NAGESH R BASAVANHALLY
Engineers in Montgomery, NJ

7231106, Jun 12, 2007

Sep 30, 2005

11/239940

Nagesh R. Basavanhally - Skillman NJ, US
Dan M. Marom - Hwell NJ, US

Lucent Technologies Inc. - Murray Hill NJ

G02B 6/26, G02B 6/42

385 18, 385 17

The invention includes an apparatus for receiving an optical signal from an optical input means and directing the optical signal to one of a plurality of optical output means. The apparatus includes a solid signal propagating material having a refractive index greater than the refractive index of air. The solid signal propagating material includes a first transparent surface optically cooperating with the optical input and output means, a second transparent surface optically cooperating with a first light directing mechanism, and a reflective surface optically cooperating with the first light directing mechanism. A first reflecting component of the light directing mechanism directs a received optical signal to a second reflecting component of the light directing mechanism via the reflective surface of the signal propagating material. The second reflecting component of the light directing mechanism directs the respective incident optical signal to the selected one of the plurality of optical output means.

7402913, Jul 22, 2008

Sep 10, 2007

11/852413

Nagesh R Basavanhally - Skillman NJ, US
Raymond A Cirelli - Hillsborough NJ, US
Omar Daniel Lopez - Summit NJ, US

Lucent Technologies Inc. - Murray Hill NJ

H01L 23/52

257777

A method and apparatus for forming an electrically and/or thermally conducting interconnection is disclosed wherein a first surface and a second surface are contacted with each other via a plurality of nanostructures disposed on at least one of the surfaces. In one embodiment, a first plurality of areas of nanostructures is disposed on a component in an electronics package such as, illustratively, a microprocessor. The first plurality of areas is then brought into contact with a corresponding second plurality of areas of nanostructures on a substrate, thus creating a strong friction bond. In another illustrative embodiment, a plurality of nanostructures is disposed on a component, such as a microprocessor, which is then brought into contact with a substrate. Intermolecular forces result in an attraction between the molecules of the nanostructures and the molecules of the substrate, thus creating a bond between the nanostructures and the substrate.

2004010, Jun 10, 2004

Dec 9, 2002

10/314768

Nagesh Basavanhally - Skillman NJ, US
Mark Paczkowski - Andover NJ, US
Hong Tang - Belle Mead NJ, US
John Weld - Ledgewood NJ, US

G02B006/26

385/018000

An optical switch has an array of fibers, an optional lens, and a mirror with two-dimensional tilt adjustment. Light from the array passes through the lens, is reflected by the mirror, and passes again through the lens back towards the array. The input/output fibers are arranged in a two-dimensional pattern designed to avoid undesirable crosstalk between fibers. The pattern may include a plurality of fibers positioned around a central fiber in a circular arrangement. For a 1×8 or 8×1 switch, nine fibers are preferably positioned in a circle around the central fiber, thereby providing geometry that substantially avoids undesirable crosstalk between fibers in the array. In another implementation, the fiber array is implemented using a tapered ferrule housing a central fiber, surrounded by an intermediate layer of six fibers, surrounded by an outer layer of twelve fibers.

7327037, Feb 5, 2008

Apr 1, 2004

10/816527

Nagesh R Basavanhally - Skillman NJ, US
Raymond A Cirelli - Hillsborough NJ, US
Omar Daniel Lopez - Summit NJ, US

Lucent Technologies Inc. - Murray Hill NJ

H01L 23/52

257777

A method and apparatus for forming an electrically and/or thermally conducting interconnection is disclosed wherein a first surface and a second surface are contacted with each other via a plurality of nanostructures disposed on at least one of the surfaces. In one embodiment, a first plurality of areas of nanostructures is disposed on a component in an electronics package such as, illustratively, a microprocessor. The first plurality of areas is then brought into contact with a corresponding second plurality of areas of nanostructures on a substrate, thus creating a strong friction bond. In another illustrative embodiment, a plurality of nanostructures is disposed on a component, such as a microprocessor, which is then brought into contact with a substrate. Intermolecular forces result in an attraction between the molecules of the nanostructures and the molecules of the substrate, thus creating a bond between the nanostructures and the substrate.

8343807, Jan 1, 2013

Nov 17, 2008

12/291974

Vladimir Anatolyevich Aksyuk - Westfield NJ, US
Nagesh R Basavanhally - Skillman NJ, US
Avinoam Kornblit - Highland Park NJ, US
Warren Yiu-Cho Lai - Chatham Township NJ, US
Joseph Ashley Taylor - Springfield NJ, US
Robert Francis Fullowan - Berkeley Heights NJ, US

Alcatel Lucent - Paris

H01L 31/0224, H01L 23/535

438118, 438459, 438667, 257E21511, 257E21597, 257E23067, 257E23011

Apparatus including a chip substrate having a first chip surface facing away from a second chip surface; an array of microelectronic elements on the first chip surface; and an array of conductors each in communication with one of the microelectronic elements, the conductors passing through the chip substrate and fully spanning a distance between the first and second chip surfaces. Process including: providing an apparatus including a chip substrate having a first chip surface facing away from a second chip surface, an array of microelectronic elements being on the first chip surface, an array of conductors each being in communication with one of the microelectronic elements and partially spanning an average distance between the first and second chip surfaces; bonding a temporary support carrier onto the array of microelectronic elements; removing a portion of the chip substrate, thereby reducing the average distance between the first and second chip surfaces; and forming an under bump metallization pad at the second chip surface in electrical communication with a conductor.

