Paul A Taylor
Electrician at Paloma St, Boise, ID

License number
Colorado 4265
Issued Date
Nov 15, 1991
Renew Date
Mar 1, 2005
Expiration Date
Feb 28, 2007
Type
Master Electrician
Address
Address
7765 W Paloma St, Boise, ID 83704

Organization information

See more information about Paul A Taylor at bizstanding.com

PAUL A. TAYLOR, INC

7765 W Paloma St, Boise, ID 83704

Status:
Inactive
Industry:
Business Services at Non-Commercial Site
Doing business as:
Paul A Taylor Inc
Registration:
Feb 5, 1982
Inactive since:
Oct 21, 2013
Business type:
CORPORATION, GENERAL BUSINESS
Owner Eng:
Paul Ataylor Owner Eng, inactive

Professional information

Paul Taylor Photo 1

Senior Engineer At Aceco Precision Manufacturing

Position:
Senior Engineer at AceCo Precision Manufacturing
Location:
Boise, Idaho Area
Industry:
Semiconductors
Work:
AceCo Precision Manufacturing since Apr 2013 - Senior Engineer Ace Co Apr 2010 - Apr 2013 - JV Manager AceCo 2010 - 2012 - JV Manager AceCo ATS, Singapore IM Flash Singapore 2008 - 2008 - Manager Fab Manufacturing Operations Support Micron Technology Jan 1996 - Dec 2008 - Lead Senior Engineer, Manufacturing Operations Support Boise State University Jan 2007 - May 2007 - Adjunct Professor Idaho National Laboratory Nov 1991 - Jan 1996 - Sr. Engineer
Education:
The Ohio State University 1988 - 1990
MS, Welding Engineering
Millikin University 1984 - 1988
BS, Welding Engineering
Skills:
Failure Analysis, JMP, Semiconductors, Electronics, Process Control, Manufacturing, Test Equipment, Automation, Electrical Engineering, Design of Experiments, Semiconductor Industry, Field Service, Hardware, Robotics, SPC, Labview


Paul Taylor Photo 2

Technical Writer At Micron

Position:
Technical Writer at Micron, Owner at Pyrrhic Paintball, Owner at Intevault
Location:
Boise, Idaho Area
Industry:
Semiconductors
Work:
Micron since Feb 2005 - Technical Writer Pyrrhic Paintball since May 2010 - Owner Intevault since 2006 - Owner
Education:
Idaho State University 2001 - 2004
MFA, Art Metals
Boise State University 1994 - 1999
BFA, Art Metals
Boise High School


Paul Taylor Photo 3

Paul Taylor

Location:
Boise, Idaho Area
Industry:
Computer Networking


Paul Taylor Photo 4

Method And Apparatus For Assessing Weld Quality

US Patent:
6236017, May 22, 2001
Filed:
Jul 1, 1999
Appl. No.:
9/346196
Inventors:
Herschel B. Smartt - Idaho Falls ID
Kevin L. Kenney - Idaho Falls ID
John A. Johnson - Idaho Falls ID
Nancy M. Carlson - Idaho Falls ID
Denis E. Clark - Idaho Falls ID
Paul L. Taylor - Boise ID
Edward W. Reutzel - State College PA
Assignee:
Bechtel BWXT Idaho, LLC - Idaho Falls ID
International Classification:
B23K 9095
US Classification:
21913001
Abstract:
Apparatus for determining a quality of a weld produced by a welding device according to the present invention includes a sensor operatively associated with the welding device. The sensor is responsive to at least one welding process parameter during a welding process and produces a welding process parameter signal that relates to the at least one welding process parameter. A computer connected to the sensor is responsive to the welding process parameter signal produced by the sensor. A user interface operatively associated with the computer allows a user to select a desired welding process. The computer processes the welding process parameter signal produced by the sensor in accordance with one of a constant voltage algorithm, a short duration weld algorithm or a pulsed current analysis module depending on the desired welding process selected by the user. The computer produces output data indicative of the quality of the weld.


Paul Taylor Photo 5

Semiconductor Wafer Processing Accelerometer

US Patent:
7498759, Mar 3, 2009
Filed:
Aug 17, 2006
Appl. No.:
11/465262
Inventors:
Matthew T. Nelson - Boise ID, US
Kent C. McBride - Boise ID, US
Paul L. Taylor - Boise ID, US
Assignee:
Micron Technology, Inc. - Boise ID
International Classification:
B25J 9/10
US Classification:
31856817, 318561, 702191
Abstract:
An end effector of a robot tool that includes accelerometers and methods to sense end effector motion. A semiconductor substrate or similar object may be supported by the end effector. Motion of the end effector and associated substrate movement may be transduced and sampled according to specified conditions. The sampled data may be processed, stored and analyzed for subsequent use, and/or may be used in near real time to control end effector movement. Sampled data representative of mechanical events associated with end effector movement may be communicated to a remotely operated processor system.