Inventors:
Alvaro Maury - Orlando FL
Arun K. Nanda - Orlando FL
Omar Rodriguez - Orlando FL
Assignee:
Lucent Technologies Inc. - Murray Hill NJ
International Classification:
H01L 21304
Abstract:
The present invention provides a method for polishing a semiconductor substrate having a first layer of material formed on a second layer of different material. In one embodiment, the method includes placing the semiconductor substrate against a polishing surface and polishing the semiconductor substrate, producing a first vibration by polishing and removing the first layer, producing a second vibration by polishing at least a portion of the second layer, and detecting a change from the first vibration to the second vibration with a vibration sensor. The vibration that is sensed in the present invention is physical or mechanical vibration, and it is not a vibration associated with a change in temperature. The vibration sensor may be of varying types. For example, the vibration sensor may be an acoustic sensor or an ultrasonic sensor.