7062132, Jun 13, 2006

Dec 23, 2003

10/743922

Nagesh R. Basavanhally - Skillman NJ, US
David A. Ramsey - Annandale NJ, US
Hong Tang - Belle Mead NJ, US

Lucent Technologies Inc. - Murray Hill NJ

G02B 6/26, G02B 6/42

385 52, 385 15, 385 24, 385 25

A coupler assembly for an optical backplane system having a backplane and two or more circuit packs connected to that backplane. Each circuit pack has an optical transceiver and the backplane has an optical pipe (e. g. , an array of waveguides) adapted to guide optical signals between the transceivers of different circuit packs. A coupler assembly is provided for each transceiver to couple light between that transceiver and the optical pipe. Advantageously, the coupler assembly has a movable optical element that can accommodate possible misalignment between the backplane and the circuit pack. In one embodiment, the movable optical element is an array of MEMS mirrors, each mirror adapted to direct light between an optical transmitter or receiver and the corresponding waveguide of the optical pipe. In another embodiment, the movable optical element is an array of flexible optical fibers, each coupled between an optical transmitter or receiver and the corresponding waveguide of the optical pipe and having an angled surface adapted to couple light between said fiber and waveguide.

7832462, Nov 16, 2010

Mar 31, 2008

12/080408

Nagesh R. Basavanhally - Skillman NJ, US
Marc Scott Hodes - Dublin, IE
Paul Robert Kolodner - Hoboken NJ, US
Avinoam Kornblit - Highland Park NJ, US
Thomas Nikita Krupenkin - Middleton WI, US
Wonsuck Lee - Basking Ridge NJ, US
Alan Michael Lyons - New Providence NJ, US
Todd Richard Salamon - Chatham NJ, US
Brijesh Vyas - Warren NJ, US

Alcatel-Lucent USA Inc. - Murray Hill NJ

F28D 15/00

16510426, 16510433, 361700

Device having first wick evaporator including first membrane and plurality of first thermally-conductive supports. First membrane has upper and lower surfaces. First membrane also has plurality of pores with upper pore ends at upper surface of first membrane and with lower pore ends at lower surface of first membrane. Each of first thermally-conductive supports has upper and lower support ends. Upper support ends of first thermally-conductive supports are in contact with first membrane. Each of first thermally-conductive supports has longitudinal axis extending between the upper and lower support ends, average cross-sectional area along axis, and membrane support cross-sectional area at upper support end, the membrane support cross-sectional area effectively being smaller than average cross-sectional area. First thermally-conductive supports are configured to conduct thermal energy from lower support ends of first thermally-conductive supports to first membrane. Process includes providing wick evaporator, providing liquid working fluid in contact with lower or upper surface of membrane, and causing liquid working fluid to be evaporated from liquid-vapor interface in membrane.

8639070, Jan 28, 2014

Nov 12, 2010

12/944939

David T. Neilson - Old Bridge NJ, US
Nagesh R. Basavanhally - Skillman NJ, US
Mark P. Earnshaw - Morristown NJ, US

Alcatel Lucent - Paris

G02B 6/28, G02B 6/12, G02B 6/26, G02B 6/32, G02B 6/10

385 24, 385 14, 385 16, 385 18, 385 25, 385 34, 385 47, 385129

An optical assembly for a wavelength-division-multiplexing (WDM) transmitter or receiver that lends itself to cost-effective production-line manufacturing. In one embodiment, the fiber optic assembly has a vernier-type arrayed waveguide grating (AWG) with five optical ports at one side and fourteen optical ports at another side. Ten of the fourteen ports are optically coupled to ten photo-detectors or lasers. A selected one of the five ports is optically coupled to an external optical fiber. The coupling optics and the mounting hardware for the AWG are designed to accommodate, with few relatively straightforward adjustments performed on the production line, any configuration of the AWG in which any consecutive ten of the fourteen ports are optically coupled to the ten photo-detectors or lasers.

2014007, Mar 13, 2014

Sep 11, 2012

13/609388

Noriaki Kaneda - Westfield NJ, US
Nagesh Basavanhally - Skillman NJ, US
Yves Baeyens - Stirling NJ, US

Alcatel-Lucent USA, Inc. - Murray Hill NJ

H01Q 1/38, H01L 21/98

343700MS, 438118, 257E21705

An apparatus includes a dielectric slab having first and opposing second major surfaces. A planar antenna element is located on the first major surface. A via formed through the dielectric slab is conductively connected to the antenna element. A plurality of solder bump pads is located on the second major surface and is configured to attach the dielectric slab to an integrated circuit.

2014006, Mar 6, 2014

Sep 5, 2012

13/604080

Nagesh Basavanhally - Skillman NJ, US

Alcatel-Lucent USA, Incorporated - Murray Hill NJ

H01L 21/28, H01L 23/48

257753, 438654, 257E21158, 257E2301

A method of manufacturing comprising providing a semiconductor layer having metal adhesion layer on a planar surface of the semiconductor layer and an alloy layer on the metal adhesion layer, the alloy layer comprising an alloy of gold and a non-gold metal. The method comprises removing a portion of the non-gold metal from the alloy layer to form a porous gold layer. The method comprises applying pressure between the porous gold layer and a metal layer to form a bond between the semiconductor layer and the metal layer.