OLIVER CHARLES BOOMHOWER
Pilots at Fonda Rd, Waterford, NY
License number
New York A4371975
Issued Date
Nov 2013
Expiration Date
Nov 2018
Category
Airmen
Type
Authorized Aircraft Instructor
Address
Address
123 Fonda Rd, Waterford, NY 12188
Professional information
Electrical Connection Through A Substrate To A Microelectromechanical Device
US Patent:
7915696, Mar 29, 2011
Filed:
Oct 24, 2007
Appl. No.:
11/877786
Inventors:
David Cecil Hays - Niskayuna NY, US
Marco Francesco Aimi - Niskayuna NY, US
Christopher Fred Keimel - Schenectady NY, US
Glenn Scott Claydon - Wynantskill NY, US
Oliver Charles Boomhower - Waterford NY, US
Marco Francesco Aimi - Niskayuna NY, US
Christopher Fred Keimel - Schenectady NY, US
Glenn Scott Claydon - Wynantskill NY, US
Oliver Charles Boomhower - Waterford NY, US
Assignee:
General Electric Company - Niskayuna NY
International Classification:
H01L 29/82
US Classification:
257415, 257420
Abstract:
An electrical through-connection, or via, that passes through a substrate to a bus on a first surface of the substrate. The via may be configured with an interlock such that the electrically conductive core of the via is constrained to thermally expand towards the second surface, away from the bus, thus preventing damage to the bus. The interlock may be a local constriction or enlargement of the via near the first surface of the substrate. The via may be greater in length along the bus than a unit spacing of beams in a parallel microswitch array actuated in unison along the bus. The via may be narrower in width than in length, and may form a trapezoidal geometry that is larger at the second surface of the substrate than at the first surface.
Sealed Wafer Packaging Of Microelectromechanical Systems
US Patent:
2009009, Apr 16, 2009
Filed:
Oct 15, 2007
Appl. No.:
11/872562
Inventors:
MARCO FRANCESCO AIMI - Niskayuna NY, US
Chirstopher James Kapusta - Delanson NY, US
Arun Virupaksha Gowda - Niskayuna NY, US
David Cecil Hays - Niskayuna NY, US
Oliver Charles Boomhower - Waterford NY, US
Glenn Scott Claydon - Wynantskill NY, US
Joseph Alfred Iannotti - Glenville NY, US
Christopher Fred Keimel - Schenectady NY, US
Chirstopher James Kapusta - Delanson NY, US
Arun Virupaksha Gowda - Niskayuna NY, US
David Cecil Hays - Niskayuna NY, US
Oliver Charles Boomhower - Waterford NY, US
Glenn Scott Claydon - Wynantskill NY, US
Joseph Alfred Iannotti - Glenville NY, US
Christopher Fred Keimel - Schenectady NY, US
International Classification:
H01L 23/34, H01L 21/00
US Classification:
257723, 438107, 257E2301
Abstract:
Multiple microelectromechanical systems (MEMS) on a substrate are capped with a cover using a layer that may function as a bonding agent, separation layer, and hermetic seal. A substrate has a first side with multiple MEMS devices. A cover is formed with through-holes for vias, and with standoff posts for layer registration and separation. An adhesive sheet is patterned with cutouts for the MEMS devices, vias, and standoff posts. The adhesive sheet is tacked to the cover, then placed on the MEMS substrate and heated to bond the layers. The via holes may be metalized with leads for circuit board connection. The MEMS units may be diced from the substrate after sealing, thus protecting them from contaminants.
Microfluidic Device And Methods For Droplet Generation And Manipulation
US Patent:
2010005, Mar 11, 2010
Filed:
Sep 11, 2008
Appl. No.:
12/208445
Inventors:
Wei-Cheng Tian - Clifton Park NY, US
Jeffrey Bernard Fortin - Chelmsford MA, US
Jun Xie - Niskayuna NY, US
Barbara Grossman - Clifton Park NY, US
Oliver Charles Boomhower - Waterford NY, US
Shashi Thutupalli - Bangalore, IN
Long Que - Rexford NY, US
Jeffrey Bernard Fortin - Chelmsford MA, US
Jun Xie - Niskayuna NY, US
Barbara Grossman - Clifton Park NY, US
Oliver Charles Boomhower - Waterford NY, US
Shashi Thutupalli - Bangalore, IN
Long Que - Rexford NY, US
Assignee:
GENERAL ELECTRIC COMPANY - Schenectady NY
International Classification:
G01N 33/00
US Classification:
137 1, 422 681
Abstract:
Methods and microfluidic devices for generating and manipulating sample droplets, wherein the devices comprise, a plurality of fluid channels, at least one of which is a sample channel for carrying a fluidic sample material, that is in fluid communication with the carrier fluid channel via an orifice; and an actuated flow interrupter adapted to force a predetermined amount of the sample fluid from the sample channel through the orifice into the carrier fluid channel.
Encapsulated Beam And Method Of Forming
US Patent:
2013034, Dec 26, 2013
Filed:
Jun 26, 2012
Appl. No.:
13/533192
Inventors:
Oliver Charles Boomhower - Waterford NY, US
Assignee:
GENERAL ELECTRIC COMPANY - SCHENECTADY NY
International Classification:
B05D 1/36, B32B 9/00, B05D 3/10
US Classification:
428 76, 427404, 216 58, 216 57, 216 41
Abstract:
A device including a protecting material encapsulated metallic beam and a method of encapsulating the metallic beam using the protecting material layer are presented. The device includes a cantilever beam that includes at least about 90 Wt % of a metallic beam material, and 10 Wt % or less of a protecting material. The method of forming an encapsulated metallic beam includes the steps of depositing a first layer of protecting material over a substrate, depositing a second layer of protecting material over the first layer, depositing a metallic beam material over the second layer of protecting material, and encapsulating the beam material with a coating of the protecting material.
