Position:
Package Division Manager at Mini-Systems, Inc. - Electronic Package Division
Work:
Mini-Systems, Inc. - Electronic Package Division
since Dec 2002
-
Package Division Manager
Mini-Systems, Inc. - Thick Film Division
Dec 1997 - Oct 2002
-
Manufacturing Design Engineer
Elmwood Sensors, Inc. - Precision Division
Mar 1990 - Dec 1997
-
Senior Manufacturing Engineer
Moldex Corporation
- Putnam, CT Sep 1987 - Mar 1990
-
Manufacturing Engineer
Education:
University of Rhode Island 1987 - 1990
MSME, Heat Transfer and Mass Flow
University of Rhode Island 1981 - 1985
BS, Mechanical Engineering
Tong Hop University - Vietnam 1976 - 1978
BS, Chemistry
Interests:
3D Packaging Technology, High Frequency and High Power Packages.