NITIN A PATEL
Physician at Underwood St, Orlando, FL
License number
Florida 5654
Issued Date
Jun 24, 2002
Effective Date
Jul 11, 2004
Expiration Date
Jun 24, 2004
Category
Health Care
Type
Registration for Resident/HSE Physician
Address
Address
86 W Underwood St SUITE 100, Orlando, FL 32806
Professional information
Modular Semiconductor Substrates
US Patent:
6534851, Mar 18, 2003
Filed:
Aug 21, 2000
Appl. No.:
09/642376
Inventors:
Michael Antonell - Orlando FL
Erik Cho Houge - Orlando FL
Nitin Patel - Orlando FL
Larry E. Plew - St. Cloud FL
Catherine Vartuli - Windermere FL
Erik Cho Houge - Orlando FL
Nitin Patel - Orlando FL
Larry E. Plew - St. Cloud FL
Catherine Vartuli - Windermere FL
Assignee:
Agere Systems, Inc. - Allentown PA
International Classification:
H01L 2306
US Classification:
257684, 257723, 257724, 257707
Abstract:
A modular substrate-based processing scheme for producing semiconductor devices provides multiple modular processing units which may be arranged together to form any of various cohesive processing units or they may be individually or sequentially processed through standard semiconductor processing equipment. The cohesive processing units are processed unitarily providing for multiple modular processing units to be processed simultaneously. The modular processing units may be formed of a thick semiconductor substrate or a semiconductor substrate mounted on a further substrate such as a ceramic material. The modular processing units may each contain ribs, grooves, posts or other features to aid in handling and placement of the individual units.
Semiconductor Manufacturing Using Modular Substrates
US Patent:
6713409, Mar 30, 2004
Filed:
Nov 25, 2002
Appl. No.:
10/303280
Inventors:
Michael Antonell - Orlando FL
Erik Cho Houge - Orlando FL
Nitin Patel - Orlando FL
Larry E. Plew - St. Cloud FL
Catherine Vartuli - Windermere FL
Erik Cho Houge - Orlando FL
Nitin Patel - Orlando FL
Larry E. Plew - St. Cloud FL
Catherine Vartuli - Windermere FL
Assignee:
Agere Systems Inc. - Allentown PA
International Classification:
H01L 2100
US Classification:
438800, 257684, 257701, 257706, 257717, 257719, 257730, 257735, 257777
Abstract:
A manufacturing method using a modular substrate-based processing scheme for producing semiconductor devices, provides multiple modular processing units which may be arranged together to form any of various cohesive processing units or individually or sequentially processed through standard semiconductor processing equipment. The cohesive processing units are processed unitarily providing for multiple modular processing units to be processed simultaneously. The modular processing units may be formed of a thick semiconductor substrate or a semiconductor substrate mounted on a further substrate such as a ceramic material. The modular processing units may each contain ribs, grooves, posts or other features to aid in handling and placement of the individual units.
Nitin Patel
Location:
Orlando, Florida Area
Industry:
Public Policy