NAM LE, RPH
Pharmacy at Clovis Ave, Fresno, CA

6436303, Aug 20, 2002

Jul 21, 1999

09/359148

Bok Heon Kim - San Jose CA
Nam Le - San Jose CA
Joseph V. DSouza - Sunnyvale CA
Ashish Shrotriya - Santa Clara CA

Applied Materials, Inc. - Santa Clara CA

H01L 2100

216 67, 134 11, 134 12, 438710, 438727, 438731

A method and device for removing film from a substrate are provided that take advantage of a remote plasma source to etch away undesired portions of films, such as dielectric films formed on a substrate. To that end, the method includes forming a plasma remotely with respect to the process chamber, from which a flow is created that is directed toward the substrate. The substrate is of a type having opposed major surfaces with a peripheral surface extending therebetween. A film, such as a dielectric film, is disposed on one of the opposed major surfaces and on the peripheral surface. The opposed major surface having the film thereon is shielded from the flow of reactive radicals while the peripheral surface is left exposed. In this fashion, the flow is maintained for a sufficient amount of time to remove film present on the peripheral surface.

6413321, Jul 2, 2002

Dec 7, 2000

09/731601

Bok Hoen Kim - San Jose CA
Mario Dave Silvetti - Morgan Hill CA
Ameeta Madhava - San Francisco CA
Davood Khalili - Santa Clara CA
Martin Seamons - San Jose CA
Emanuele Cappello - Saratoga CA
Nam Le - San Jose CA
Lloyd Berken - Fremont CA

Applied Materials, Inc. - Santa Clara CA

C23C 1600

118725, 118719, 438680, 438758, 438765

Backside particle contamination of semiconductor wafers subjected to chemical vapor deposition is significantly reduced by optimizing various process parameters, alone or in combination. A high quality oxide seasoning layer is deposited to improve adhesion and trapping of contaminants remaining after a prior chamber cleaning step. Second, wafer pre-heating reduces thermal stress on the wafer during physical contact between the wafer and heater. Third, the duration of the gas stabilization flow of thermally reactive process gas species prior to CVD reaction is reduced, thereby preventing side products produced during this stabilization flow from affecting the wafer backside. Fourth, the wafer heater is redesigned to minimize physical contact between the heater surface and the wafer backside. Redesign of the wafer heater may include providing only a few, small projections from the top wafer surface, and also may include providing a continuous circumferential rim supporting the edge of the wafer to interfere with the flow of process gases to the wafer backside during processing.

5910375, Jun 8, 1999

May 3, 1996

8/642326

Theodore L. Parker - Danville CA
Anthony Lam - San Jose CA
Nam Thanh Le - San Jose CA

2C Optics, Inc. - Alpharetta GA

B32B 2730, G02B 522, G03B 2146

428520

A dual coating is provided for tinting a plastic material such that the plastic material is tinted and rendered scratch resistant. Also provided is tintable, scratch resistant plastic materials and tinted, scratch resistant plastic materials. The dual layer coating includes a dye reservoir layer formed over a surface of the material to be tinted and a hard coating layer formed over the dye reservoir layer. The dye reservoir layer includes between about fifteen and eighty percent by weight of a flexible acrylated oligomer or acrylated oligomer/acrylate monomer blend resin, and between about one and seventy percent by weight of a mono vinyl functional reactive diluent. The hard coating layer formed over the dye reservoir layer includes between about twenty and one hundred percent by weight of alkane polyols, the alkane polyols containing up to about forty eight carbon atoms and at least three O-�acryloyl(polyalkylene oxide)! groups, each polyalkylene oxide chain including between about one and twenty alkylene oxide groups, and between about ten and seventy percent by weight of polyacryloylated alkane polyols, the alkane polyols containing up to about twenty four carbon atoms and at least about two O-acryloyl groups.

2004016, Aug 19, 2004

Dec 1, 2003

10/726007

Matthew Foley - Santa Clara CA, US
Lewis Kawecki - Kings Beach CA, US
Nam Le - San Jose CA, US
Rony Yakir - Mountain View CA, US

Arkivio, Inc. - Mountain View CA

G11C029/00

714/769000

Techniques for maintaining data consistency in a storage environment. In a HSM controlled storage environment, techniques are provided for automatically detecting and correcting inconsistencies after a file system or a portion thereof has been restored from backup. The file system may store data files, tag files, and/or repository files that have been restored from backup.

5916669, Jun 29, 1999

Jan 7, 1997

8/777009

Theodore L. Parker - Danville CA
David S. Soane - Piedmont CA
Nam Thanh Le - San Jose CA
Anthony Lam - San Jose CA

2C Optics, Inc. - Alpharetta GA

B32B 702, B32B 2730

428216

An abrasion resistant, radiation or heat curable dual composition is applied to a polymer substrate, such as an opthamlic lens. An abrasion enhancement layer is deposited on a surface of the substrate. The abrasion enhancement layer has a modulus of M. sub. 1 and a Shore A value of 50 or less. A top coating is deposited on the abrasion enhancement layer. It has a modulus of M. sub. 2 that is greater than M. sub. 1. The top coating has an abrasion resistance Bayer Haze Gain ratio of 1. 0 or greater.

2004004, Mar 11, 2004

Aug 27, 2003

10/650171

Rony Yakir - Mountain View CA, US
Matthew Foley - Santa Clara CA, US
Yuedong Mu - san jose CA, US
Albert Leung - Los Altos CA, US
Nam Le - San Jose CA, US

Arkivio, Inc. - Mountain View CA

G06F007/00

707/100000

Techniques for moving a stub file (or any information that is used to recall migrated data) from an originating storage location to a destination storage location without recalling the migrated data corresponding to the stub file. The originating storage location and the destination storage location may be on storage unit allocated to the same server or allocated to different servers.

6843881, Jan 18, 2005

Apr 2, 2002

10/115526

Bok Hoen Kim - San Jose CA, US
Nam Le - San Jose CA, US
Martin Seamons - San Jose CA, US
Ameeta Madhava - San Francisco CA, US
Michael P. Nault - Woodland Park CO, US
Thomas Nowak - Cupertino CA, US
Tsutomu Tanaka - Santa Clara CA, US
Moshe Sarfaty - Cupertino CA, US

Applied Materials, Inc. - Santa Clara CA

H01L 21306

15634525, 15634524, 15634529, 15634535, 15634551, 134 56 R

In a substrate processing apparatus, a substrate processing chamber has a substrate support to support a substrate, a gas delivery system to provide an energized cleaning gas to the chamber to clean process residues formed on surfaces in the chamber during processing of the substrate, and an exhaust to exhaust the cleaning gas. A detector monitors a chemiluminescent radiation emitted from about a surface during cleaning of the process residues by the energized cleaning gas and generates a signal in relation to the monitored chemiluminescent radiation. A controller receives the signal and evaluates the signal to determine an endpoint of the cleaning process.