MR. MING KAY CHEN, ARNP
Nursing in Bellevue, WA
License number
Washington RN00088730
Category
Nursing
Type
Registered Nurse
License number
Washington AP30003185
Category
Nursing
Type
Family
Address
Address
2
14350 SE EASTGATE WAY, Bellevue, WA 98007
112 N 83Rd St, Seattle, WA 98103
112 N 83Rd St, Seattle, WA 98103
Phone
(206) 296-4920
(206) 205-8960 (Fax)
(206) 783-6028
(206) 205-8960 (Fax)
(206) 783-6028
Professional information
Accounting Director At Kemper Development Co.
Position:
Accounting Director at Kemper Development Co.
Location:
Greater Seattle Area
Industry:
Real Estate
Work:
Kemper Development Co.
-
Accounting Director
Ming Chen - Issaquah, WA
Work:
WIG PROPERTIES
Property Accountant Ranstad - contract work with VITUS GROUP
Senior Accountant HINES INTEREST
Staff Accountant III KEMPER DEVELOPMENT COMPANY
Senior Accountant BENTALL CAPITAL
Senior Property Accountant
Property Accountant Ranstad - contract work with VITUS GROUP
Senior Accountant HINES INTEREST
Staff Accountant III KEMPER DEVELOPMENT COMPANY
Senior Accountant BENTALL CAPITAL
Senior Property Accountant
Education:
Gleim
CMA Review University of Phoenix - Bellevue, WA
MBA in Business Administration University of Washington - Seattle, WA
Bachelor of Arts in Accounting
CMA Review University of Phoenix - Bellevue, WA
MBA in Business Administration University of Washington - Seattle, WA
Bachelor of Arts in Accounting
Principal Engineer At Areva T&Amp;D
Position:
Principal engineer at AREVA T&D
Location:
Greater Seattle Area
Industry:
Electrical/Electronic Manufacturing
Work:
AREVA T&D
-
Principal engineer
Ming K Chen, Bellevue WA - ARNP
Specialties:
Nursing (Registered Nurse), Nursing (Nurse Practitioner)
Address:
14350 SE Eastgate Way, Bellevue 98007
(206) 296-4920 (Phone), (206) 205-8960 (Fax)
(206) 296-4920 (Phone), (206) 205-8960 (Fax)
Languages:
English
Radio Frequency (Rf) Transition Design For A Phased Array Antenna System Utilizing A Beam Forming Network
US Patent:
8154469, Apr 10, 2012
Filed:
Jun 22, 2007
Appl. No.:
11/767170
Inventors:
Chris D. McKinley - Seattle WA, US
Ming Chen - Bellevue WA, US
John B. O'Connell - Seattle WA, US
Ming Chen - Bellevue WA, US
John B. O'Connell - Seattle WA, US
Assignee:
The Boeing Company - Chicago IL
International Classification:
H01Q 1/50
US Classification:
343850, 343700 MS, 343702, 343905, 343906
Abstract:
In accordance with an embodiment, a radio frequency transition system includes a stripline trace section with openings in ground planes and forms a quarter wavelength resonator and an electromagnetic mechanism to couple the RF energy from the stripline trace section to a connector, wherein the RF signal energy is transferred from inside a beam forming network printed wiring board to an a back side of a phased array antenna system with minimal RF losses. An RF transition system is disclosed. The RF transition system comprises a stripline trace section with openings in ground planes and forms a quarter-wavelength resonator. The RF transition system further includes an electromagnetic mechanism to couple the RF energy from the stripline trace section to a connector. The RF signal energy is transferred from inside a beam forming network printed wiring board to an a back side of a phased array antenna system with minimal RF losses.
Phased Array Antenna System Utilizing A Beam Forming Network
US Patent:
7609210, Oct 27, 2009
Filed:
Jun 22, 2007
Appl. No.:
11/767129
Inventors:
Ming Chen - Bellevue WA, US
Robert L. Wightman - Seattle WA, US
Dan R. Miller - Seattle WA, US
Chris D. McKinley - Seattle WA, US
Robert L. Wightman - Seattle WA, US
Dan R. Miller - Seattle WA, US
Chris D. McKinley - Seattle WA, US
Assignee:
Boeing Company - Chicago IL
International Classification:
H01Q 1/38, H01Q 19/06
US Classification:
343700MS, 343754, 343853
Abstract:
In accordance with an embodiment, a phased array antenna system includes a printed wiring board formed in rhombic shape that accommodates requirements for low observability and a beam forming network located within the printed wiring board. The beam forming network is located over substantially the entire printed wiring board. The embodiment includes connectors located on the backside of the printed wiring board. The back side connectors allow the array architecture to expand to include more subarrays and therefore allowing for more beam forming elements in a full size array than conventional phased arrays.
