DR. PAUL DAVID JOHNSON, DMD
Dentist at Mcdermott Dr, Allen, TX

License number
Texas 26526
Category
Dentist
Type
Orthodontics and Dentofacial Orthopedics
Address
Address 2
1205 W Mcdermott Dr, Allen, TX 75013
120 S Denton Tap Rd SUITE 210, Coppell, TX 75019
Phone
(469) 635-1105
(469) 635-1108 (Fax)

Personal information

See more information about PAUL DAVID JOHNSON at radaris.com
Name
Address
Phone
Paul Johnson, age 65
4961 Daffodil Dr, Brownsville, TX 78526
(956) 544-6850
Paul Johnson
500 Avocado Rd, Gilmer, TX 75644
(903) 355-4553
Paul Johnson
5008 Bay Vw, Garland, TX 75043
Paul Johnson, age 62
4 Green Blade Ln, Spring, TX 77380
Paul Johnson
4850 Odessa Ave, Fort Worth, TX 76133

Professional information

Paul Johnson Photo 1

Paul Johnson - Allen, TX

Work:
GMMP Enterprises, LLC
Shop Manager
PJs Mobile Detailing
Owner
DAP, Inc - Garland, TX
Shipping and Receiving
Education:
Crowley High School - Crowley, LA
High School Diploma
Skills:
I am an excellent communicator with the ability to establish and maintain good rapport with both internal and external customers. A proven track record of outstanding interpersonal, organizational and time management skills sets me apart. I am a very detail oriented individual that possesses excellent leadership skills. I am a team player. I have extensive knowledge of shipping and receiving processes, including over 10 years of forklift experience.


Paul Johnson Photo 2

Method Of Forming An Electronic Package With A Solder Seal

US Patent:
6352195, Mar 5, 2002
Filed:
Sep 18, 2000
Appl. No.:
09/664198
Inventors:
Frank E. Guthrie - Rockwall TX
Paul O. Johnson - Allen TX
Assignee:
RF Monolithics, Inc. - Dallas TX
International Classification:
B23K 3102
US Classification:
2281231, 2281246, 228 563, 228245, 228214, 228219, 228220, 2282342
Abstract:
A method of attaching a lid with at least a metallic surface thereon to a substrate to enclose a surface acoustic wave electronic circuit using a fluxless solder preform having an undesired oxide surface and associated with the metallic surface on the lid and in superimposed and abutting relationship with a gold seal ring surrounding the electronic circuit to form a unit that is heated in a furnace having a hydrogen atmosphere such that the hydrogen removes any undesired oxide surfaces from the solder preform and the metallic surface on the lid by combining with the oxygen therein to form moisture so as to remove any oxide surfaces from the solder preform and the lid metallic surface and enable a complete bonding of the fluxless solder preform with the gold seal ring and the lid metallic surface thereby forming a hermetically sealed package.


Paul David Johnson Photo 3

Paul David Johnson, Allen TX

Specialties:
Dentist
Address:
1205 W Mcdermott Dr, Allen, TX 75013


Paul Johnson Photo 4

Thermal Detector Apparatus And Method Using Reduced Thermal Capacity

US Patent:
5457318, Oct 10, 1995
Filed:
Apr 29, 1994
Appl. No.:
8/235413
Inventors:
James E. Robinson - Dallas TX
James F. Belcher - Plano TX
Howard R. Beratan - Richardson TX
Steven N. Frank - McKinney TX
Charles M. Hanson - Richardson TX
Paul O. Johnson - Allen TX
Robert J. S. Kyle - Rowlett TX
Edward G. Meissner - Dallas TX
Robert A. Owen - Rowlett TX
Gail D. Shelton - Mesquite TX
William K. Walker - Plano TX
Assignee:
Texas Instruments Incorporated - Dallas TX
International Classification:
G01J 506
US Classification:
250332
Abstract:
A thermal detection system (10) includes a focal plane array (12), a thermal isolation structure (14), and an integrated circuit substrate (16). Focal plane array (12) includes thermal sensors (28), each having an associated thermal sensitive element (30). Thermal sensitive element (30) is coupled with one side to infrared absorber and common electrode assembly (36) and on the opposite side to an associated contact pad (20) disposed on the integrated circuit substrate (16). Reticulation kerfs (52a, 52b) separate adjacent thermal sensitive elements (30a, 30b, 30c) by a distance at least half the average width (44, 46) of a single thermal sensitive element (30a, 30b, 30c). A continuous, non-reticulated optical coating (38) may be disposed over thermal sensitive elements (30a, 30b, 30c) to maximize absorption of thermal radiation incident to focal plane array (12).


Paul Johnson Photo 5

Method Of Forming An Electronic Package With A Solder Seal

US Patent:
6119920, Sep 19, 2000
Filed:
Dec 20, 1996
Appl. No.:
8/770268
Inventors:
Frank E. Guthrie - Rockwall TX
Paul O. Johnson - Allen TX
Assignee:
RF Monolithics, Inc. - Dallas TX
International Classification:
B23K 100
US Classification:
2281231
Abstract:
A method of attaching a lid with at least a metallic surface thereon to a substrate to enclose a surface acoustic wave electronic circuit using a fluxless solder preform having an undesired oxide surface and associated with the metallic surface on the lid and in superimposed and abutting relationship with a gold seal ring surrounding the electronic circuit to form a unit that is heated in a furnace having a hydrogen atmosphere such that the hydrogen removes any undesired oxide surfaces from the solder preform and the metallic surface on the lid by combining with the oxygen therein to form moisture so as to remove any oxide surfaces from the solder preform and the lid metallic surface and enable a complete bonding of the fluxless solder preform with the gold seal ring and the lid metallic surface thereby forming a hermetically sealed package.


Paul Johnson Photo 6

Method Of Fabricating Focal Plane Array

US Patent:
5604977, Feb 25, 1997
Filed:
Jun 7, 1995
Appl. No.:
8/478570
Inventors:
James E. Robinson - Dallas TX
James F. Belcher - Plano TX
Howard R. Beratan - Richardson TX
Steven N. Frank - McKinney TX
Charles M. Hanson - Richardson TX
Paul O. Johnson - Allen TX
Robert J. S. Kyle - Rowlett TX
Edward G. Meissner - Dallas TX
Robert A. Owen - Rowlett TX
Gail D. Shelton - Mesquite TX
William K. Walker - Plano TX
Assignee:
Texas Instruments Incorporated - Dallas TX
International Classification:
H01R 4300
US Classification:
29825
Abstract:
A thermal detection system (10) includes a focal plane array (12), a thermal isolation structure (14), and an integrated circuit substrate (16). Focal plane array (12) includes thermal sensors (28), each having an associated thermal sensitive element (30). Thermal sensitive element (30) is coupled with one side to infrared absorber and common electrode assembly (36) and on the opposite side to an associated contact pad (20) disposed on the integrated circuit substrate (16). Reticulation kerfs (52a, 52b) separate adjacent thermal sensitive elements (30a, 30b, 30c) by a distance at least half the average width (44, 46) of a single thermal sensitive element (30a, 30b, 30c). A continuous, non-reticulated optical coating (38) may be disposed over thermal sensitive elements (30a, 30b, 30c) to maximize absorption of thermal radiation incident to focal plane array (12).