Mems Microswitch Having A Conductive Mechanical Stop
US Patent:
7609136, Oct 27, 2009
Filed:
Dec 20, 2007
Appl. No.:
11/961767
Inventors:
Xuefeng Wang - Schenectady NY, US
Christopher Fred Keimel - Schenectady NY, US
Marco Francesco Aimi - Niskayuna NY, US
Kuna Venkat Satya Rama Kishore - Bangalore, IN
Glenn Scott Claydon - Wynantskill NY, US
Oliver Charles Boomhower - Waterford NY, US
Parag Thakre - Bangalore, IN
Christopher Fred Keimel - Schenectady NY, US
Marco Francesco Aimi - Niskayuna NY, US
Kuna Venkat Satya Rama Kishore - Bangalore, IN
Glenn Scott Claydon - Wynantskill NY, US
Oliver Charles Boomhower - Waterford NY, US
Parag Thakre - Bangalore, IN
Assignee:
General Electric Company - Niskayuna NY
International Classification:
H01H 51/22
US Classification:
335 78, 200181
Abstract:
A MEMS switch includes a substrate, a movable actuator coupled to the substrate, a substrate contact, a substrate electrode, and a conductive stopper electrically coupled to the movable actuator and structured to prevent the movable actuator from contacting the substrate electrode while allowing the movable actuator to make contact with the substrate contact.
Microfluidic Device With Vertical Injection Aperture
US Patent:
8029743, Oct 4, 2011
Filed:
Sep 19, 2007
Appl. No.:
11/857570
Inventors:
Jun Xie - Niskayuna NY, US
Shashi Thutupalli - Bangalore, IN
Stacey Joy Kennerly - Albany NY, US
Wei-Cheng Tian - Clifton Park NY, US
Erin Jean Finehout - Clifton Park NY, US
Li Zhu - Clifton Park NY, US
Oliver Charles Boomhower - Waterford NY, US
Shashi Thutupalli - Bangalore, IN
Stacey Joy Kennerly - Albany NY, US
Wei-Cheng Tian - Clifton Park NY, US
Erin Jean Finehout - Clifton Park NY, US
Li Zhu - Clifton Park NY, US
Oliver Charles Boomhower - Waterford NY, US
Assignee:
General Electric Company - Niskayuna NY
International Classification:
B01L 3/00, G01N 27/453
US Classification:
422503, 204604
Abstract:
A microfluidic device with a vertical injection aperture is provided. The microfluidic device comprises a separation channel, an injection aperture disposed adjacent to and in fluid communication with the separation channel. The microfluidic device further comprises a semi-permeable filter disposed adjacent to the injection aperture, wherein the filter is configured to preconcentrate a sample in the injection aperture to form a preconcentrated sample plug during an injection operation, and wherein the sample plug flows downwardly from the injection aperture to the separation channel during an electrophoresis operation.
Inorganic Membrane Devices And Methods Of Making And Using The Same
US Patent:
8168101, May 1, 2012
Filed:
Aug 20, 2009
Appl. No.:
12/544305
Inventors:
Anping Zhang - Rexford NY, US
Peter Paul Gipp - Schenectady NY, US
Oliver Charles Boomhower - Waterford NY, US
Peter Paul Gipp - Schenectady NY, US
Oliver Charles Boomhower - Waterford NY, US
Assignee:
General Electric Company - Niskayuna NY
International Classification:
B28B 1/48, C03C 25/68, B01D 39/00
US Classification:
264154, 216 41, 427244, 21050025
Abstract:
An inorganic membrane device is provided. The device comprises a substrate having a network of pores, and a membrane layer at least partially coupled to the substrate and having a plurality of pores, wherein the pores have an aspect ratio in a range from about 1:2 to about 1:100.
Membrane Assemblies And Methods Of Making And Using The Same
US Patent:
8622223, Jan 7, 2014
Filed:
Dec 17, 2008
Appl. No.:
12/337164
Inventors:
Anping Zhang - Rexford NY, US
Azar Alizadeh - Wilton NY, US
Joleyn Eileen Balch - Schaghticoke NY, US
Rui Chen - Clifton Park NY, US
Anthony John Murray - Lebanon NJ, US
Vicki Herzl Watkins - Alplaus NY, US
Oliver Charles Boomhower - Waterford NY, US
Reed Roeder Corderman - Niskayuna NY, US
Peter Paul Gipp - Schenectady NY, US
Azar Alizadeh - Wilton NY, US
Joleyn Eileen Balch - Schaghticoke NY, US
Rui Chen - Clifton Park NY, US
Anthony John Murray - Lebanon NJ, US
Vicki Herzl Watkins - Alplaus NY, US
Oliver Charles Boomhower - Waterford NY, US
Reed Roeder Corderman - Niskayuna NY, US
Peter Paul Gipp - Schenectady NY, US
Assignee:
General Electric Company - Niskayuna NY
International Classification:
B01D 71/02, B01D 69/12, B01D 63/08
US Classification:
21050021, 21050022, 21050025, 210488, 210490, 205199, 205324, 4283044, 4283122, 4283126
Abstract:
A method of making a membrane assembly is provided. The method comprises forming an inorganic membrane layer disposed on a substrate, and forming a plurality of macropores in the substrate at least in part using anodization. Further, a membrane assembly is provided. The membrane assembly comprises a filtering membrane that is coupled to an anodized substrate comprising a plurality of macropores.