MICHAEL QUINN
Medical Practice in Allentown, PA
License number
Pennsylvania PRF000040
Category
Medicine
Type
Perfusionist
Address
Address
Allentown, PA 18106
Personal information
See more information about MICHAEL QUINN at radaris.comName
Address
Phone
468 Maple Springs Rd, Hollsopple, PA 15935
458 E College Ave APT 406, State College, PA 16801
4328 Lawndale St, Philadelphia, PA 19124
Professional information
Process For Fabricating A Power Hybrid Module
US Patent:
2004021, Oct 28, 2004
Filed:
Apr 8, 2003
Appl. No.:
10/408448
Inventors:
Patrick Carberry - Allentown PA, US
Lawrence Golick - Allentown PA, US
Juan Herbsommer - Berkeley Heights NJ, US
Osvaldo Lopez - Lebenon NJ, US
Michael Quinn - Allentown PA, US
Hugo Safar - Berkeley Heights NJ, US
Lawrence Golick - Allentown PA, US
Juan Herbsommer - Berkeley Heights NJ, US
Osvaldo Lopez - Lebenon NJ, US
Michael Quinn - Allentown PA, US
Hugo Safar - Berkeley Heights NJ, US
International Classification:
H01L023/34
US Classification:
257/717000
Abstract:
A process for fabricating a power hybrid module including placing at least one carrier assembly in at least one opening in at least one printed circuit board, mounting the at least one carrier assembly and the at least one printed circuit board on assembly tape, electrically connecting one of the at least one carrier assemblies and one of the at least one printed circuit boards, overmolding the at least one carrier assembly and the at least one printed circuit board and removing the assembly tape to produce a surface mount power hybrid module. A power hybrid module including at least one printed circuit board with at least one opening therein, at least one carrier assembly, positioned in the at least one opening such that said at least one carrier assembly may be surface mounted and electrically connected to the at least one printed circuit board, and an overmold over the at least one printed circuit board and the at least one carrier assembly.
Device Packages Having Stable Wirebonds
US Patent:
7314781, Jan 1, 2008
Filed:
Nov 5, 2003
Appl. No.:
10/702875
Inventors:
Brett J. Campbell - Hatfield PA, US
Patrick J. Carberry - Laury's Station PA, US
Jason P. Goodelle - Allentown PA, US
Michael Francis Quinn - Allentown PA, US
Patrick J. Carberry - Laury's Station PA, US
Jason P. Goodelle - Allentown PA, US
Michael Francis Quinn - Allentown PA, US
Assignee:
LSI Corporation - Milpitas CA
International Classification:
H01L 21/60
US Classification:
438111, 438123, 438466, 438617, 257E23025
Abstract:
A method of making a packaged electrical device comprises the steps of (a) connecting one end of a wire to a first point (e. g. , a first electrical node) in the package, and (b) connecting the other end of the wire to a second point (e. g. , a second electrical node) in the package, characterized by (c) causing energy from an external source to heat at least one predetermined segment of the wire to a temperature that is below its melting point (MP) but not below its recrystallization temperature (RCT), and (d) cooling the heated segment to a temperature below its RCT [e. g. , to room temperature (RT)], thereby to increase the stiffness modulus of the segment. In one embodiment, the external source is a laser whose optical output is absorbed by the segment. In another embodiment, the heated segment is rapidly cooled (i. e. , quenched) to RT.