PAUL A DANELLO
Engineering in Franklin, MA

2013025, Oct 3, 2013

Mar 30, 2012

13/434992

Paul A. Danello - Franklin MA, US
Richard A. Stander - Chelmsford MA, US
Michael D. Goulet - Southbridge MA, US

Raytheon Company - Waltham MA

H05K 7/20, H01L 21/50

361706, 361719, 438122, 257E21499

A method of forming a heat-dissipating structure for semiconductor circuits is provided. First and second semiconductor integrated circuit (IC) chips are provided, where the first and second semiconductor chips each have first and second opposing sides, wherein the first and second semiconductor IC chips are configured to be fixedly attached to a top surface of a substantially planar circuit board along their respective first sides. The respective second opposing sides of each of the first and second semiconductor IC chips are coupled to first and second respective portions of a sacrificial thermal spreader material, the sacrificial thermal spreader material comprising a material that is thermally conductive. The first and second portions of the sacrificial thermal spreader material are planarized to substantially equalize a respective first height of the first semiconductor chip and a respective second height of the second semiconductor chip.

8508943, Aug 13, 2013

Oct 16, 2009

12/580356

Paul A. Danello - Franklin MA, US
Scott R. Cheyne - Brookline NH, US
Joseph R. Ellsworth - Worcester MA, US
Thomas J. Tellinghuisen - Pelham NH, US

Raytheon Company - Waltham MA

H05K 7/20, H01Q 1/38

361704, 361688, 36167901, 343700 MS

In one aspect, an assembly includes a panel that includes a first surface. The panel also includes a first active circuit coupled to the first surface of the panel and a cold plate having a first bore. The cold plate includes a first inner surface exposed by the first bore. The panel further includes a first thermally conductive material in contact with the first inner surface of the cold plate and the first active circuit.

2010003, Feb 18, 2010

Aug 15, 2008

12/228699

Paul A. Danello - Franklin MA, US
Michael P. Martinez - Worcester MA, US
Russell D. Belanger - Tyngsborough MA, US
Joaquim A. Bento - Marlborough MA, US
Joseph R. Ellsworth - Worcester MA, US

H05K 7/20

361691

An electronic subsystem such as an array of radar transmit/receive microwave modules are associated with (e.g., base mounted to) spaced heat sinks. There is an electronic module on each side of each heat sink and an inflatable bladder or “pneumatic pressure wedge” between adjacent heat sinks biases a pair of electronic modules against their respective heat sinks.

2003014, Aug 7, 2003

Feb 7, 2002

10/071710

Paul Danello - Franklin MA, US
Joseph Mirabile - Medford MA, US
Anthony Carrara - Holliston MA, US

A47F007/00

211/026000

A symmetric wedgelock system includes a compression device having a longitudinal axis; a plurality of segments arranged along the compression device including at least one drive segment at each end and at least one working segment in between each working segment including at least two sections having diverging sides forming a concave wedge facing an associated drive segment; each drive segment having converging sides forming a convex wedge facing an associated working segment; the compression device includes an adjustment device for applying a compressive force along the longitudinal axis to drive the convex wedges of the drive segment into the concave wedges of the working segment to drive apart laterally the sections of the working segment.