PAUL GERALD ENGLE
Vehicle Board in Navy Sup Dpt, PA
License number
Pennsylvania MV149027L
Category
Vehicle Board
Type
Vehicle Salesperson
Address
Address
Navy Sup Dpt, PA 17055
Professional information
Medical Circuit Forming Process
US Patent:
5567328, Oct 22, 1996
Filed:
Jun 8, 1995
Appl. No.:
8/482244
Inventors:
Paul F. Engle - Mechanicsburg PA
Thomas J. Lynch - Mechanicsburg PA
Roger T. Banks - York PA
Thomas J. Lynch - Mechanicsburg PA
Roger T. Banks - York PA
Assignee:
The Whitaker Corporation - Wilmington DE
International Classification:
B44C 122, C23F 100
US Classification:
216 13
Abstract:
A process to manufacture disposable medical flat flexible printed circuits 10. The process entails depositing conductive metal in the range of 1000 to 2500 Angstroms thick onto a flexible film having a thickness in the range of 0. 1 to 10 mils. The first portions of the conductive metal are covered with a resist material arranged in a pattern. Metal circuit material is deposited onto second portions of the conductive metal. Overplating the metal circuit material with a corrosion resistant metal. Lastly, removing the resist material and the first portions of the metal and laminating the circuit.
Process For Low Density Additive Flexible Circuits And Harnesses
US Patent:
5721007, Feb 24, 1998
Filed:
Apr 25, 1995
Appl. No.:
8/429220
Inventors:
Thomas J. Lynch - Mechanicsburg PA
Ram K. Agnihotri - Harrisburg PA
Paul F. Engle - Mechanicsburg PA
Roger T. Banks - York PA
Ronald B. Barnes - Camp Hill PA
Earl Hennenhoefer - Harrisburg PA
Russell T. Lerch - Palmyra PA
Thomas O'Shea - York PA
John Yavor - Mount Joy PA
Ram K. Agnihotri - Harrisburg PA
Paul F. Engle - Mechanicsburg PA
Roger T. Banks - York PA
Ronald B. Barnes - Camp Hill PA
Earl Hennenhoefer - Harrisburg PA
Russell T. Lerch - Palmyra PA
Thomas O'Shea - York PA
John Yavor - Mount Joy PA
Assignee:
The Whitaker Corporation - Wilmington DE
International Classification:
B05D 512
US Classification:
427 98
Abstract:
An additive electrical circuit (5) on a flexible substrate (1) fabricated by; metallization of the substrate, applying a mask pattern comprising a plating resistant material, applying a conductive circuit material in a circuit pattern that is uncovered by the mask pattern, and removing the plating resistant material and the metallization. Leaving the circuit (5) on the substrate (1) to be applied as a harness or instrument panel.