DR. PAUL L LIN, MD
Medical Practice at Medical Dr, Longview, TX
License number
Texas K1238
Category
Medical Practice
Type
Obstetrics & Gynecology
Address
Address
2
802 Medical Dr SUITE 100, Longview, TX 75605
PO Box 847176, Dallas, TX 75284
PO Box 847176, Dallas, TX 75284
Phone
(903) 757-6042
(903) 232-8213 (Fax)
(903) 237-1800
(903) 237-1810 (Fax)
(903) 232-8213 (Fax)
(903) 237-1800
(903) 237-1810 (Fax)
Professional information
Partner &Amp; Chief Videographer/Editor At Green Light Media Services
Position:
Videographer/Editor at Thrillist, Partner & Chief Videographer/Editor at Green Light Media Services, Creative Intern at Eyes of the World Media Group, Freelance Videographer at Citybuzz.com
Location:
Dallas/Fort Worth Area
Work:
Thrillist
- Dallas, TX since Oct 2011
-
Videographer/Editor
Green Light Media Services
- Dallas, Texas since May 2011
-
Partner & Chief Videographer/Editor
Eyes of the World Media Group
since Oct 2010
-
Creative Intern
Citybuzz.com
since Aug 2010
-
Freelance Videographer
Fo Guan Shan Buddhist Association
Sep 2005 - Sep 2010
-
Videographer
Fox Sports Southwest
Jun 2007 - Sep 2007
-
Production Intern
Prime Arts & Jewel
Jun 2006 - Aug 2006
-
Advertising Department Intern
Education:
University of North Texas 2006 - 2010
Bachelor of Arts, Film
Bachelor of Arts, Film
Dr. Paul L Lin, Longview TX - MD (Doctor of Medicine)
Specialties:
Obstetrics & Gynecology
Address:
Diagnostic Clinic Of Longview PA
707 Hollybrook Dr, Longview 75605
(903) 757-6042 (Phone)
707 Hollybrook Dr, Longview 75605
(903) 757-6042 (Phone)
Certifications:
Obstetrics & Gynecology, 2012
Awards:
Healthgrades Honor Roll
Languages:
English, Spanish
Hospitals:
Diagnostic Clinic Of Longview PA
707 Hollybrook Dr, Longview 75605
Good Shepherd Medical Center
700 East Marshall Ave, Longview 75601
Longview Regional Medical Center
2901 North 4Th St, Longview 75605
707 Hollybrook Dr, Longview 75605
Good Shepherd Medical Center
700 East Marshall Ave, Longview 75601
Longview Regional Medical Center
2901 North 4Th St, Longview 75605
Education:
Medical School
University Of Utah School Of Medicine
Parkland Memorial Hospital
Graduated: 1999
University Of Utah School Of Medicine
Parkland Memorial Hospital
Graduated: 1999
Paul L Lin, Longview TX
Specialties:
OB-GYN
Address:
707 Hollybrook Dr, Longview, TX 75605
Education:
Parkland Memorial Hospital - Residency - Obstetrics and Gynecology
Board certifications:
American Board of Obstetrics and Gynecology Certification in Obstetrics & Gynecology
Founder And Partner At Viapak
Position:
Founder and Partner at ViaPak
Location:
Dallas/Fort Worth Area
Industry:
Semiconductors
Work:
ViaPak
-
Founder and Partner
Chip-Embedded Support-Frame Board Wrapped By Folded Flexible Circuit For Multiplying Packing Density
US Patent:
7408253, Aug 5, 2008
Filed:
Mar 30, 2005
Appl. No.:
11/094111
Inventors:
Paul T. Lin - Dallas TX, US
International Classification:
H01L 23/02
US Classification:
257686, 257E23177, 257E23065, 361749, 361755, 174254
Abstract:
The present invention includes a chip-embedded support-frame wrapped-by-flex-circuit package assembly. The package assembly includes a flex circuit having a plurality of patterned connecting-traces. The package assembly further includes a plurality of semiconductor chips mounted on the flex circuits wherein the semiconductor chips having a plurality of contact terminals connected to corresponding connecting traces on the flex circuit. The package assembly further includes a support frame-board having an edge surface placed along predefined folded lines on the flex circuit. The frame-board has a plurality of open spaces for disposing each of the semiconductor chips therein. The flex circuit is provided for folding onto the support frame along the predefined folded lines to form the chip-embedded support-frame wrapped-by-flex-circuit package.
Package With Solder-Filled Via Holes In Molding Layers
US Patent:
7667338, Feb 23, 2010
Filed:
Jul 23, 2007
Appl. No.:
11/880753
Inventors:
Paul T. Lin - Dallas TX, US
Chi-Shih Chang - Austin TX, US
Chi-Shih Chang - Austin TX, US
International Classification:
H01L 23/28
US Classification:
257787, 257686
Abstract:
The present invention discloses an electronic package to contain and protect an integrated circuit (IC) chip. The electronic package further includes a leadframe, a flexible circuit or PCB type of substrate. The leadframe, flexible circuit or PCB type substrate further includes solder contacts, which are aligned with via holes in the molding layers on the top and bottom sides of the package. These via holes are for placing solder paste or solder balls from above and below for electrical access to the IC chip. These solder balls provide access for electrical testing after the package is mounted on a motherboard. They also provide the connection points for stacking multiple packages vertically.