Inventors:
David R. Hall - Provo UT, US
H. Tracy Hall - Provo UT, US
Paul Moody - Provo UT, US
Scott Dahlgren - Provo UT, US
Marshall Soares - Provo UT, US
International Classification:
H01L 23/34
US Classification:
257720, 257E23101, 257706, 257707, 257712, 361723
Abstract:
An integrated circuit apparatus with heat removal has an electrical interconnection network. The electrical interconnection network has a plurality of electrically and thermally conductive vias in electrical communication with terminals of at least one semiconductor device. An electrically insulating heat spreader is chemically bonded to each of the vias at an upper layer of the electrical interconnection network. At the upper layer the vias are electrically isolated from each other. In some embodiments the electrically insulating heat spreader is a polycrystalline diamond body with a metallized undersurface. The metallized undersurface may be etched away between vias.