Transmitting Power And Data
US Patent:
8421692, Apr 16, 2013
Filed:
Feb 25, 2009
Appl. No.:
12/392734
Inventors:
Matthew A. Stoneback - Federal Way WA, US
Ming Chen - Bellevue WA, US
David M. Anderson - Sammamish WA, US
Ming Chen - Bellevue WA, US
David M. Anderson - Sammamish WA, US
Assignee:
The Boeing Company - Chicaco IL
International Classification:
H01Q 1/28
US Classification:
343705, 343909
Abstract:
Apparatus, systems and methods to transmit power and data are provided. A particular apparatus to transmit power and data includes a transmission medium. The transmission medium includes at least one first frequency selective surface (FSS) layer, at least one second FSS layer, and a dielectric layer separating the at least one first FSS layer and the at least one second FSS layer. In a particular embodiment, the apparatus also includes a first coupler coupled to the transmission medium to send a signal along the transmission medium and a second coupler coupled to the transmission medium. The second coupler may receive signals via the transmission medium, receive power via the transmission medium to power devices coupled to the second coupler, process and send data via the transmission medium, or any combination thereof.
Transmitting Power And Data
US Patent:
2013010, May 2, 2013
Filed:
Dec 21, 2012
Appl. No.:
13/723875
Inventors:
The Boeing Company - Chicago IL, US
Ming Chen - Bellevue WA, US
David M. Anderson - Sammamish WA, US
Ming Chen - Bellevue WA, US
David M. Anderson - Sammamish WA, US
Assignee:
The Boeing Company - Chicago IL
International Classification:
H01P 5/16
US Classification:
333 27
Abstract:
Apparatus, systems and methods to transmit power and data are provided. A particular apparatus includes a transmission component. The transmission component includes at least one first frequency selective surface (FSS) layer, at least one second FSS layer, and a dielectric layer separating the at least one first FSS layer and the at least one second FSS layer. In a particular embodiment, the apparatus also includes a first coupler coupled to the dielectric layer to send a signal along the transmission component.
Phased Array Antenna Beam Tracking With Difference Patterns
US Patent:
7450068, Nov 11, 2008
Filed:
Nov 20, 2006
Appl. No.:
11/602015
Inventors:
Ming Chen - Bellevue WA, US
Mark A. Curry - Lynnwood WA, US
Kenneth G. Voyce - Bellevue WA, US
Mark A. Curry - Lynnwood WA, US
Kenneth G. Voyce - Bellevue WA, US
Assignee:
The Boeing Company - Chicago IL
International Classification:
G01S 5/02, G01S 13/00, G01S 13/08, G01S 3/16, H04B 7/00
US Classification:
342427, 342 78, 342 79, 342 90, 342133, 342139, 342140, 342383, 4552761
Abstract:
A system and method for using a phased array antenna to concurrently receive an RF signal transmitted by a remote transmitter, to determine the angular location of the remote transmitter using the transmitted signal, and to use that angular location to direct a transmit antenna to transmit information in the direction of the transmitter is disclosed.
Dual Beam Dual Selectable Polarization Antenna
US Patent:
7868830, Jan 11, 2011
Filed:
May 13, 2008
Appl. No.:
12/119865
Inventors:
Robert Tilman Worl - Maple Valley WA, US
Isaac Ron Bekker - Seattle WA, US
Dan R. Miller - Puyallup WA, US
Kenneth G. Voyce - Bellevue WA, US
Ming Chen - Bellevue WA, US
Harold J. Redd - Kent WA, US
Isaac Ron Bekker - Seattle WA, US
Dan R. Miller - Puyallup WA, US
Kenneth G. Voyce - Bellevue WA, US
Ming Chen - Bellevue WA, US
Harold J. Redd - Kent WA, US
Assignee:
The Boeing Company - Chicago IL
International Classification:
H01Q 1/38
US Classification:
343700MS, 343893, 343872
Abstract:
A dual beam dual-selectable-polarization phased array antenna comprises an aperture unit, a printed wiring board, radiating elements, chip units, a pressure plate, and a rear housing unit. The printed wiring board has sub assemblies bonded to each other with a bonding material providing both mechanical and electrical connection. The printed wiring board is connected to the aperture unit. The radiating elements are formed on the printed wiring board. The chip units are mounted on the printed wiring board. The chip units include circuits capable of controlling radio frequency signals radiated by the radiating elements to form dual beams with independently selectable polarization. The pressure plate is connected to the aperture unit. The aperture unit is connected to the rear housing unit such that the aperture unit covers the rear housing unit.