror, and charge of the capacitor is dumped onto an output of the stage at a controlled timing. Two or more such stages may be provided, so as to improve the slew rate of both of the leading and trailing edges of the clock signal, and also so as to provide a convenient source of timing for dumping charge of each capacitor. Each stage might also include a diode switchably connected across the capacitor, so as to discharge the capacitor at appropriate timings, to reduce interference on succeeding stages that might otherwise be caused by residual charge on the capacitor.

5731520, Mar 24, 1998

Aug 14, 1996

8/696545

Paul Elwin Stevenson - Colorado Springs CO
Craig Hamman Stephan - Ann Arbor MI
Amer Mohammad Samman - Dearborn MI
Leland Joseph Spangler - Manitou Springs CO

Ford Global Technologies, Inc. - Dearborn MI

G01P 2100, G01P 15125

7351432

A micro-machined accelerometer includes a moveable metal plate, mounted upon a semiconductor substrate. The moveable metal plate includes an aperture which contains a pedestal and at least one torsion bar for connecting the pedestal to the moveable metal plate. Measurement electrodes formed on the semiconductor substrate combine with the metal plate to form measurement capacitors A combined self-test/common electrode provides a dual function of a common electrode during operation of the accelerometer and a testing electrode during a self-test procedure.

5920013, Jul 6, 1999

Feb 7, 1997

8/797376

William John Boardman - Colorado Springs CO
John Crumlin - Colorado Springs CO
John Ralph Lindsey - Colorado Springs CO
Paul Thomas Carson - Colorado Springs CO
Judd Steven Carper - Colorado Springs CO
John Ames - Colorado Springs CO
Paul Elwin Stevenson - Colorado Springs CO

Ford Motor Company - Dearborn MI

G01P 15125

7351432

A protective coating is utilized to protect the silicon during a wet chemical etch step in the process of making a micromachine, thereby preventing the formation of etched holes or pits in the micromachine. In another embodiment, silicon sacrificial pedestals are used to eliminate or greatly reduces the electrical potential difference between metal on the glass substrate and the silicon, thereby eliminating arcing and the resulting damage to silicon and metal. These pedestals may be removed after the anodic bond.

7639094, Dec 29, 2009

May 9, 2008

12/118574

Paul Stevenson - Colorado Springs CO, US

Marvell International Ltd. - Hamilton

H03B 5/12

331108C, 331162, 331116 M

An oscillator circuit for a plurality of resonator-based oscillators is provided. In a dual oscillator circuit, a first oscillator circuit operating at a first frequency is coupled to a second oscillator circuit operating at a lower frequency. The two circuits are separated by a low-pass filter that isolates the input stage of the first oscillator circuit from the input stage of the second oscillator circuit. A circuit leg shared between the first oscillator circuit and the second oscillator circuit is configured to couple the first input stage of the first oscillator circuit to a first external resonator resonate at the first frequency and couple the second input stage of the second oscillator circuit to a second external resonator resonate at the second frequency.

7123109, Oct 17, 2006

Dec 15, 2004

11/013059

Paul E. Stevenson - Colorado Springs CO, US
Jon E. Tourville - Colorado Springs CO, US
Nathan L. Pihlstrom - Colorado Springs CO, US

Intel Corporation - Santa Clara CA

H03B 5/36, H03L 3/00, H03L 5/00

331109, 331116 FE, 331158, 331186

An oscillator circuit may be operated in a high power mode or a reduced power mode. The high power mode provides fast start-up of the oscillator circuit.

6223586, May 1, 2001

Dec 23, 1998

9/220021

Karl Allen Dierenbach - Monument CO
Fred John Trusell - Colorado Springs CO
John Carlson Ames - Colorado Springs CO
Paul Elwin Stevenson - Colorado Springs CO

Visteon Global Technologies, Inc. - Dearborn MI

G01M 304

73 455

An inspection method for evaluating the hermeticity of integrated circuits and micro-electromechanical devices having a cavity. The method includes submerging one or more of the devices in a liquid, under pressure, for a given time period in order to allow the liquid to seep into any cavities that have leak paths. After the pressure soak, the devices are transferred to another liquid and observed under a microscope for signs of the liquid in any of the devices cavities, thereby determining if hermeticity is present.

5364011, Nov 15, 1994

Apr 6, 1994

8/223569

Jay D. Baker - West Bloomfield MI
Myron Lemecha - Dearborn MI
Richard K. McMillan - Dearborn MI
Kenneth A. Salisbury - Livonia MI
Paul E. Stevenson - Colorado Springs CO
Thomas B. Merala - Canton MI
Wells L. Green - Garden City MI
Matti Mikkor - Ann Arbor MI
Bernard A. Meyer - Taylor MI

Ford Motor Company - Dearborn MI

B23K 300

22818021

A micro soldering apparatus and method comprising a system (10) for attaching an electronic component (12) to a substrate (14). The system (10) comprises a soldering tool (16) including a dispensing orifice assembly (18) for pulsatingly dispensing a controlled quantity of molten solder (19) to a component (12) and substrate (14) so that the component is joined to the substrate (14) mechanically and electrically upon solidification of the molten solder (19). There is no physical contact between the dispensing orifice assembly (18) and joint. The system (10) also includes a controller for the soldering tool (16). The controller functions in response to process control parameters so that the controlled quantity of molten solder (19) is dispensed through a non-oxidizing atmosphere by a pressure pulse applied to the molten solder.

2006026, Nov 30, 2006

Aug 9, 2006

11/501611

Paul Stevenson - Colorado Springs CO, US
Jon Tourville - Colorado Springs CO, US
Nathan Pihlstrom - Colorado Springs CO, US

H03L 7/099

331185000

An oscillator circuit may be operated in a high power mode or a reduced power mode. The high power mode provides fast start-up of the oscillator circuit.